M. G. Lagally's research while affiliated with University of Wisconsin–Madison and other places

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Publications (677)


Fabrication of the end‐tetered metal ribbons (compliant substrates).[⁷] a) A Ge sacrificial layer is deposited on a bulk‐Si substrate. b) An inverted‐V‐shape trilayer metal (30 nm Cr/ 300 nm Au/ 5 nm Cr from top to bottom) strip connected to a frame is fabricated on the Ge sacrificial layer. Formation of c) a non‐helical and d) a helical ribbon after selectively removing the Ge sacrificial layer. Scanning electron micrographs showing the formation of e) a non‐helical and f) a helical ribbon after etching of the sacrificial layer using XeF2 etching. Helical ribbons occur ≈40% of the time. The lowest layer in the trilayer stack (5 nm Cr) nominally becomes the outer layer of the coiled ribbons. However, see the text for more details.
SEMs showing the morphology of an Au layer electrodeposited on a Cr/Au ribbon; a) Outer ribbon surface (Au), b) inner ribbon surface (Cr), and c) surface of a ribbon edge (Cr/Au). On the outer ribbon surface, the morphology is continuous and reasonably smooth. On the inner (Cr terminated) surface the Au deposits only at widely scattered pinholes in the Cr layer. On the edges, where Cr and Au are both exposed, the deposition is again heavy and continuous. The scale bar is 500 nm in all cases.
Structure of end‐tethered Cr/Au/Cr ribbons before and after Au electrodeposition. a,c) SEM images of released non‐helical ribbons after XeF2 etching of the Ge sacrificial layer. b,d) SEM images of the double‐chirality helices obtained by reconfiguration of the corresponding non‐helical ribbons a,c) during electroplating.
Tailoring the dimensions of helices by electrodeposition. a,c) Helices before and b,d) helices after electrodeposition. b) The diameter of the helix shown in a) increases after electrodeposition to sufficient thickness. d) The diameter of the helix shown in c) decreases if the electrodeposited Au thickness is low. e) Measured diameters of the helices before and after electroplating vs electroplated‐Au thickness. The graph shows two regions: at low deposited thicknesses the helix diameter decreases, while at greater thicknesses the diameter increases.
a) Metal heterostructure with thickness discretized into N sublayers with smaller steps than the individual layer thicknesses. The cartesian coordinate system is shown in red. The coordinate axes follow the ribbon as it is released and bends out of the initial x–z plane.

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Formation and Shape Changing of Conductive Helical Ribbons via Deposition of Highly Stressed Films on Mechanically Responsive Substrates
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December 2023

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39 Reads

Advanced Functional Materials

Advanced Functional Materials

Anjali Chaudhary

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Divya J. Prakash

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RB Jacobson

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This work demonstrates that the electrodeposition of highly stressed films on compliant ribbons is a robust process to obtain helical structures with excellent mechanical stability and potentially high thermal and electrical conductance. Electrodeposition on end‐tethered ribbons alters their axial and bending stiffness while imparting mechanical stress to drive the formation of a helix with a microscale diameter and pitch in a controlled and scalable manner. The process generates helices with diameters and pitches between 80 and 200 µm and lengths as large as several millimeters. The approach is amenable to parallel processing a large number of 3D structures on any substrate, including large‐area semiconductor wafers. This phenomenon is explained in terms of the change of stress gradients as material is added. Applications of the fabricatd helices include antennas, metamaterials, and slow‐wave structures in frequency ranges not previously attainable.

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Electroplating on Unconventional Ultra-Compliant Substrates for Travelling Wave Tube Amplifiers

August 2023

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19 Reads

ECS Meeting Abstracts

We report gold electroplating on ultra-compliant substrates comprising helical slow wave structures (SWSs) for traveling wave tube amplifiers (TWTAs) [1]. The novel ultra-compliant substrates are composed of edge-tethered tri-layer metal ribbons with a helical geometry of microscale diameter. After electroplating with gold, we obtain overall thicknesses of a few um. We discuss different controllable electroplating conditions that influence thickness, uniformity, roughness, and related properties of deposited gold films on helical ribbons. In addition to increasing conductance of the electroplated helical ribbons, electroplating stabilizes the helix at its equilibrium diameter, with the pitch predicted by Prakash et al .[1]. Our method of fabrication of ultra-compliant helical ribbons starts with defining strips of width 5 µm to 10 µm by optical lithography, metal evaporation, and lift-off, deposited on Si substrates coated with a sacrificial layer of Ge or GeOx,. We use Cr/Au/Cr tri-layers to create an inherent stress gradient that causes the strip to self-assemble into a helix, after etching with XeF 2 for selective removal of a sacrificial layer. Diameter and pitch of the released helices are controlled by varying the thickness, the elastic modulus, the residual stress, and the in-plane geometry of the deposited tri-layer metal strips. The gold electroplating process uses a sulphate-based gold solution in a two-electrode electrochemical setup with the helix as the cathode and a platinized mesh as the anode [2]. We deposit gold to a thickness of a few um, using a pulsed current source with variable parameters. Direct current can also be used with smaller deposition times. Our results demonstrate the application of electroplating to unconventional ultra-compliant helix of nanoscale dimensions. Reference [1] Divya J. Prakash,., Matthew M. Dwyer, Marcos Martinez Argudo, Mengistie L. Debasu, Hassan Dibaji, Max G. Lagally, Daniel W. van der Weide, and Francesca Cavallo. 2020. “Self-Winding Helices as Slow-Wave Structures for Sub-Millimeter Traveling-Wave Tubes.” ACS Nano, 2021, 15, 1229-1239. doi:10.1021/acsnano.0c08296. [2] Max G. Lagally, Anjali Chaudhary, Daniel van der Weide, Divya J. Prakash, and Francesca Cavallo, Improved Self-assembly of Helices via Electrodeposition on Freestanding Nanoribbons for TWT Application, provisional US patent application (P220249US01) Work supported by U.S. AFOSR-Award No FA9550-22-1-0086.


Figure 1. (a) An optical image of a four-probe heating wire fabricated across an AlO x -encapsulated hBN flake that has been exfoliated from a bulk crystal and mechanically transferred to a SiO 2 /Si substrate. (b) A cross-sectional schematic diagram of a reference heating wire on the AlO x covered SiO 2 substrate and a second wire on a hBN sample. The encapsulating AlO x layer and underlying hBN are etched into a mesa as shown using BCl 3 Ar and SF 6 plasma etches, respectively. During a measurement, the heat from the wire flows cross-plane through the hBN and dissipates into the substrate. (c) The measured cross-plane thermal conductivity of a 585 nm thick hBN flake as a function of temperature. The cross-plane thermal conductivity of bulk hBN crystals (>10 μm thick) is shown as " ■ " and " ◇ " for comparison. 20,21
Figure 2. (a) The measured cross-plane thermal resistance of the hBN flakes multiplied by the surface area of the heating wire as a function of flake thickness at 295 K (blue points). The phonon mean free path contribution fits to the data assuming that the thermal conductivity eventually saturates to either 8 or 16 W m −1 K −1 are shown as black and purple lines, respectively. (b) The hBN flake cross-plane thermal conductivity at 295 K (blue points) calculated from the data shown in (a). Shaded regions indicate the thermal conductivity of bulk (>10 μm) hBN measured by others. 3,20,21 The black and purple lines show the phonon mean free path contribution fits. The dashed lines indicate the likely trend in the thermal conductivity when extrapolated to larger thicknesses. (c) The differential phonon mean free path functions that best fit the data shown in (a) assuming two different values for the bulk thermal conductivity κ bulk . The inset shows the corresponding thermal conductivity accumulation functions. (d) The suppression of contributions to thermal conductivity (eq 2) of phonons with long mean free paths for films of three different thicknesses.
Figure 3. (a) The measured cross-plane thermal resistance of the hBN flakes multiplied by the surface area of the heating wire as a function of flake thickness at 295 K (blue points) and 198 K (red points). (b) The cross-plane thermal resistance at 198 K is subtracted from the resistance at 295 K to remove the interfacial thermal resistance contribution (ITR). The remaining thermal resistance (orange points) is due solely to heat conduction in the hBN flake. The phonon mean free path contribution fits to the data assuming that the thermal conductivity eventually saturates to either 8, 16, or 32 W m −1 K −1 are shown as black, purple, and blue lines, respectively. (c) The calculated thermal conductivity of hBN with the ITR contribution removed (orange points) and without the subtraction (blue points). The thermal conductivity fits to the ITR removed data points are shown as solid lines. (d) The differential phonon mean free path spectra that best fit the orange data points shown in (b) assuming three different values for the bulk thermal conductivity κ bulk . The inset shows the corresponding thermal conductivity accumulation functions.
Thickness-Dependent Cross-Plane Thermal Conductivity Measurements of Exfoliated Hexagonal Boron Nitride

February 2023

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67 Reads

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13 Citations

ACS Applied Materials & Interfaces

Submicrometer-thick layers of hexagonal boron nitride (hBN) exhibit high in-plane thermal conductivity and useful optical properties, and serve as dielectric encapsulation layers with low electrostatic inhomogeneity for graphene devices. Despite the promising applications of hBN as a heat spreader, the thickness dependence of its cross-plane thermal conductivity is not known, and the cross-plane phonon mean free paths (MFPs) have not been measured. We measure the cross-plane thermal conductivity of hBN flakes exfoliated from bulk crystals. We find that submicrometer thick flakes exhibit thermal conductivities up to 8.1 ± 0.5 W m-1 K-1 at 295 K, which exceeds previously reported bulk values by more than 60%. Surprisingly, the average phonon mean free path is found to be several hundred nanometers at room temperature, a factor of 5 larger than previous predictions. When planar twist interfaces are introduced into the crystal by mechanically stacking multiple thin flakes, the cross-plane thermal conductivity of the stack is found to be a factor of 7 below that of individual flakes with similar total thickness, thus providing strong evidence that phonon scattering at twist boundaries limits the maximum phonon MFPs. These results have important implications for hBN integration in nanoelectronics and improve our understanding of thermal transport in two-dimensional materials.


The Wiggle Well
a Schematic of the Wiggle Well heterostructure, showing Ge oscillations throughout the quantum well. The darker regions have higher Ge concentration. b Plot of Ge concentration versus position in a heterostructure with a quantum well with average concentration nGe of 15% Ge and oscillation wavelength λ, corresponding to wavevector q = 2π/λ. c EMVC predictions for valley splitting contributions (Ev versus q) due to Ge concentration oscillations in the quantum well, for nGe values shown in the inset, and a vertical electric field of 8.5 MV/m. The left inset shows two neighboring Brillouin zones in the silicon conduction band, with constant energy surfaces around the valley minima shown in blue. The peaks at q ≈ 3.5 nm⁻¹ arise from Umklapp coupling between the z valleys in neighboring Brillouin zones, and the peaks at q ≈ 20 nm⁻¹ arise from coupling between z valleys within a single zone. The peak maxima at q ≈ 20 nm⁻¹ lie between 0.4 and 18 meV and are shown on a different scale in Supplementary Fig. 1. Source data are provided as a Source Data file.
Growth and measurement of a quantum dot device on a Wiggle Well heterostructure
a High-angle annular dark-field (HAADF) image of a test heterostructure demonstrating an oscillation wavelength of ~1.7 nm. The lighter regions have higher Ge concentrations. b False-color scanning electron micrograph of a quantum dot device lithographically identical to the one measured. The different colors (blue, green, yellow) indicate different gate layers, and relevant gates are labeled. c Stability diagram of a quantum dot formed under the leftmost plunger gate in the lower channel, measured using a quantum dot charge sensor in the upper left channel. Here the differential conductance dICS/dVP1 is plotted, where ICS is the current through the charge sensor and VP1 and VB1 are the voltages on gates P1 and B1, respectively. The dark lines (minima in dICS/dVP1) reveal the voltages at which charge transitions occur in the dots. The measurements presented here are performed at the last (leftmost) electron transition in this dot, near the magenta star. d Pulsed-gate spectroscopy of a singly occupied quantum dot. The dc voltage on gate P1 is swept across the 0-1 electron charging transition while simultaneously applying a square-wave voltage pulse of varying amplitude and 2 kHz frequency, revealing a characteristic V-shape in a lock-in measurement of the transconductance of the charge sensor: ∣g∣ ≈ ∣δICS/δVP1∣, where δVP1 is the pulse amplitude. e Extraction of Ev and Eorb: we repeat 16 P1 voltage scans at the same device tuning as in d, for a 16 mV pulse amplitude. The blue curve shows the averaged lock-in response and the green curve shows its derivative with respect to VP1. The resulting dips allow us to determine the valley and orbital splittings, Ev and Eorb, as indicated. Source data are provided as a Source Data file.
Valley and orbital excitation energies of a Wiggle Well quantum dot
The voltages applied to the dot are tuned in two ways, both of which change the orbital splitting (Eorb) substantially but only one of which changes the valley splitting (Ev) significantly. Case 1 (filled green diamonds): dot position depends on Eorb. Case 2 (open blue circles): dot position remains stationary. a Inset: Case 1 is achieved by asymmetrically changing voltages on screening gates S1 and S2 (top axis). Case 2 is achieved by changing voltages on S1 and S2 symmetrically, while simultaneously changing the voltage on P1 to compensate (bottom axis). Main panel: valley splittings vary by a factor of 4 for the moving dot, but much less for the stationary dot, over approximately the same range of orbital splittings. Dashed lines are linear fits through the two datasets. Valley splitting is computed by fitting to pairs of spectroscopy peaks [Fig. 2(e)]; error bars reflect the standard error in the peak fits, combined in quadrature, with errors in the lever-arm fits also added in quadrature (see Supplemental Note 3). b NEMO-3D tight-binding simulations of Case 1 (left panel) and Case 2 (right panel) scenarios, as depicted by the dot shapes shown in the insets. Simulations include atomistic random-alloy disorder, where the probability of choosing Si or Ge atoms is determined by the Ge concentration profile. Here each curve reflects a unique disorder realization, and we vary the orbital energies (Cases 1 and 2) and dot locations (Case 1 only). Note that Ev values are shifted to align when Eorb = 1 meV. (Shifted values are labelled ΔEv.) The dashed lines in b are the same as the experimental results in a. Here they fall within the statistical range of the randomized simulations, showing consistency with the theory. c Statistical sampling of NEMO-3D simulations for several values of germanium concentrations nGe, for λlong-period (top panel, 40 samples) or λshort-period (bottom panel, 20 samples) Wiggle Wells. The mean values of the simulations are shown as black lines, along with 25 to 75 percentile ranges (gray bars). Results indicate that alloy disorder plays a dominant role in valley splitting for λlong oscillations, with concentration oscillations providing a much smaller enhancement. Source data are provided as a Source Data file.
SiGe quantum wells with oscillating Ge concentrations for quantum dot qubits

December 2022

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113 Reads

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35 Citations

Nature Communications

Large-scale arrays of quantum-dot spin qubits in Si/SiGe quantum wells require large or tunable energy splittings of the valley states associated with degenerate conduction band minima. Existing proposals to deterministically enhance the valley splitting rely on sharp interfaces or modifications in the quantum well barriers that can be difficult to grow. Here, we propose and demonstrate a new heterostructure, the “Wiggle Well”, whose key feature is Ge concentration oscillations inside the quantum well. Experimentally, we show that placing Ge in the quantum well does not significantly impact our ability to form and manipulate single-electron quantum dots. We further observe large and widely tunable valley splittings, from 54 to 239 μeV. Tight-binding calculations, and the tunability of the valley splitting, indicate that these results can mainly be attributed to random concentration fluctuations that are amplified by the presence of Ge alloy in the heterostructure, as opposed to a deterministic enhancement due to the concentration oscillations. Quantitative predictions for several other heterostructures point to the Wiggle Well as a robust method for reliably enhancing the valley splitting in future qubit devices. Quantum-dot spin qubits in Si/SiGe quantum wells require a large and uniform valley splitting for robust operation and scalability. Here the authors introduce and characterize a new heterostructure with periodic oscillations of Ge atoms in the quantum well, which could enhance the valley splitting.




Self-assembled helices with single and double chirality. (a) and (b) 3D schematic views of representative samples before and after self-assembly of ribbons into a helix with single chirality (single-chirality helix or SCH) (a) and a helix with double chirality (double-chirality helix or DCH) (b). (c) SEM of an SCH formed by self-assembly of a 10 nm Au/30 nm Cr bilayer on a bulk Si substrate. (d) SEM of a DCH formed by self-assembly of a 30 nm Cr/300 nm Au/5 nm Cr trilayer ribbon on a bulk Si substrate. The sacrificial layers were GeOx and Ge in (c) and (d), respectively.
Simulations results for cold helices. (a) Simulation domain used to obtain cold parameters of a self-assembled helix in CST-MS. The parameters of the 3D structures are reported in Table I. The helix is formed by a Au tape. (b) Axial electric field vs z (axial direction) at x = 0 and y = 0. The axial field distribution in the waveguide is plotted at five different phase angles to track its propagations along z. The black lines mark the position of the self-assembled helix. (c) Magnitude of the axial component of the electric field (|Ez|) vs z for single- and double-chirality helices with the parameters reported in Table I.
Energy of an electron beam interacting with traveling waves in a single-chirality helix (red lines) and a double-chirality helix (blue lines). The dashed black line marks the DC value of the e-beam energy. The parameters of the simulated helices are reported in Table I. The meshing steps are DXY = h and DZ = p/16. The parameter t (interaction time) is the elapsed time since the e-beam and the 1 THz wave began interacting.
Simulated modulus of the axial electric field (|EZ|) vs z in hot helices with a single chirality (solid red line) and a double chirality (solid blue line). |EZ| vs z plots are shown at three different interaction times, namely, t = 0.06 ns, t = 0.12 ns, and t = 0.25 ns. The parameters of the simulated helices are reported in Table I. The meshing steps are Dxv = h and Dz = p/16.
Beam trajectory and signals in a hot DCH. (a) 3D energy distribution and trajectory of an electron beam interacting with a 1 THz electromagnetic wave that propagates in a double-chirality Au helix. The e-beam radius at z = 0 µm is rb = 5 µm. The helix parameters are reported in Table I. (b) Output signals vs interaction time (t) for a single-chirality helix (red solid line) and a double-chirality helix (blue solid line). The input signal to the two helices is shown by a black solid line.
Amplification of THz waves by beam-wave interaction in self-assembled helical slow-wave structures with single and double chirality

August 2022

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95 Reads

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3 Citations

We investigate the interaction between an electron beam and a THz guided electromagnetic wave in a helical slow-wave structure formed by self-assembly of a conductive ribbon. We have previously shown the controlled fabrication of this slow-wave structure and its potential to form the basis for widely deployable millimeter-through-THz traveling-wave tube amplifiers. The process allows the fabrication of helical slow-wave structures with single and double chirality. Here, we use three-dimensional simulations to perform a comparative analysis of beam–wave interaction in self-assembled gold helices with single and double chirality. First, the structures are modeled without the electron beam (cold helices) to calculate the distribution of the electric field generated by the high-frequency wave. We perform simulations of cold helices by using Computer Simulation Technology Microwave Studio. Second, we evaluate the interaction between an electron beam and the THz travelingwave by using a particle in cell simulator in Computer Simulation Technology Particle Studio. Simulation studies show that a switch in chirality in the middle of self-assembled helices generates a reflected wave that boosts beam–wave interaction. We demonstrate that this efficient energy exchange will potentially provide high gain in THz traveling-wave tube amplifiers based on self-assembled helices.




Toward Robust Autotuning of Noisy Quantum dot Devices

February 2022

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21 Reads

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23 Citations

Physical Review Applied

The current autotuning approaches for quantum dot (QD) devices, while showing some success, lack an assessment of data reliability. This leads to unexpected failures when noisy or otherwise low-quality data is processed by an autonomous system. In this work, we propose a framework for robust autotuning of QD devices that combines a machine learning (ML) state classifier with a data quality control module. The data quality control module acts as a “gatekeeper” system, ensuring that only reliable data are processed by the state classifier. Lower data quality results in either device recalibration or termination. To train both ML systems, we enhance the QD simulation by incorporating synthetic noise typical of QD experiments. We confirm that the inclusion of synthetic noise in the training of the state classifier significantly improves the performance, resulting in an accuracy of 95.0(9)% when tested on experimental data. We then validate the functionality of the data quality control module by showing that the state classifier performance deteriorates with decreasing data quality, as expected. Our results establish a robust and flexible ML framework for autonomous tuning of noisy QD devices.


Citations (63)


... The weak interlayer van der Waals forces limit high-frequency vibration modes, which significantly suppresses the phonon transmissivity along the cross-plane directions. [4][5][6] Moreover, heat transfer through interfaces comprising 2DM has also attracted great attention, since 2DM have been widely investigated for potential applications in electronic, photonic or spintronic devices. For example, the few-layer h-BN has been used as the dielectric layer in resistive random-access memory (RRAM) 7 , and as the tunnel barrier layer in magnetic tunnel junction (MTJ) 8 . ...

Reference:

Ultralow thermal conductance across the [FePt/h-BN/FePt] interface
Thickness-Dependent Cross-Plane Thermal Conductivity Measurements of Exfoliated Hexagonal Boron Nitride

ACS Applied Materials & Interfaces

... Quantum confinement in direct bandgap semiconductors has stood at the cradle of many photonic devices such as single photon quantum dot (QD) emitters [24][25][26][27] , quantum well (QW) lasers 28,29 and colloidal QD LED display technology [30][31][32] . These direct bandgap low dimensional structures have been responsible for major advances in science and constitute a toolbox for many optoelectronic and quantum photonic devices 33,34 , allowing for tunable and narrow band emission, and the concentration of charge carriers. ...

SiGe quantum wells with oscillating Ge concentrations for quantum dot qubits

Nature Communications

... In this context, the recent findings on the direct growth of single-layer graphene on a Ge surface and their ongoing progress provide an appropriate roadmap toward a potentially integrable interface [19][20][21][22][23][24][25][26][27][28][29][30][31][32][33][34]. However, one must pay attention to which Ge surface is used, since the graphene's growth may or may not be accompanied by faceting of the Ge substrate. ...

Effect of Germanium Surface Orientation on Graphene Chemical Vapor Deposition and Graphene-Induced Germanium Nanofaceting
  • Citing Article
  • July 2022

Chemistry of Materials

... Before using QDs as qubits to perform operations, each QD has to be tuned into a specific charge state by applying appropriate gate voltages. The complete calibration procedure can be divided into five distinct steps: (i) bootstrapping: cooling the device and bringing its regime into the appropriate parameter range ; (ii) coarse tuning [25,26,[29][30][31][32][33][34]: tuning the QDs into a specific topology (e.g., single QD, double QD) ; (iii) establishing controllability [26,29,35,36]: setup virtual gates that compensate capacitive cross-talk ; (iv) charge state tuning [22,23,26,37]: tuning the QDs into specific charge configuration (number of electrons in our case) ; (v) fine-tuning [29,38]: adjusting the inter-dot tunnel coupling. For a more detailed description of these steps, refer to Zwolak and Taylor [39]. ...

Toward Robust Autotuning of Noisy Quantum dot Devices
  • Citing Article
  • February 2022

Physical Review Applied

... Many different methods to determine the E VS of a Si/SiGe QD were reported, such as thermal excitation 8 , pulsed-gate spectroscopy in a single 21,24 or double 23 QD, spin funnel measurement in two exchange-coupled QDs 32,33 and the identification of the spin-valley relaxation hot-spot 20,21 . Other methods measure the singlet-triplet energy splitting E ST , being a lower bound of the E VS , by Pauli-spin blockade 19 or magnetospectroscopy [15][16][17]22,26,31 . High-energy resolution has been achieved by dispersive coupling, to a resonator 18,34 , and some attempts towards laterally mapping E VS 21,24,25 have been published, but these are involved, time-consuming, and cover a small area. ...

Valley splittings in Si/SiGe quantum dots with a germanium spike in the silicon well
  • Citing Article
  • August 2021

... In contrast, synchrotronbased X-ray micro-diffraction techniques allow for a non-destructive investigation of the deformation within the strained regions of such devices 22,23 that can reside at or below the top surface of the sample. Nanodiffraction with sub-100-nm resolution has been reported in studies of various crystalline materials [24][25][26][27] . To date, micro/nanodiffraction implementations possess a spatial resolution often found to be insufficient in studying the structural deformation within modern nanoelectronics. ...

Strain-Induced Lateral Heterostructures in Patterned Semiconductor Nanomembranes for Micro- and Optoelectronics
  • Citing Article
  • June 2021

ACS Applied Nano Materials

... The radiation tolerance of multiwalled carbon nanotubes (CNTs) is demonstrated by the ability of carbon atoms to be displaced after gamma-ray exposure only in the vicinity of the graphene plane, as the radiation-induced structural rearrangement is restricted to chemical cross-links between the carbon atoms from the nanotube and the nearest carbon atoms from the environment [5,6]. Currently, there are two noticeable trends in the exploitation of the radiation hardness of graphene [7] and other 2D and plane-based materials [8]. On the one hand, as a promising tool for single atom manipulation, the radiation 2D damage provides a basis for nanoscale defect engineering. ...

High-Quality Graphene as a Coating for Polycrystalline Tungsten in Low-Energy Helium and Deuterium Plasma Exposures
  • Citing Article
  • April 2021

Journal of Nuclear Materials

... Recently to utilize their unique physical properties, helices can be exquisitely fabricated by various techniques, such as 3D printing, [8] glancing angle deposition, [9] ion/electron beaminduced deposition, [10] and DNA-based self-assembly. [11] These processes facilitate the production of helices scaled from millimeters to nanoscale, capable of operating with different functionalities in micro robotics, [12] electronic devices, [13] artificial muscles, [14] and optical sensors. [10b,11,15] Researchers are particularly interested in using chirality for sensing because its unique properties offer sensing capabilities that non-chiral systems do not, making it a promising research field. ...

Self-Winding Helices as Slow-Wave Structures for Sub-Millimeter Traveling-Wave Tubes
  • Citing Article
  • December 2020

ACS Nano

... After this working frequency, the phase angle is varying abruptly due to the extrinsic characteristic of the material, and it is not advisable to execute the experiment above the working frequency. Also, multiple heaters can be employed to remove the systematic errors due to drift in ambient condition by performing simultaneous measurement from all the heater [102]. ...

Three-omega thermal-conductivity measurements with curved heater geometries
  • Citing Article
  • August 2020

Applied Physics Letters

... Analyzing the two-qubit system, we consider two distinct possibilities of dynamical fluctuations: Splitting energies J 1 , J 2 could fluctuate independently, i.e., J i (t) =J i + δ J i (t), or their fluctuations may have a common source J i (t) =J i + s i δ J (t), where s i ∈ [0, 1] is a coupling of ith qubit to the noise. Note that correlations of lowfrequency charge noises affecting two quantum dots separated by ∼ 100 nm distance have been observed in experiments [80,88]. Correspondingly, the two-qubit coupling in the former case reads ...

Spatial noise correlations in a Si/SiGe two-qubit device from Bell state coherences
  • Citing Article
  • June 2020