Conference PaperPDF Available

Using modified GaAs FET model function for the accurate representation of PHEMTs and varactors

Authors:

Abstract and Figures

In the recent PSpice programs, several GaAs FET models of various classes have been implemented. However, some of them are sophisticated and therefore very difficult to measure and identify afterwards, especially the realistic model of Parker and Skellern. In the paper, simple enhancement of one of the standard models is proposed. The resulting modification is usable for the accurate modelling of both GaAs FETs and PHEMTs. Moreover, its updated capacitance function can serve as a precise representation of microwave varactors, which is more important.
Content may be subject to copyright.
Using Modified GaAs FET Model Functions for
the Accurate Representation of PHEMTs and
Varactors
Josef Dobe
ˇ
s
Czech Technical University in Prague, Department of Radio Engineering, The Czech Republic
dobes@feld.cvut.cz
AbstractIn the recent PSpice programs, several GaAs
FET models of various classes have been implemented.
However, some of them are sophisticated and therefore very
difficult to measure and identify afterwards, especially the
realistic model of Parker and Skellern. In the paper, simple
enhancements of one of the standard models are proposed.
The resulting modification is usable for the accurate model-
ing of both GaAs FETs and pHEMTs. Moreover, its updated
capacitance function can serve as a precise representation
of microwave varactors, which is more important.
INTRODUCTION
The Sussman-Fort, Hantgan, and Huang [1] model
equations can be considered a good compromise between
the complexity and accuracy (they are updated from [2]).
However, both static and dynamic parts of the model
equations must be modified when using them for the
suggested pHEMT and varactor modeling. All the model
modifications defined below have been implemented into
the author’s program C.I.A. (Circuit Interactive Analyzer).
I. MODIFYING THE STATIC PART OF THE MODEL
The primary voltage-controlled current source of the
GaAs FET model can be defined for the forward mode
(V
d
= 0) as
V
T
= V
T 0
σV
d
, (1a)
I
d
=
(
0 for V
g
5 V
T
,
β (V
g
V
T
)
n
2
(1 + λV
d
) tanh(αV
d
) otherwise,
(1b)
and by the mirrored equations for the reverse mode
(V
d
< 0)
V
T
= V
T 0
+ σV
d
, (2a)
I
d
=
(
0 for V
0
g
5 V
T
,
β
¡
V
0
g
V
T
¢
n
2
(1 λV
d
) tanh(αV
d
) otherwise,
(2b)
where V
0
g
= V
g
V
d
see the current and voltages
in Fig. 1. The model parameters V
T 0
, β, n
2
, λ and
α have already been defined in [1], the parameter σ
used in the “boxed” parts of (1) and (2) represents an
improvement of the classical simpler models. The Parker-
Skellern “realistic” model contains similar dependencies
[3] (1a) and (2a) can be considered as their base.
V
G
V
D
I
D
V
d
V
g
r
D
r
S
C
g
frequency
dispersion
Schottky
junctions
I
d
I
d
Fig. 1. Simplified diagram of the GaAs FET model, which includes
the frequency dispersion. For modeling the gate delay, a precise method
based on the second-order Bessel function (in frequency domain) and
associated differential equation (in time domain) is suggested in [7].
(It uses the way defined in [8], but with another model function.)
Although the equations (1) and (2) are relatively simple,
they contain an improvement in comparison with the
classical Curtice model [2] (n
2
which characterizes gate
voltage influence more precisely), and also in comparison
with the classical Statz model [4] (σ which characterizes
drain voltage influence more precisely).
The importance of the modifications (1a) and (2a)
can be demonstrated by the identification of the model
parameters for DZ71 [5] GaAs FET see the results in
Fig. 2. The C.I.A. [6] optimization procedure has provided
the values of the model parameters V
T 0
= 1.36 V,
β = 0.0346 AV
2
, n
2
= 1.73, λ = 0.082 V
1
(negative value arises if σ used), α = 2.56, σ = 0.141,
r
D
= 2.88 , and r
S
= 2.62 (r
D
and r
S
have already
been estimated in [5]). To compare, the same FET has
been identified by the classical Statz model [4] the
suggested model is more accurate, especially for the lesser
values of the gate-source control voltage.
0
-0.2
-0.5
-1
-1.5
0 1 2 3 4 5
0
.01
.02
.03
.04
.05
.06
.07
V
G
( )V
V
D
( )V
I
I
I
D
D
D
(ident,
C I A ) (ident,
Statz)
(meas)
( )
( ) ( )
. . .
,
,
A
Fig. 2. Comparison of the GaAs FET model identification using the
suggested and classical Statz equations (rms = 2.73 % and δ
max
=
8 % for the C.I.A. model). The measured data including r
D
and r
S
estimations are taken from [5].
-1.5
-1
-0.5
0.5
0
0 1 2 3 4 5
0
.025
.05
.075
.1
.125
.15
.175
.2
V
G
( )V
V
D
( )V
I
I
D
D
(ident)
(meas)
( ) ( )
,
A
Fig. 3. Results of the pHEMT identification using the C.I.A. model
(1) and (2) (rms = 2.38 % and δ
max
= 8.24 %). The measured data
are taken from [9].
II. USING THE MODEL AS PHEMTS
REPRESENTATION
The modifications (1a) and (2a) also enable the model
to be used for the pHEMT modeling see the results in
Fig. 3. The identification has set the model parameters
to V
T 0
= 1.64 V, β = 0.102 AV
2
, n
2
= 0.991, λ =
0.0288 V
1
, α = 1.16, σ = 0.00797, r
D
= 0.3 , and
r
S
= 0.2 . The representation of pHEMT using (1) and
(2) is very precise (rms 2 % only) and is slightly more
accurate than the TriQuint model in [9]. (See [10] and
[11] for exhaustive TriQuint model definitions.)
The model is able to form a negative differential
conductance, which is illustrated in Fig. 3. On the other
hand, at very high frequencies, the s
22
parameter has
mostly a positive real part. Therefore, a corrective current
source I
0
d
must be added identified by the s parameters
C
G
V
G
V
A
V
B
Fig. 4. Suggested GaAs FET model function for the varactor repre-
sentation.
measurement. Embedding the frequency dispersion can be
also performed in another precise but more complicated
way, see [3].
III. MODIFYING THE DYNAMIC PART OF THE MODEL
In general, the GaAs FET gate capacitance is highly
nonlinear as seen in Fig. 4. The definition splits into the
three parts (similar to those in Statz model [12], [13])
C
g
=
²W arctan
s
φ
0
V
T
V
T
V
g
for V
g
5 V
A
,
V
g
V
A
V
B
V
A
"
C
J0
µ
1
V
B
φ
0
m
+
π
²W
2
²W arctan
r
φ
0
V
T
V
T
V
A
#
+
²W arctan
r
φ
0
V
T
V
T
V
A
for V
g
> V
A
V
g
< V
B
,
π
²W
2
+ C
J0
µ
1
V
g
φ
0
m
for V
g
= V
B
,
(3)
where the transitional region is determined empirically [1]
V
A
= V
T
0.15 V, V
B
= V
T
+ 0.08 V. (4)
All the model parameters have been defined in [1] with
the exception of the “boxed” m. This parameter can be
found in the recent PSpice tables of the advanced model
parameters all the classical models always use
1
2
instead of m.
IV. USING THE MODEL AS VARACTORS
REPRESENTATION
The microwave varactors are highly nonlinear with
observed dependencies similar to those in GaAs FET gate
capacitances. Therefore, the functions in (3) can be used
after replacing C
g
and V
g
with the external ones, i.e.,
C
G
and V
G
.
A. Testing the Varactors from Texas Instruments
Firstly, let’s demonstrate this idea by identifying Texas
Instruments EG8132 gate and source [14] varactors see
the results in Fig. 5 and 6. The identifications confirm that
the usage of (3) enables more accurate approximation than
the 6
th
order polynomial in [14].
-13 -12 -11 -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0
0
.5
1
1.5
C
C
C
G
G
G
(ident,
C I A ) (ident,
polyn)
(meas)
( )
( )
pF
)
(
. . .
,
,
V
G
( )V
Fig. 5. Comparison of the EG8132 gate varactor model identification
using the updated GaAs FET and classical polynomial functions (rms =
4.52 % and δ
max
= 13.7 % for the C.I.A. model). The measured data
are taken from [14], where the original polynomial approximation a
0
+
a
2
(V
G
V
a
)
2
+ a
3
(V
G
V
a
)
3
+ · · · + a
6
(V
G
V
a
)
6
has been
also tested with the inaccurate results (dashed curve) shown here. (In
[14], the parameters V
a
= 8 V, a
0
= 0.54 pF, a
2
= 2.3 nF V
2
,
a
3
= 87.938 nF V
3
, a
4
= 1.4 µF V
4
, a
5
= 10.458 µF V
5
, and
a
6
= 30.48 µF V
6
were used.)
For the gate varactor, the C.I.A. optimization proce-
dure has provided the values of the model parameters
²W = 0.15711 pF, C
J0
= 1.0771 pF, V
T
= 2.7569 V,
φ
0
= 23.451 V (!), and m = 12.827 (!). The last
two parameters do not have “physical” values, which
illustrates the necessity of using the general m-power
in (3). From the physical point of view, the varactor is not
defined for V
G
> V
B
by the classical junction capacitance
function however, this formula is flexible enough to
characterize it.
For the source varactor, the C.I.A. optimization pro-
cedure has provided the values of the model parameters
²W = 0.13587 pF, C
J0
= 0.66625 pF, V
T
= 2.6026 V,
φ
0
= 13.251 V (!), and m = 8.1457 (!) with a little
more precise device characterization – compare the values
rms and δ
max
.
B. Testing the Varactor from International Laser Centre
Secondly, the nonlinear capacitance of the nonstandard
SACM APD layer structure MO457/4 [15] has been
identified see the results in Fig. 7.
The C.I.A. optimization procedure has provided the
values of the model parameters ²W = 1.51155 pF,
C
J0
= 5.30894 pF, V
T
= 6.17455 V, φ
0
= 204.491 V,
and m = 30.4842 (the last two parameters have again
exceptional values).
CONCLUSION
The proposed model has been verified for the approxi-
mation of both GaAs FETs and pHEMTs with the preci-
sion of several percent. The new unusual way is suggested
for the accurate modeling of the microwave varactors
V
G
( )V
C
C
C
G
G
G
(ident,
C I A ) (ident,
polyn)
(meas)
( )
( )
pF
)
(
. . .
,
,
-14 -13 -12 -11 -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0
0
.1
.2
.3
.4
.5
.6
.7
.8
.9
1
Fig. 6. Comparison of the EG8132 source varactor model identification
using the updated GaAs FET and classical polynomial functions (rms =
4 % and δ
max
= 6.87 % for the C.I.A. model). The measured data,
and the polynomial approximation a
0
+ a
2
(V
G
V
a
)
2
+ a
3
(V
G
V
a
)
3
+ · · · + a
6
(V
G
V
a
)
6
are taken from [14] again (V
a
=
6 V, a
0
= 0.09 pF, a
2
= 0.4783 nF V
2
, a
3
= 14.703 nF V
3
,
a
4
= 0.18351 µF V
4
, a
5
= 1.0475 µF V
5
, and a
6
= 2.3177 µF V
6
were used with the inaccurate results shown by dashed curve here).
Fig. 7. Results of the ILC varactor identification using the updated
GaAs FET C.I.A. model function (rms = 6.21 % and δ
max
= 23.7 %).
The measured data are granted by the authors of [15].
using the modified GaAs FET capacitance function. It
is important that all the model parameters can be easily
identified from the measured data.
ACKNOWLEDGMENTS
This paper has been supported by the Grant of the
European Commission FP6: Expression of Interest for
a Network of Excellence called TARGET (Top Ampli-
fier Research Groups in a European Teamwork), and
by the Czech Technical University Research Project
N
o
J04/98:212300016.
APPENDIX
The root mean square and maximum deviations com-
puted for the results in Figs. 2–5 are defined naturally
rms =
v
u
u
u
u
t
n
p
X
i=1
Ã
y
(ident)
i
y
(meas)
i
y
(meas)
i
!
2
n
p
× 100 %,
δ
max
=
n
p
max
i=1
¯
¯
¯
¯
¯
y
(ident)
i
y
(meas)
i
y
(meas)
i
¯
¯
¯
¯
¯
× 100 %,
respectively, where y
(ident)
i
and y
(meas)
i
are the identified
and measured values, and n
p
is the number of all points.
REFERENCES
[1] S. E. Sussman-Fort, J. C. Hantgan, and F. L. Huang, A SPICE
model for enhancement- and depletion-mode GaAs FET’s, IEEE
Trans. Microwave Theory Tech., vol. 34, pp. 1115–1119, Nov.
1986.
[2] W. R. Curtice, “GaAs MESFET modeling and nonlinear CAD,
IEEE Trans. Microwave Theory Tech., vol. 36, pp. 220–230, Feb.
1988.
[3] A. E. Parker and D. J. Skellern, A realistic large-signal MESFET
model for SPICE, IEEE Trans. Microwave Theory Tech., vol. 45,
pp. 1563–1571, Sept. 1997.
[4] H. Statz, P. Newman, I. W. Smith, R. A. Pucel, and H. A. Haus,
“GaAs FET device and circuit simulation in SPICE, IEEE Trans.
Electron Devices, vol. 34, pp. 160–169, Feb. 1987.
[5] A. K. Jastrzebski, “Non-linear MESFET modeling, in Proc. 17
th
European Microwave Conference, 1987, pp. 599–604.
[6] J. Dobe
ˇ
s, “C.I.A.—a comprehensive CAD tool for analog, RF, and
microwave IC’s, in Proc. 8
th
IEEE Int. Symp. High Performance
Electron Devices for Microwave and Optoelectronic Applications,
Glasgow, Nov. 2000, pp. 212–217.
[7] ——, “Expressing the MESFET and transmission line delays using
Bessel function, in Proc. 16
th
European Conf. Circuit Theory
Design, vol. I, Krak
´
ow, Sep. 2003, pp. 169–172.
[8] A. Madjar, A fully analytical AC large-signal model of the GaAs
MESFET for nonlinear network analysis and design,IEEE Trans.
Microwave Theory Tech., vol. 36, pp. 61–67, Jan. 1988.
[9] J. Cao, X. Wang, F. Lin, H. Nakamura, and R. Singh, An empirical
pHEMT model and its verification in PCS CDMA system, in
Proc. 29
th
European Microwave Conference, Munich, Oct. 1999,
pp. 205–208.
[10] A. J. McCamant, G. D. McCormack, and D. H. Smith, An im-
proved GaAs MESFET model for SPICE,IEEE Trans. Microwave
Theory Tech., vol. 38, pp. 822–824, June 1990.
[11] D. H. Smith, An improved model for GaAs MESFETs, TriQuint
Semiconductors Corporation, Tech. Rep., 2000.
[12] G. Massobrio and P. Antognetti, Semiconductor Device Modeling
With SPICE. New York: McGraw-Hill, 1993.
[13] E. Sijerci
´
c and B. Pejcinovi
´
c, “Comparison of non-linear MESFET
models, in Proc. 9
th
IEEE Int. Conf. on Electronics, Circuits and
Systems, vol. III, Dubrovnik, Sep. 2002, pp. 1187–1190.
[14] C.-R. Chang, B. R. Steer, S. Martin, and E. Reese, “Computer-
aided analysis of free-running microwave oscillators,IEEE Trans.
Microwave Theory Tech., vol. 39, pp. 1735–1744, Oct. 1991.
[15] M. Klasovit
´
y, D. Ha
ˇ
sko, M. Tom
´
a
ˇ
ska, and F. Uherek, “Character-
ization of avalanche photodiode properties in frequency domain,
in Proc. 5
th
Scientific Conference on Electrical Engineering &
Information Technology, Bratislava, Sep. 2002, pp. 63–65.
... According to our assessment, models developed for GaAs MESFETs are being used to simulate the I-V characteristics of GaN HEMTs; for example, in Ref. [18], the Curtice model developed for MESFETs is employed to simulate the characteristics of GaN HEMTs. However, models developed for GaAs MESFETs [23][24][25][26][27][28] are bound to lose their accuracy when the device characteristics exhibit noticeable self-heating effects. It is therefore pertinent to develop models for GaN HEMTs that can simulate their I-V characteristics while being compact enough to be employed in computer-aided design (CAD) software. ...
... The characteristics shown in Fig. 2 clearly demonstrate that the proposed model is accurate enough to simulate the I-V characteristics of GaN HEMTs with varying dimensions. Tables 3, 4, 5, and 6 provide a comparison of the performance of the proposed model with other numerical models reported in the literature [23][24][25][26][27][28]. Looking at the average RMSE, it can be claimed that, for device T 1 , the improvement offered by the proposed model is 31 % relative to the second best model, in this case that of Curtice [24]. ...
... This makes the proposed model more versatile and suitable for use in CAD software. [24] 0.162 0.185 0.117 McCamant [25] 0.235 0.199 0.156 Dobes [26] 0.221 0.187 0.140 Islam [27] 0.585 0.395 0.254 Riaz [28] 0.188 0.188 0.113 Proposed 0.156 0.134 0.096 device drain and gate bias and simulates both the positive and negative conductance with a good degree of accuracy. The appearance of a peak in the transconductance at a relatively higher negative gate bias is a frequently observed phenomenon in GaN HEMTs, and the proposed model can simulate such characteristics with improved accuracy. ...
Article
Full-text available
Bearing in mind the requirements of design engineers, a nonlinear model is developed to simulate the temperature-dependent I–V characteristics of submicron high-electron-mobility transistors (HEMTs). Self- and ambient heating effects are incorporated into the model expression to cater for both the negative and positive conductance of the device, after the onset of the saturation current. It is shown that the accuracy of numerical models previously developed for metal–semiconductor field-effect transistors (MESFETs) deteriorates when simulating the I–V characteristics of gallium nitride (GaN) HEMTs, primarily due to the self-heating effects. The validity of the proposed model is checked for GaN HEMTs with gate length (\(L_\mathrm{g}\)) ranging from 0.12 to 0.7 \(\upmu \hbox {m}\) in the temperature range of \(T=298\) to \(T=773\) K. It is demonstrated that the proposed model simulates, with a good degree of accuracy, the output characteristics of such devices exhibiting negative conductance in the saturation region of operation. It is observed that, for devices exhibiting negative conductance in the saturation region, the peak transconductance (\(g_\mathrm{m}\)) occurs at a relatively higher negative gate bias while the peak value reduces with increasing ambient temperature. The root-mean-square errors reveal that the proposed model is better than other similar models reported in the literature, with an improvement varying from 17 to 50 % depending on the device characteristics.
... A semiempirical , contrary to an empirical approach, is preferred because it involves the ease inherent to an empirical modeling and uses basic variables defining the device characteristics without getting involved into complicated mathematical solutions [16, 17]. There are numerous non-linear models available in the literature with the claim to simulate I − V characteristics of SiC MESFETs [18][19][20][21][22][23][24][25][26][27][28]. In this paper, as a first part, the accuracies of these models have been investigated for L g = 0.4 µm, 0.5 µm, 0.6 µm and 0.7 µm SiC MESFETs. ...
... To demonstrate the validity of the proposed model, submicron SiC MESFETs of various L g were chosen and the detail of which is given in Table 1. A MATLAB simulator was developed wherein the respective model equations were used [18][19][20][21][22][23][24][25][26][27]. Optimization of different variables of a model has been carried out using particle swarm optimization (PSO) technique and a brief of which is as under [30, 31]. ...
Article
Full-text available
This paper presents an improved model to simulate I-V characteristics of submicron SiC MESFETs designed for microwave power applications. By adjusting the device biasing through simulation variables a non-ideal Schottky behavior, which is commonly observed in submicron devices, has been adequately addressed in the proposed model. Swarm optimization technique has been employed to investigate gate length (Lg) dependent performance of various SiC MESFET’s models. It has been shown that the proposed model provides improved accuracy ranging from 7% to 24% compared to the best model available in the literature. This enhanced performance is primarily associated with the extra control which the proposed model provides to simulate the movement of the depletion region in the channel as a function of applied voltages. An attempt has been made to identify the location underneath the Schottky barrier gate where the depletion region gets its maximum height and thus controls the saturation current of the channel. Physical and electrical parameters of various SiC MESFETs having Lg = 0.4, 0.5, 0.6 and 0.7 microns were also assessed. An accurate assessment of device physical parameters exhibits the validity of the model for submicron SiC MESFETs. The model is, therefore, capable to simulate I-V characteristics of SiC MESFETs designed especially for microwave applications and thus it could be a useful tool for device simulation softwares.
Article
Full-text available
This paper presents a detailed analytical and non-linear mathematical model describing the I−V characteristics of submicron Silicon Carbide (SiC) Metal semiconductor field-effect transistor (MESFETs). Silicon Carbide (SiC) MESFET is a wideband device capable to handle high power at microwave frequencies. It is shown that our proposed model can predict the output characteristics of the device both under normal conditions as well as at relatively high drain bias. A comparison of our proposed model is made with Riaz, Khan.M, Shamsir, Kompa, Zhao, Raffo, Josef, Guidry, Mishra, and recently reported 4H-silicon carbide (SiC) MESFET large-signal I-V models by using the Particle Swarm Optimization (PSO) process. A full SiC MESFET analysis is provided and using experimental data, the validity of the proposed technique is demonstrated. The results show that the new model has the advantages of high accuracy, easily making initial value and robustness over other models. Our proposed technique improves accuracy in predicting the I-V characteristic and output characteristic of SiC MESFETs device. Silicon Carbide (SiC) MESFET is a wideband platform capable of handling microwave frequencies with high efficiency. SiC MESFETs operations are typically conducted under high bias conditions, in which the response is modified from normal. The proposed technique is useful for evaluating the output of high-power microwave SiC MESFETs over a wider bias range.
Article
In the recent PSpice programs, five types of the GaAs FET model havebeen implemented. However, some of them are too sophisticated andtherefore very difficult to measure and identify afterwards, especiallythe realistic model of Parker and Skellern. In the paper, simpleenhancements of one of the classical models are proposed first. Theresulting modification is usable for the accurate modeling of both GaAsFETs and pHEMTs. Moreover, its updated capacitance function can serveas an accurate representation of microwave varactors, which is alsoimportant. The precision of the updated models can be strongly enhancedusing the artificial neural networks. In the paper, both using anexclusive neural network without an analytic model and cooperating acorrective neural network with the updated analytic model will bediscussed. The accuracy of the analytic models, the models based on theexclusive neural network, and the models created as a combination ofthe updated analytic model and the corrective neural network will becompared.
Article
Full-text available
A comprehensive large-signal MESFET model that provides a realistic description of measured characteristics over all operating regions is presented, It describes subthreshold conduction and breakdown. It has frequency dispersion of both transconductance and drain conductance, and derates with power dissipation. All derivatives are continuous for a realistic description of circuit distortion and intermodulation. The model has improved descriptions of capacitance and bias dependence. It has small-signal S-parameter accuracy extended to a wide range of operating conditions. The model is implemented with new techniques for continuity and dispersion. These provide accurate prediction of circuit performance and also improve simulation speed
Article
From the Publisher:With all the clarity and hands-on practicality of the best-selling first edition,this revised version explains the ins and outs of SPICE,plus gives new data on modeling advanced devices such as MESFETs,ISFETs,and thyristors. And because it's the only book that describes the models themselves,it helps readers gain maximum value from SPICE,rather than just telling them how to run the program. This guide is also distinctive in covering both MOS and FET models. Step by step,it takes the reader through the modeling process,providing complete information on a variety of semiconductor devices for designing specific circuit applications. These include: Pn junction and Schottky diodes; bipolar junction transistor (BJT); junction field effect transistor (JFET); metal oxide semiconductor transistor (MOST); metal semiconductor field effect transistor (MESFET); ion sensitive field effect transistor (ISFET); semiconductor controlled rectifier (SCR-thyristor).
Conference Paper
A new empirical PHEMT model has been developed with emphases on the simplicity and accuracy of the model. The purpose of the work is to use fewer model parameters to describe the device nonlinear performance without losing accuracy. This model has been verified in PCS CDMA system. The results show that the model can predict the nonlinear performance of the PHEMT in PCS CDMA application accurately.
Article
Contains summary and reports on three research projects.
Conference Paper
The objective of this paper is to investigate the non-linear performance of some of the most widely used GaAs MESFET models. DC, AC and intermodulation (IMD) measurements were carried out on 300 μm devices, and equivalent circuit parameters were extracted and optimized. Model predictions of IMD were investigated through several figures of merit: gain, IMD3, IMD5, compression points and intercept points. No clear cut "winner" among the models was observed, but Statz and Advanced Materka have the best overall performance.
Conference Paper
Author has constructed an original CAD tool called CIA (Circuit Interactive Analyser). The programme has built-in modified models for GaAsFET, other semiconductor elements, and transmission lines. New features of the GaAsFET model are summarised in the first section. The CIA program comprises several types of analyses that are not customary in the PSPICE class. The poles-zeros, steady-state, optimisation and sensitivity analyses are characterised in the following sections. A tuneable distributed microwave oscillator as an example is analysed in the fifth section-poles-zeros diagram and steady-state are presented here
Conference Paper
A large-signal MESFET model, implemented with new techniques, has continuity and rate dependence. These features provide accurate prediction of circuit gain and distortion. The techniques also improve simulation speed. The model has improved descriptions of capacitance and bias dependence. It has small-signal S-parameter accuracy extended to a wide range of operating conditions. This model is now in several simulators including Pspice v6.2
Conference Paper
Finds a non-linear circuit model of a MESFET, which is sufficiently accurate for microwave applications and additionally, is easy to implement in general simulation programs. In the first part of the paper, existing non-linear MESFET models are reviewed. The second part contains detailed description of the proposed empirical model, which is a combination and modification of the models discussed in the first part
Article
An improved model for the GaAs MESFET has been implemented in the source code of the circuit-simulation program SPICE. New features include 1) an accurate model for the Schottky barrier, which allows simulation of both enhancement- and depletion-mode devices; 2) detailed modeling of the nonlinear gate-source and gate-drain capacitance; and 3) a user-specifiable value for the exponent in the expression for the dependence of the dc drain current upon the gate-source voltage. Also discussed are some important points concerning the charge-voltage equations that must accompany the new model's capacitance-voltage equations within SPICE. The new GaAs FET SPICE model is believed to be the most comprehensive one available to date in the public domain.
Article
A SPICE model for modeling GaAs MESFET devices more accurately is discussed. In particular, small-signal parameters are accurately modeled over a wide range of bias conditions. These results were achieved by modifying the model equations of H. Statz et al. (see IEEE Trans. Electron. Devices, vol.3, no.2, p.160-9, 1987) to better represent the variation of I <sub>ds</sub> as a function of the applied voltage. The model applies over a large range of pinch-off voltages, allows size scaling of devices, and is suited for modeling R <sub>ds</sub> changes with frequency. The Statz equations are used to represent diode characteristics and capacitive components of the model