Yuanhang Zhang's research while affiliated with Dalian University of Technology and other places
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Publications (10)
In order to fabricate copper coatings with excellent brightness, a cationic additive was screened by applying the electrochemical method and the theoretical calculation method. The adsorption-coordination coupling inhibition mechanism was proposed to illustrate the influence of the additive methylene blue (MB). The electrochemical behavior of coppe...
Finding proper additive to achieve copper superconformal electrodeposition is significantly important. Brilliant Green exhibits excellent suppressing ability to the copper electrodeposition according to electrochemical analysis. Meanwhile, 100 mg/L was selected as the optimum value based on the convection-dependent adsorption behavior analysis of B...
In order to realize high-quality through-hole (TH) interconnection with high aspect ratio, the mechanism of reverse pulse on TH electrodeposition process was systematically studied. In this paper, the mechanism of sodium thiazolinyl dithio propane sulfonate (SH110) was studied by electrochemical methods and molecular dynamics (MD) simulation. Under...
Uniform electrodeposition of through-hole (TH) with a high aspect ratio is the key to the reliability of printed circuit board (PCB) interconnection. Inhibitors produce stronger inhibition at high potentials during TH electrodeposition and thus reduce the difference in electrodeposition rates between inside and outside the TH. In this paper, the el...
The electrodeposition of Mo or Ni, a traditional and mature technique, is of vital importance in industrial applications owing to the extraordinary mechanical properties of these elements when used as assisted coatings. The exploration of green electrodeposition technology has attracted much attention, especially with ionic liquids (ILs) emerging a...
![SPS conversion on Cu surface during electrodeposition [10]](publication/354364784/figure/fig2/AS:1064544348676128@1630818559481/SPS-conversion-on-Cu-surface-during-electrodeposition-10_Q320.jpg)
![Mechanism of acceleration and migration of Cu²⁺ by MPS [12]](publication/354364784/figure/fig3/AS:1064544348692505@1630818559567/Mechanism-of-acceleration-and-migration-of-Cu-by-MPS-12_Q320.jpg)
![Cathodic reaction of JGB [22]](publication/354364784/figure/fig4/AS:1064544348696607@1630818559624/Cathodic-reaction-of-JGB-22_Q320.jpg)
![Periodic pulse reverse waveform of plating TH [30]](publication/354364784/figure/fig5/AS:1064544348680217@1630818559672/Periodic-pulse-reverse-waveform-of-plating-TH-30_Q320.jpg)
With the gradual development of high density and high integration of printed circuit board (PCB), the electroplating technology of PCB has been widely paid attention by researchers and enterprises, among which the through-hole (TH) electroplating of PCB is the key to realize the multi-layer interconnection. Many researches improve the electroplatin...
The comparison of macroscopic appearance and microscopic morphology of gold electrodeposit determined PHEN as the main brightener for its effective influence on refining the grains, resulting in a golden bright and shiny deposit. Improving the flatness of deposit when used together with PHEN, PDDA was the auxiliary brightener, thereby obtaining thi...
Citations
... The energy difference (ΔE) between the HOMO and LUMO can serve as an indicator to assess the adsorption capability of additives [33]. A lower ΔE value indicates faster electron transfer and stronger adsorption capacity. ...
... Levelers are used to obtain smooth coatings since they locally decrease the copper electrodeposition rate on the surface protrusions and promote its growth in hollows, as a result of which the surface roughness of the copper deposit decreases. Nitrogen-containing heterocyclic and high-molecular compounds are among the most common levelers [28][29][30][31][32]. ...
... Nevertheless, it is timeconsuming and requires high costs, which limits the application of these advanced analysis methods. The theoretical calculation, an emerging method, is widely applied in the field of electroplating to study the interaction between additive and metal ions and the adsorption ability on the metal substrate due to its convenience and low cost, which can help to gain an insight into the special groups in molecular structure to provide support for the future design of additive molecules [41,42]. ...
... The morphology and film properties of copper deposits highly depend on the types and concentrations of additives [33], but their collective effect on the electroplating process is also important. Along with the abovementioned joint action of chloride ions with inhibitor or accelerator molecules, it is necessary to note possible synergistic [6,31,32,[34][35][36] and antagonistic [37] effects of additives of various types. The synergism of the additives enables a bright, dense, and smooth copper coating to be achieved. ...
... The energy dispersive X-ray spectrum (EDS), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS) are used to identify the structure and composition of the materials [118][119][120]. The electrochemical behavior of the material can be obtained and analyzed by several parameters (i.e., cyclic voltammetry, electrochemical impedance spectroscopy, chronopotentiometry, and potentiodynamic polarization study) [118,121,122]. ...
... However, traditional experimental methods have inherent limitations, including blindness, workload, time, and resource waste. Nowadays, quantum chemistry and molecular dynamic simulations are widely used for calculating and simulating chemical systems as a technique to understand and predict behaviors at the molecular level [33][34][35][36][37]. Combining computational chemistry predictions with experimental investigation is a highly efficient methodology for accelerating the investigation of CO 2 RR. ...
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... [23][24][25][26] Organic polymers such as polyethylene glycol (PEG), polypropylene glycol (PPG), and polyvinylpyrrolidone (PVP) can physically block the movement of metal ions onto the surface, thus acting as a suppressor. [27][28][29][30][31] Kim et al. reported the effect of halide ions during metal electrodeposition. Halide ions form a strong suppression layer with a suppressor during metal electrodeposition. ...
... Consequently, the industrial application of these systems is limited. To address these limitations, research efforts have predominantly focused on screening new environmentally friendly ligands and additives, investigating the mechanism of Au ECD, and studying the roles of plating solution components and additives [10,11]. However, there have been fewer reports on the integration of other energy fields into cyanide-free electroplating processes to optimize them. ...
