Materials Processing - Science topic

"How do we understand special relativity?"

The Quantum FFF Model differences: What are the main differences of Q-FFFTheory with the standard model? 1, A Fermion repelling- and producing electric dark matter black hole. 2, An electric dark matter black hole splitting Big Bang with a 12x distant symmetric instant entangled raspberry multiverse result, each with copy Lyman Alpha forests. 3, Fermions are real propeller shaped rigid convertible strings with dual spin and also instant multiverse entanglement ( Charge Parity symmetric) . 4, The vacuum is a dense tetrahedral shaped lattice with dual oscillating massless Higgs particles ( dark energy). 5, All particles have consciousness by their instant entanglement relation between 12 copy universes, however, humans have about 500 m.sec retardation to veto an act. ( Benjamin Libet) It was Abdus Salam who proposed that quarks and leptons should have a sub-quantum level structure, and that they are compound hardrock particles with a specific non-zero sized form. Jean Paul Vigier postulated that quarks and leptons are "pushed around" by an energetic sea of vacuum particles. 6 David Bohm suggested in contrast with The "Copenhagen interpretation", that reality is not created by the eye of the human observer, and second: elementary particles should be "guided by a pilot wave". John Bell argued that the motion of mass related to the surrounding vacuum reference frame, should originate real "Lorentz-transformations", and also real relativistic measurable contraction. Richard Feynman postulated the idea of an all pervading energetic quantum vacuum. He rejected it, because it should originate resistance for every mass in motion, relative to the reference frame of the quantum vacuum. However, I postulate the strange and counter intuitive possibility, that this resistance for mass in motion, can be compensated, if we combine the ideas of Vigier, Bell, Bohm and Salam, and a new dual universal Bohmian "pilot wave", which is interpreted as the EPR correlation (or Big Bang entanglement) between individual elementary anti-mirror particles, living in dual universes.

Fred-Rick Schermer added a reply

Wolfgang Konle

That is incorrect, Wolfgang. You are not paying attention.

When there is an omelet, then we know that there was an egg. That is NOT a miracle. Is the egg still around? No, that is the entire point of what the omelet shows us.

The results tell us something about the origin. It is NOT a miracle that there was an origin. It is too bad that we cannot know more about the origin other than it producing the results, but the results do present us a clear storyline how the results came about.

I'd like you to go back to the basics of science and rethink the conclusion you came to.

The following question is truly the first step:

Both positions are good scientific positions to start out from. We have the omelet, and we want to understand how the omelet came about. We are not investigating where the egg came from or what the egg tells us. Only the omelet is doing the talking.

Know that I do not mind if you do not agree with the proposal. I have no problem there. Yet your declaring it is a miracle is not based in good science. I must urge you to find your scientific footing.

Wolfgang Konle added a reply

Fred-Rick Schermer "Here the quarks aligned themselves immediately into neutrons and protons."

According to everything we currently know, this would be a miracle, which drastically violates charge neutrality.

"That is incorrect, Wolfgang. You are not paying attention. When there is an omelet, then we know that there was an egg. That is NOT a miracle. Is the egg still around? No, that is the entire point of what the omelet shows us."

No, you are not paying attention. A process which just generates neutrons and protons violates charge parity. According to the number of generated protons an equal amount of electrons also must be generated.

Cosmin Visan added a reply

Santa Claus.

Fred-Rick Schermer added a reply

Wolfgang Konle

We do have the exact same amount of positively charged protons and negatively charged electrons.

There is no miracle. Yet the protons are indeed part of the energy that got changed during the Big Bang process, from being immaterial energy at first to becoming damaged energy: the quarks. The quarks are self-based energy, incapable of returning to their original format.

Meanwhile, the electrons are pulled from the very large remainder of (unchanged) energy; the large remainder was not damaged. The electrons are not self-based in outcome; they are proton-focused, neutralizing the positive charge of the protons. In effect, the protons manifest the electrons from the energized field. The electrons do not annihilate the charge because they cannot undo the damage of the quarks. They are there only to neutralize the charge and yet they cannot undo the charge at the subatomic level.

There are therefore two realities for matter:

Original (undamaged) energy, some say this could be as much as 96% of all energy there is in the universe.

Damaged energy, the quarks.

Matter is said by some to be about 4% of all energy there is. This includes then the electrons since they got pulled into the material realm, yet do not contribute anything close to what the quarks contribute in material energy.

--

There is no miracle here, Wolfgang. It is all about the mechanics of what went wrong during the materialization process.

Wolfgang Konle added a reply

Fred-Rick Schermer "Yet the protons are part of the energy that got changed during the Big Bang process, from being immaterial energy at first to becoming damaged energy: the quarks. The quarks are self-based energy, incapable of returning to their original format.

...

Original (undamaged) energy, some say this could be as much as 96% of all energy there is in the universe. Damaged energy, the quarks."

You are telling absurd stories without any foundation. This is unacceptable.

Fred-Rick Schermer added a reply

Wolfgang Konle

I am actually staying fully within the scientific realm, Wolfgang.

Let's start at the beginning once more.

A/ The material universe is either based on a single foundation, or

B/ The material universe is based on the lack of a single foundation.

That is a real good scientific question, and the data that we have can therefore be organized in two different manners, either via A or via B.

The Lambda-CDM model follows A.

The Big Whisper model, named for Penzias and Wilson who discovered the whisper of the materialization process, follows B.

The Lambda-CDM model is mechanically incomplete, question marks abound.

The Big Whisper model is mechanically complete. The question how matter could have come about is answered fully. It does require to accept that Energy is already a given.

Both A and B represent scientific approaches, both fully within the scientific realm.

I have tried this: mixed the powder with acetone before putting it into the pressing die of diameter = 13 mm. Added the damp powder into the die and pressed at 8 T and then waited for 30 minutes. I released the press in one step and took out the sample. The pellet is cracking. It has a circular crack like it is about to divide the pellet into two layers of powder but the crack is not continuous right round the pellet (it is only affecting half part of the pellet). The pellet is therefore forming sort of two layers, one big layer with almost half of it not affected and the other piece as a flake. 

Is there anything I can do to get a single solid pellet?

Where is the Jade due to the throwing out of a brick and a paving stone?

A brand new conception of preferable probability and its evaluation were created, the book was entitled "Probability - based multi - objective optimization for material selection", and published by Springer, which opens a new way for multi-objective orthogonal experimental design, uniform experimental design, respose surface design, and robust design, discretization treatment and sequential optimization, etc.

It aims to provide a rational approch without personal or other subjective coefficients, which is available at https://link.springer.com/book/9789811933509,

DOI: 10.1007/978-981-19-3351-6.

Best regards.

Yours

M. Zheng

In order to examine the micro-structure in cross-section of the Inconel alloy on Cast iron, I'm not able to find a suitable etchant which could give good image. There are various etchants for both the material, and not finding a common etchant. 

The suspension wire of our Shimadzu TGA-50 was disconnected. It was undamaged, so we anchored it back to the balance. However, during our next thermal analysis experiment, we experienced slight erratic increases and decreases in the temperature above 300 degrees Celsius. Any suggestions on how to remedy this issue? 

Ceramic cookware are all the latest craze in regards to safe cookware. However, they tend to lose their non stick properties within a year or so. From what I can understand, the nonstick property is derived from a surface layer glaze on the ceramic that smooths and fills micropores in the base layer metal or ceramic, and excessive heating and heating cycles cause the glaze to change. Is the general root cause of failure the failure of the glaze to adhere and remain rigid, failure of a primer, or just surface scratches?

Ceramic is also a poor conductor of heat, so has there been research on dispersing metal particles within the glaze or ceramic?  

Also, has anyone heard of research on nano-textured non stick coatings? 

How can I run an ONIOM calculation with solvation? I have tried scrf=(smd,solvent=warter, oniompcm=x) and scrf=(check, oniompcm=x) and neither worked

Al A356

Slurries generally consists of some heavier particles which should remain suspended in solution for best coating results. Kindly suggest best way to maintain viscosity of alumina slurries. Thank you:)

I have 70 percent cryo-rolled 2219 samples but i am not able to get good scan from EBSD,what should I do?

1. Material Processes: Welding Research.

2. Materials: Composites, Plastics, Metals, exotics, etc.

3. Following the welding process, certain alloys (e.g., aluminum) lose their mechanical properties, and therefore:

a. How to weld in these situations?

b. How can the strength be returned to the basic materials (hardening efforts, cold processing, etc.)?

4. Is it possible to give an electrical interpretation to the vibration of the molecules, which is created as a result of the thermal energy and causes the decomposition of the intermolecular forces?

P. S. Assuming that the electrical charge between the ions and the molecules, and between themselves (dipoles, ion bonds, H- bonding, van der Waals forces: Keesom, Debye and London) cause to electrical bond (force).

Recently I tested a novel superhydrophobic coating by means of potential curves. What is odd is that I found a significative change in Ecorr (from 800 to 500 mv in comparison with the bare metal...) but instead of a lowering of Icorr I found an increase in ICorr (10-8 bare metal to 10-7 protected). The coating is conductive (it's C based). I have no idea how to interpret the results. Any ideas?

Hello scientific community, please I would like some information on the characterization of adsorbent materials by the Boehm method. I would be grateful if you could correct the procedure for me.

To my knowledge, the Boehm method consists of mixing (for 24 hours) a mass of adsorbent of the order of 0.15 g in a closed bottle with 50 ml of a 0.01 mol / l aqueous solution of reagent. The reagent could be either NaOH to neutralize the phenolic groups, or Na2CO3 to neutralize the lactones, or NaHCO3 to neutralize the carboxyl groups, or HCl to determine the content of basic groups. Then, the suspensions are filtered through membrane filters at 0.45 μm and the filtrates are titrated (adsorbent-NaOH, adsorbent-Na2CO3, adsorbent-NaHCO3) with HCl (0.01 M) and the filtrate (adsorbent-HCl) is titrated with NaOH (0.01 M).

The question is how to quantify acidic and basic groups? How to quantify carboxylic groups, lactonic groups, phenolic groups, carbonyl groups, total oxygenated groups, total basic groups? What units are the results expressed by?

Thank you infinitely for all your efforts. I confide in your availability and friendliness. In the end, please accept my heartfelt Thanks and sincere salutations.

Yours sincerely

PhD Student Researcher

Laboratory of Materials, Processes, Catalysis, and Environment, University Sidi Mohamed Ben Abdellah, Higher School of Technology, Post office Box 2427 Fez, Morocco

In fiber metal laminates (FML), adhesion between the fiber and the metal is an important problem.

How this problem can be reduced?

Dear Colleagues,

I want to design a furnace of 1600⁰C for material processing in my laboratory.

Please suggest me which is the best insulating material for this ?

Thanks and Regards

N Das

It should be either decrease or increase for nth time during heat supply. Is there any possibility of irregular temperature sequences as shown in figure. In that picture the highest temperature lies around 168 °C, but that values keep decreasing and increasing. What causes it ?

The method of heat supply is two- probe electrode method. Probe material is copper. The values were recorded using a thermal camera. Time and current value is constant.

I am heating my sample (NaNiCoMnO2) at 900 deg. C in presence of air for 12 hours to form metal oxide. After heating to 900 deg. C the quartz tube becomes whitish (See the attached picture) . Tried cleaning with HCL acid doesn't go off completely. After heating 4/5 more samples the Quartz tube breaks. I broke few of them. Kindly let me know if this is common practice with Quart tube while preparing metal oxide ?  Please suggest me a good brand of tube or any suggestions regarding my issue. 

- I think the material is forming some layer. Kindly check the attached pic. 

Thank you !!

Is there anyone who knows anything about the difficulties of this Process? And why these difficulties occur?

For example:

why sponge iron stick to SiC Saggar sometime?

why the product's carbon level is low?

why products get colored?

Do the colors blue and purple indicate the presence of a specific compound?

...

In powder metallurgy stearates are added while mixing of powders in order to facilitate compaction. Further these stearates are removed during dewaxing.

If zinc stearate is added as a lubricant during mixing of iron powder or other metallic based composites, does zinc stearate evaporates during sintering or remains there in the compacts.

I found D. Mukherji et al. paper  on nanocrystalline Ni3Al-type superalloys. I am interested in making measurements of strength and hardness of these alloys at high pressures. For this purpose I need these alloys of various sizes.

Please help me to have these for my measurements.

How Machine Learning can be helpful to developing production of new materials?

In my opinion it is so useful in materials engineering.

During synthesis I found that when APS is added to a solution of Ani + HCl, even small amount of APS is sufficient to form the green color to solution. Of course the rate at which PANI is formed is different and increases with an increase in APS. Fresh HCl and Dist. Aniline were used. To what extent does the chemistry change and what are the possibilities that the other forms of PANI are forming?

Doing Hot isostatic pressing (HIP) after SLM is often considered as a best way to reduce the porosity and anisotropy. But in the most of the research papers, tests has been carried out on samples of cubic/ cuboid shape. Are there any papers available on studies HIP carried out on some complex AM components (one having internal channels , with thin sections etc.) ? Will this process have any significant effect in the dimension and shape?

Any leads will be helpful.

There are some analytical programs and numerical modeling software, including COMSOL, 3DSIM, ABAQUS, MARC, ANSYS (using stress analyses), and many other 3D or finite element based methods, which have already been used to find a relation between the parameters of AM processes (e.g. hatch distance, scan speed, and device power) and the properties of final products. It seems that previous researchers could already partially simulate some characteristics of manufactured products by the help of design of experiments/DOE methods (e.g. TAGUCHI) as well as microstructural studies (considering droplet geometry, phases characteristics, grain size, defects, etc.), thermal evaluations (CTE, heat capacity, conductivity, molten pool temperature distribution, etc.), or stress analyses. However, there is still no comprehensive method to precisely evaluate the influence of AM parameters and also the magnitude of their impact on the mechanical properties of the products.

Please let me know what method you think is the most complete, practical, and reliable approach which can best simulate the final properties of the additively-manufactured products using the process parameters.

Let's say I have a material with a stable phase A that transitions to another stable phase B at temperature T. If the material also has a metastable phase A', I know that if I cool B fast enough I would get:

B -> A'

and if I cool very slowly I'd get

B-> A.

If I were to look at the interface between B and the new phase and somehow extract all possible information (energy/mass transfer, etc), what signal would indicate to me that I would expect A' (metastable) to form over A?

Example :I am using GeSeTe and GeSbTe material, the ratio is

(19:1; ball:material) I am unable to to reduce the size

In Terms of Process, Parameters and Application.

Im currently doing flow drilling simulation and according to what I have read, there is no loss in material in this process since it push the material down with high temperature generated from the friction between the tool and the workpiece. AFAIK it is not possible because the element deletion option need to be enabled to make the tool be able to drill through the workpiece, otherwise the tool will be stuck trying to drill through the material and the program return with the error later. Im not sure which approch is the correct way to simulate the process.

Injection molding offers high quality and production rate of many geometrically complex shapes. One of the drawbacks of this method is the relatively higher cost of the material compared to the similar material produced through compression molding. There are also limitations regarding the choice of high-end injection molded material.

BMC (Bulk Moulding Compound) materials may be used in injection and/or compression molding methods. However, there are many BMC materials from well-known suppliers which are not tested for injection molding purposes. What are the main characteristics that give a material advantages in injection molding method?

Hello, in WC-Ni hardafing coating using the flame thermal spray process. Without using XRD analysis, which method can be used to identifie the decraburization of the WC particles? and the product of this phenoman is always the formation of W2C eutecic phase?

Also, how can I stop, or inhibate this decaburization of the WC particles,

Thank you.

I wants to relate MRR and erosion rate

How do we make Tungsten carbide cutting tool inserts? By powder injection molding or by mechanical pressing and sintering?

Any information, experience you can provide would be much appreciated. Thanks

We are trying to manufacture fasteners made of A286 steel. The fasteners were forged and solid solution treated at 900^oC for 2.5hours followed by 680, 720, or 740^oC aging for 16hours, which is well-known heat-treatment process for gamma' precipitation of A286. After then, hardness in the range of 30-32HRC was obtained.

This result is pretty much unsatisfactory to us because we need to make A286 fasteners with 34HRC or above. I heard that maximum hardness of A286 would be around 35-36HRC but our heat-treatment couldn't lead to the value.

Can anybody suggest any heat-treatment process to improve hardness of A286 steel? Unfortunately, we cannot conduct cold rolling more after solid solution treatment due to client's request. For your information, grain size of our materials is around 12-13 micro meter.

Any assistance would be greatly appreciated.

 

Thank you,

JH Kim

Can anyone help me to make the user subroutine UMATHT used in ABAQUS simulation for lithiation process in lithium ion battery (LIB)? I am working on anode part of LIB and need to run an FEM simulation. However, I am not aware of the programming part of this subroutine. I would really appreciate comments from people who know about it.

How we can increase the respose and recovery time of a Humidity Sensors based on ZnO?

What should be the core material and the process for making hollow spheres?

I am a research scholar interested in HEA.

I am in need of HEA materials.

Can You provide me some materials Sir.

Thanking You.

Regards

J.Maya

Research Scholar

Advanced Materials Processing Lab

National Institute of Technology(NIT)

Tiruchirappalli620015

Tamil Nadu

India

The area of manufacturing that I interested to know including metal or material processing and automotive industry. Thanks

Can anyone explain how to simulate additive manufacturing metal process in ANSYS or ABAQUS?

Can anyone share/email a research article on the effect of gold additions to Fe based bulk metallic glasses (BMGs).

Thanks

I have been trying to prepare Ketjen Black-Sulfur composite by using SBR:CMC binder for a while. But, when I coat aluminum foil with this slurry, the coating always cracks during the drying procedure. Could you give me some advice to improve this?

The grain size of the as deposited film was higher when compared to lower temperature annealed films and found to increase on 350C annealing. Material is copper based alloy..

i have milled Aluminium powder with 15%Alumina and i forgot to add stearic acid!!! so after 6 hours milling, a thick layer formed around media and in jar, I have tried 5 hours milling with stearic acid to remove that, but didn't work!!!

We are using Silver coated Hollow Glass spheres having a size of 10 microns. Since it is very expensive and we require a good amount of seeding, we are looking into the ways for making the particles in our laboratory itself. Can anyone suggest any reference which could be helpful?

Thanks in advance.

[*Edit - see my post below, as I think I have a solution to this problem]

Dear researchers,

I am trying to develop a dry etch process for a single-crystal SiC chip to remove the top few hundred nanometres, leaving a smooth surface.

So far I have only been able to produce a rough surface, which also shows some strange line patterns on it (I’ll attach an image). I wonder if anyone had any insight as to how I could adjust my recipe to get a smooth etch process and also why I see this strange line patterns? Perhaps you could also suggest a better cleaning process for a multi-user, multi-process RIE system?

My guesses at potential problems are:

- Pre-chamber cleaning process is not sufficient

- Subsurface damage from the wafer polishing is being revealed. However, the polishing company specs the surface roughness to be better than 1 Angstrom RMS.

- Sputtering of the glass carrier wafer causing micromasking of the SiC - unlikely as this hasn’t been a problem with other etch processes and the process is relatively low power.

Etch recipe:

SF6 (30 sccm), ICP power = 50 W, RF plate power = 50 W (44 V measured), chamber set pressure = 15 mTorr, process time = 30 minutes.

I opted for a low power SF6 recipe with very little plate bias, as I had reasonable results with this for etching diamond for 10’s of um. Chip sits on large glass carrier wafer during the etch.

Equipment details:

RIE/ICP system - Oxford Plasmalab System 100. This system is used by a lot of people for a many different materials and processes and is has several different gases attached (not just SF6). I performed our standard cleaning process before the SiC chip was inserted - SF6 (20 sccm)/O2 (10 sccm), ICP power = 220 W, RF plate power = 50 W (6 V measured), chamber set pressure = 70 mTorr, process time = 60 minutes. The glass carrier wafer was in the chamber during the cleaning process.

SiC chip details:

Single crystal. Both sides polished to a RMS surface roughness better than 1 Angstrom. Polytype: 4H-4°.

Chip dimensions: a few mm^2, 100 um thick.

Any advice appreciated. Thanks in advance!

Please tell me how I can clean the surface layer of the turbine blade. The photo is attached. The chemical composition of the alloy:

Fe up to 2, C 0.14 — 0.2, Si up to 0.4, Mn up to 0.4, Ni 53.8 — 63.46, S up to 0.015, P up to 0.015, Cr 8.5 — 10.5, Ce up to 0.02, Mo 2.7 — 3.4, W 1 — 1.8, V 0.5 — 1, Co 12 — 15, Nb 0.5 — 1, Ti 4.2 — 4.7, Al 5 — 5.7, Zr up to 0.02, B up to 0.015, Pb up to 0.001, Bi up to 0.0005.

 I am interested in non abrasive treatment technologies and also in repairing technologies.

I am working on a project involving VAWT blades (about 20-30 cm long with 5-6 cm of chord length) manufacturing and I am looking for help in regards to:

1. Commonly adopted materials and manufacturing processes;

2. Very approx costs of such processes (at least orders of magnitude).

My interest lies in the blade manufacturing phase alone.

Any reference explaining and illustrating those points is very welcomed!

Thanks in advance.

E.g.: glass fiber+epoxy composites and vacuum bag processing

Process description? Costs involved?

Hi,

I'm trying to carbon coat microparticles containing certain ratios of germanium and selenium. To do so, I'm coating the particles in polymer, and carbonizing at 600C to reduce the polymer into carbon. However, when I'm doing so, I notice that my selenium content goes to basically nothing. according to the phase diagram, the ratio of Ge and Se I'm mixing together should have a melting point of around 860C. The melting point and boiling point of Se are 221C and 685C. I can only assume that the reason why my Se is disappearing from the alloy is because of sublimation. I'm wondering if others agree that this is the case, and if so, potentially recommend a way to mitigate it

another possibility is the selenium is getting reduced via carbothermic reduction. as the polymer coating gets reduced, it will reduce oxides on the particles. The same might occur on selenium. the byproduct would be CSe2, which I don't think is a very thermodynamically favored process.. so I don't know..

H2 has etchant effect. The etchant ability of H2 help to remove of defected site and edges in graphene structure. If we increase H2 flow rate over it's optimum amount, what would be happen????

suppose we take aluminium, we fabricate aluminium metal matrix composites by any process by adding any ceramic material like SiC, Al2O3, etc.

I couldn't find any article regarding the metal surface condition for best result of laser welding ! 

Which type of contamination is OK/ bad for laser welding ? Is oil material affect bad the laser welding process if it is exist on the metal surface ? 

Any paper/answers regarding this issue will be very helpful ... thank you very much for your support 

By using the energy in the process

Hello Fellows .. 

I am working on a plastic pallet (not pellet) and my intention is to make it flame retardant. For this purpose I am incorporating Magnesium Hydroxide. 

Can someone guide me the important aspect/properties I must look for in the TDS provided by supplier??

During MCC-1; is it required to use different sample for 28 days or can we take microliter sample and replace with fresh deionised water

Etching process.

how to eliminate dark spots in the microstructure.I etched with glyceregia and acetic acid mixed with HCL and nitric acid.

I understand the importance of a chemically clean, oxide-free surface to produce a high-quality anodizing oxide film. My understanding about electropolishing is that it unavoidably produces a thin layer of aluminum oxide on the aluminum surface. So I don't understand why electropolishing is a common treatment before anodizing although it doesn't clean up the oxide like the mechanical polishing does. Thank you for any insight on this.

My synthesis was of Shell and Core arrangement. Shell is CaCO₃ and Core is Heptadecane. Temperature range was from 0 to to 50°C at rate of 5°C/min. For pure Heptadecae the peaks were obtained 12°C and 25°C while heating and 5°C and 18°C while cooling.

In Plasma Electrolytic Oxidation reaction arcing happens, when applied voltage exceeds breakdown voltage, which implies dielectric breakdown, this is defined as arc regime. Again after some time of reaction voltage reduces below breakdown voltage and no visible arcing happens this time, therefore this time of reaction defined as the soft regime.

This arc and the soft regime we can observe and can also drive using the value of voltage according to time. But, can we predict these regimes by making some mathematical calculations?

Thank you.

Assuming that it is a high temperature SOFC operating above 800C temperature,

1. What are the parameters (constraints) for this optimizations problem (What is the objective of this project)?

2. Since the title says SOFC, are you trying to optimize microstructures of anode, cathode and electrolyte or only one of them?

I think you must have planned design of expts in a specific design space. Have you also considered the effect of layer dimensions, electrode sintering process parameters like temperature profiles, shrinkage characteristics etc as well in your study? Any cell life studies planned for this optimization?

I wish you success in reaching your research objectives and very interested in new findings based on your research.

Best Regards,

Prasad

I've found some standard drawings for I-shaped sections, but nothing for cross columns.

Materials engineering and Materials scientific

It's about fabrication of pressure sensor.

Materials engineering and Materials scientific

I am asking about Al-ZnO composites related to Mechanical point of view.

If any paper publish on Al-ZnO fabricated through casting process in any journal,

pls send link/title.

Hi Dears

my project is microstructure aluminide coating investigate with reduce the size of the aluminum particles in pack cementation. I use of Optical Microscope for microstructure investigate. What solution would I use? Etching Time ?(substrate is Nickel superalloy)

i need some article or book a bout simulation of residual stress with Abaqus or sysweld software in nickel base supperalloy 939.

does anyone have information about this topics?

my project is 'Residual stresses and HAZ simulation in welding of Nickel-base supperalloy (inconel 939) considering phase transformations'

Can I put ice cubes into Ultrasonic bath while it was running. My purpose here is to cool down the temperature of the bath. Thank you. 

It is very important that the performance of weld metal should be same as SC NiFe-1 & 2 electrodes. 

Anti-Sinking Composite Materials for Ships.

In friction stir welding high heat input results in grain growth for aluminium.Grain growth is also higher for slower cooling rate in aluminium since time for growth will be more as a general saying.Than how cooling rate and peak temperature are related .Is it possible that higher peak temperature will results in slower cooling or lower cooling rate (for natural condition where no cooling arrangement has done other than normal air cooling) thus resulting in grain growth .

what is the best conductive material for induction heating susceptor at 1200 °C? which should work in both inert and oxidizing atm.

why a thin blade of iron whose density is greater than water float it the surface of water

i need some information a bout inconel 939 (nickel base supper alloy) included it's phisycal properties, yield strength, uts and its phase in different temperature.

please share with me this information.

Tnx

i am a research scholar working in process metallurgy area, i just want to know why Cu is used for tip of the lance in LD converter? why not any other material

who can help me about "Incoloy 907" its (Fe-Ni-Co-Nb-Ti) superalloy. i need some information about: product approach, deformation, heat treatment and microstructrue. please guide me.

How to differentiate between phase separation induced crystallization and spinodal decomposition and techniques required to establish them?

The valves are made up of Stainless Steel and the nanocoatings will be deposited on the stainless steel. 

Part - Al-aloy A334 (Si9Cu3-T8), Hardness - 90HB

Milling cutter - Mapal, with diameter 200mm

Stock removal - 5mm

Surface requirements - wt=max10micron, Ra=max0.8micron