Ming Yu Jia's research while affiliated with Beijing City University and other places

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Publications (2)

Fracture of the Leads of Integrated Circuits with TO Package
Article
  • Apr 2014
The Kovar alloy leads broke from two integrated circuits (ICs) with TO (Tin Outline) package. Through the metallurgical microstructure analysis, energy dispersive spectrometer (EDS) analysis and fractography analysis, the failure mode of the leads was found to be stress-corrosion-cracking. After checking the whole plating process, it was found that...
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Manufacturing Industry in China Informatization Development Analysis Based on the Internet of Things
Article
  • May 2013
In order to speed up the integration of industrialization and informatization in China, to promote the transformation and upgrading of enterprises. This article introduces the project of manufacturing informatization based on internet of things (IOT), analyzes the development of IOT technology, expounds the application of IOT in informatization dev...
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