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Logic and in-memory computing achieved in a single ferroelectric semiconductor transistor

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Abstract

Exploring materials with multiple properties who can endow a simple device with integrated functionalities has attracted enormous attention in the microelectronic field. One reason is the imperious demand for processors with continuously higher performance and totally new architecture. Combining ferroelectric with semiconducting properties is a promising solution. Here, we show that logic, in-memory computing, and optoelectrical logic and non-volatile computing functionalities can be integrated into a single transistor with ferroelectric semiconducting α-In2Se3 as the channel. Two-input AND, OR, and non-volatile NOR and NAND logic operations with current on/off ratios reaching up to five orders, good endurance (1000 operation cycles), and fast operating speed (10 μs) are realized. In addition, optoelectrical OR logic and non-volatile implication (IMP) operations, as well as ternary-input optoelectrical logic and in-memory computing functions are achieved by introducing light as an additional input signal. Our work highlights the potential of integrating complex logic functions and new-type computing into a simple device based on emerging ferroelectric semiconductors.

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... These semiconductors offer an ideal platform for in-memory computing 11 . Logic, memory and neuromorphic computing functions are realized in junctions [12][13][14] or transistors 6,10,11,[15][16][17][18] using the layered ferroelectric semiconductor as the channel. The multiple conductance states in these devices provide the physical basis for the integration of logic and memory 19 , in which case the implementation of precise conductivity modulation becomes essential. ...
... This insight is widely applicable to currently reported FeCFETs, such as α-In 2 Se 3 , InSe, Bi 2 O 2 Se (refs. 6,10,11,15,16,21) and AgSiP 2 Se 6 transistors 6,10,11,15,16,21 . ...
... This insight is widely applicable to currently reported FeCFETs, such as α-In 2 Se 3 , InSe, Bi 2 O 2 Se (refs. 6,10,11,15,16,21) and AgSiP 2 Se 6 transistors 6,10,11,15,16,21 . ...
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Precise control of the conductivity of layered ferroelectric semiconductors is required to make these materials suitable for advanced transistor, memory and logic circuits. Although proof-of-principle devices based on layered ferroelectrics have been demonstrated, it remains unclear how the polarization inversion induces conductivity changes. Therefore, function design and performance optimization remain cumbersome. Here we combine ab initio calculations with transport experiments to unveil the mechanism underlying the polarization-dependent conductivity in ferroelectric channel field-effect transistors. We find that the built-in electric field gives rise to an asymmetric conducting route formed by the hidden Stark effect and competes with the potential redistribution caused by the external field of the gate. Furthermore, leveraging our mechanistic findings, we control the conductivity threshold in α-In2Se3 ferroelectric channel field-effect transistors. We demonstrate logic-in-memory functionality through the implementation of electrically self-switchable primary (AND, OR) and composite (XOR, NOR, NAND) logic gates. Our work provides mechanistic insights into conductivity modulation in a broad class of layered ferroelectrics, providing foundations for their application in logic and memory electronics.
... For example, wang et al. demonstrated a multifunctional FeFET that can integrate logic, memory computing, photoelectric logic, and non-volatile computing into a single transistor. The gate of this transistor can also be used as a signal input, showing the powerful potential of FeFET in synaptic devices 14 . ...
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After more than a hundred years of development, ferroelectric materials have demonstrated their strong potential to people, and more and more ferroelectric materials are being used in the research of ferroelectric transistors (FeFETs). As a new generation of neuromorphic devices, ferroelectric materials have attracted people's attention due to their powerful functions and many characteristics. This article summarizes the development of ferroelectric material systems in recent years and discusses the simulation of artificial synapses. The mainstream ferroelectric materials are divided into traditional perovskite structure, fluorite structure, organic polymer, and new 2D van der Waals ferroelectricity. The principles, research progress, and optimization for brain like computers of each material system are introduced, and the latest application progress is summarized. Finally, the scope of application of different material systems is discussed, with the aim of helping people screen out different material systems based on different needs.
... Through the synergistic modulation of mechanical and optical signals, our optoelectronic synaptic transistors can conveniently switch to distinct logic functions and improve information processing capabilities. High-performance logic computation can be achieved with either electrical or optical inputs without building complex complementary metal oxide semiconductor circuits, [61,62] but mechanical-optical synergy provides a new avenue for multifunctional applications of interactive neuromorphic devices. The α-In 2 Se 3 synaptic transistor also simulates the classical Pavlovian conditioning experiment related to the associative learning process in the brain. ...
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Inspired by biological neural networks, the fabrication of artificial neuromorphic systems with multimodal perception capacity shows promises in overcoming the “von Neumann bottleneck” and takes advantage of the efficient perception and computation of diverse types of signals. Here, we combine a triboelectric nanogenerator with an α‐phase indium selenide (α‐In2Se3) optoelectronic synaptic transistor to construct a tribo‐ferro‐optoelectronic artificial neuromorphic device with multimodal plasticity. Based on the excellent ferroelectric and optoelectronic characteristics of the α‐In2Se3 channel, typical synaptic behaviors (e.g., pair‐pulse facilitation and short‐term/long‐term plasticity) are successfully simulated in response to the synergistic effect of mechanical and optical stimuli. The interaction of mechanical displacement and light illumination enables heterosynaptic plasticity and spatiotemporal dynamic logic. Furthermore, multiple Boolean logical functions and associative learning behaviors are successfully implemented using the paired stimuli of displacement pulses and light pulses. The proposed tribo‐ferro‐optoelectronic artificial neuromorphic devices have great potential for application in interactive neural networks and next‐generation artificial intelligence.
... So far, most FSTs have been proposed based on ferroelectric materials such as PbZr x Ti 1−x O 3 (PZT) [17,18], poly(vinylidene fluoride-trifluoroethylene) (P(VDF-TrFE)) [19][20][21][22], and novel two-dimensional materials [23][24][25]. Conductance dynamic range (G max /G min ) larger than 20 and more than 100 conductance states have been achieved in these FSTs, by means of channel scaling [26], electrode altering [27], and 2D ferroelectric semiconductors [28][29][30], but tens-ofvolt and microsecond pulses are usually required for the programming process. ...
Article
Benefiting from the nonvolatile and fast programming operations of ferroelectric materials, ferroelectric synaptic transistors (FSTs) are promising in neuromorphic computing. However, it is challenging to realize conductance with a large dynamic range (Gmax/Gmin) and multilevel states simultaneously under low energy consumption. Here, solution-processed indium oxide (In2O3) synaptic transistors gated by ferroelectric Hf0.5Zr0.5O2 (HZO) are proposed for the first time to address the above problems. Excellent synaptic characteristics were realized through the delicately regulated ferroelectric phase and good inhibition of charge injection in ferroelectric bulk and ferroelectric/semiconductor interface. Long-term potentiation/depression (LTP/D) up to 101 effective conductance states and excellent endurance (>1000 cycles) with large Gmax/Gmin = 32.2 were successfully mimicked under a low energy consumption of 490 fJ per spike event. Besides, the simulation achieved 96.5% recognition accuracy of handwriting digit, which is the highest record for existing FSTs. This work provides a new pathway for developing low-cost, high-performance, and energy-efficient FSTs.
... Recently, ferroelectric field-effect transistors (Fe-FETs) with nondestructive operation, nonvolatility, and high dense integration have attracted extensively interest as a promising building block for high-performance analog computing. [23][24][25][26] In a Fe-FET, ferroelectric materials are utilized as the gate insulators where the conductance of semiconductor can be modulated by the polarization switching of a ferroelectric dielectric layer under an external electrical field. The short retention time originated from the gate leakage current and depolarization field-induced charge trap is the main obstacle for the commercialization of Fe-FET. ...
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... fabrication process, the Raman spectrum of the channel was tested. As shown in Fig. 1(b), peaks observed at 104, 181 and 193 cm -1 are corresponding to the , and modes of α-In 2 Se 3 respectively, which is consistent with previous results [45,46]. This demonstrates the high crystalline quality of the channel material after device fabrication. ...
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... Ferroelectric materials attract intensive attentions due to their uniquely reversible polarization switching property and high dielectric performance, thus having promising applications in the energy harvesters, 1 nonvolatile memory devices 2,3 and novel multi-fields coupling electronic devices. 4,5 For example, tin-hypothiodiphosphate (Sn 2 P 2 S 6 ) is a nonoxide ferroelectric semiconductor with monoclinic Pn structure at room temperature. ...
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... IMC can be realized using Static Random-Access Memory (SRAM) [39], Dynamic RAM (DRAM) [40] and Non-Volatile Memories (NVMs) including Resistive RAM (ReRAM) [41], Ferroelectric RAM (FeRAM) [42], STT-MRAM [22], Spin-Orbit Torque MRAM (SOT-MRAM) [32] and other emerging memory devices [21]. NVMs outperform SRAM and DRAM with near-zero leakage power and the non-volatile property of the stored data [43], while STT-MRAM and SOT-MRAM outperform other NVMs with ∼ 10 15 write endurance of single memory cell and much shorter access latency [44]. ...
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The growing importance of applications based on machine learning is driving the need to develop dedicated, energy-efficient electronic hardware. Compared with von Neumann architectures, which have separate processing and storage units, brain-inspired in-memory computing uses the same basic device structure for logic operations and data storage1–3, thus promising to reduce the energy cost of data-centred computing substantially⁴. Although there is ample research focused on exploring new device architectures, the engineering of material platforms suitable for such device designs remains a challenge. Two-dimensional materials5,6 such as semiconducting molybdenum disulphide, MoS2, could be promising candidates for such platforms thanks to their exceptional electrical and mechanical properties7–9. Here we report our exploration of large-area MoS2 as an active channel material for developing logic-in-memory devices and circuits based on floating-gate field-effect transistors (FGFETs). The conductance of our FGFETs can be precisely and continuously tuned, allowing us to use them as building blocks for reconfigurable logic circuits in which logic operations can be directly performed using the memory elements. After demonstrating a programmable NOR gate, we show that this design can be simply extended to implement more complex programmable logic and a functionally complete set of operations. Our findings highlight the potential of atomically thin semiconductors for the development of next-generation low-power electronics.
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Due to the potential applications in optoelectronic memories, optical control of ferroelectric domain walls has emerged as an intriguing and important topic in modern solid‐state physics. However, its device implementation in a single ferroelectric, such as conventional BaTiO3 or PZT ceramics, still presents huge challenges in terms of the poor material conductivity and the energy mismatch between incident photons and ferroelectric switching. Here, using the generation of photocurrent in conductive α‐In2Se3 (a van der Waals ferroelectric) with a two‐terminal planar architecture, the first demonstration of optical‐engineered ferroelectric domain wall in a non‐volatile manner for optoelectronic memory application is reported. The α‐In2Se3 device exhibits a large optical‐writing and electrical‐erasing (on/off) ratio of >104, as well as multilevel current switching upon optical excitation. The narrow direct bandgap of the multilayer α‐In2Se3 ferroelectric endows the device with broadband optical‐writing wavelengths greater than 900 nm. In addition, photonic synapses with approximate linear weight updates for neuromorphic computing are also achieved in the ferroelectric devices. This work represents a breakthrough toward technological applications of ferroelectric nanodomain engineering by light. An optically engineered ferroelectric domain wall in a layered ferroelectric is demonstrated for optoelectronic memory applications. The device exhibits a large optical‐writing and electrical‐erasing ratio of >104, as well as multilevel current switching upon optical excitation. The optical‐writing wavelength can be greater than 900 nm. Photonic synapses with approximate linear weight updates for neuromorphic computing are also achieved in such devices.
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Recently, 2D ferroelectrics have attracted extensive interest as a competitive platform for implementing future generation functional electronics, including digital memory and brain-inspired computing circuits. Fulfilling their potential requires achieving the interplay between ferroelectricity and electronic characteristics on the device operation level, which is currently lacking since most studies are focused on the verification of ferroelectricity from different 2D materials. Here, by leveraging the ferroelectricity and semiconducting properties of α-In2Se3, ferroelectric semiconductor field-effect transistors (FeSFETs) are fabricated and their potential as artificial synapses is demonstrated. Multiple conductance states can be induced in α-In2Se3-based FeSFETs by controlling the out-of-plane polarization, which enables the device to faithfully mimic biosynaptic behaviors. In comparison with charge-trapping-based three-terminal synaptic devices, the electronic synapses based on α-In2Se3 have the advantages of good controllability, fast learning, and easy integration of gate dielectric, rendering them promising for neuromorphic computing. In addition, an abnormal resistive switching phenomenon in α-In2Se3 is reported when operated in the in-plane ferroelectric switching mode. The findings pave the way forward for α-In2Se3-based FeSFETs for developing neuromorphic devices in brain-inspired intelligent systems.
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Reconfigurable logic and neuromorphic devices are crucial for the development of high-performance computing. However, creating reconfigurable devices based on conventional complementary metal–oxide–semiconductor technology is challenging due to the limited field-effect characteristics of the fundamental silicon devices. Here we show that a homojunction device made from two-dimensional tungsten diselenide can exhibit diverse field-effect characteristics controlled by polarity combinations of the gate and drain voltage inputs. These electrically tunable devices can achieve reconfigurable multifunctional logic and neuromorphic capabilities. With the same logic circuit, we demonstrate a 2:1 multiplexer, D-latch and 1-bit full adder and subtractor. These functions exhibit a full-swing output voltage and the same supply and signal voltage, which suggests that the devices could be cascaded to create complex circuits. We also show that synaptic circuits based on only three homojunction devices can achieve reconfigurable spiking-timing-dependent plasticity and pulse-tunable synaptic potentiation or depression characteristics; the same function using complementary metal–oxide–semiconductor devices would require more than ten transistors. A homojunction device made from two-dimensional tungsten diselenide can be used to create circuits that exhibit multifunctional logic and neuromorphic capabilities with simpler designs than conventional silicon-based systems.
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Ultrathin ferroelectric materials could potentially enable low-power perovskite ferroelectric tetragonality logic and nonvolatile memories1,2. As ferroelectric materials are made thinner, however, the ferroelectricity is usually suppressed. Size effects in ferroelectrics have been thoroughly investigated in perovskite oxides—the archetypal ferroelectric system3. Perovskites, however, have so far proved unsuitable for thickness scaling and integration with modern semiconductor processes4. Here we report ferroelectricity in ultrathin doped hafnium oxide (HfO2), a fluorite-structure oxide grown by atomic layer deposition on silicon. We demonstrate the persistence of inversion symmetry breaking and spontaneous, switchable polarization down to a thickness of one nanometre. Our results indicate not only the absence of a ferroelectric critical thickness but also enhanced polar distortions as film thickness is reduced, unlike in perovskite ferroelectrics. This approach to enhancing ferroelectricity in ultrathin layers could provide a route towards polarization-driven memories and ferroelectric-based advanced transistors. This work shifts the search for the fundamental limits of ferroelectricity to simpler transition-metal oxide systems—that is, from perovskite-derived complex oxides to fluorite-structure binary oxides—in which ‘reverse’ size effects counterintuitively stabilize polar symmetry in the ultrathin regime. Enhanced switchable ferroelectric polarization is achieved in doped hafnium oxide films grown directly onto silicon using low-temperature atomic layer deposition, even at thicknesses of just one nanometre.
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Ferroelectric field-effect transistors (FeFETs) are one of the most interesting ferroelectric devices; however, they, usually suffer from low interface quality. The recently discovered 2D layered ferroelectric materials, combining with the advantages of van der Waals heterostructures (vdWHs), may be promising to fabricate high-quality FeFETs with atomically thin thickness. Here, dual-gated 2D ferroelectric vdWHs are constructed using MoS2 , hexagonal boron nitride (h-BN), and CuInP2 S6 (CIPS), which act as a high-performance nonvolatile memory and programmable rectifier. It is first noted that the insertion of h-BN and dual-gated coupling device configuration can significantly stabilize and effectively polarize ferroelectric CIPS. Through this design, the device shows a record-high performance with a large memory window, large on/off ratio (107 ), ultralow programming state current (10-13 A), and long-time endurance (104 s) as nonvolatile memory. As for programmable rectifier, a wide range of gate-tunable rectification behavior is observed. Moreover, the device exhibits a large rectification ratio (3 × 105 ) with stable retention under the programming state. This demonstrates the promising potential of ferroelectric vdWHs for new multifunctional ferroelectric devices.
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Ferroelectric field-effect transistors employ a ferroelectric material as a gate insulator, the polarization state of which can be detected using the channel conductance of the device. As a result, the devices are potentially of use in non-volatile memory technology, but they suffer from short retention times, which limits their wider application. Here, we report a ferroelectric semiconductor field-effect transistor in which a two-dimensional ferroelectric semiconductor, indium selenide (α-In2Se3), is used as the channel material in the device. α-In2Se3 was chosen due to its appropriate bandgap, room-temperature ferroelectricity, ability to maintain ferroelectricity down to a few atomic layers and its potential for large-area growth. A passivation method based on the atomic layer deposition of aluminium oxide (Al2O3) was developed to protect and enhance the performance of the transistors. With 15-nm-thick hafnium oxide (HfO2) as a scaled gate dielectric, the resulting devices offer high performance with a large memory window, a high on/off ratio of over 108, a maximum on current of 862 μA μm−1 and a low supply voltage. A ferroelectric semiconductor field-effect transistor, which uses the two-dimensional ferroelectric semiconductor α-In2Se3 as a channel material, could offer enhanced capabilities compared with conventional ferroelectric field-effect transistors in non-volatile memory applications.
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Memristive devices have been extensively demonstrated for applications in nonvolatile memory, computer logic, and biological synapses. Precise control of the conducting paths associated with the resistance switching in memristive devices is critical for optimizing their performances including ON/OFF ratios. Here, gate tunability and multidirectional switching can be implemented in memristors for modulating the conducting paths using hexagonal α‐In2Se3, a semiconducting van der Waals ferroelectric material. The planar memristor based on in‐plane (IP) polarization of α‐In2Se3 exhibits a pronounced switchable photocurrent, as well as gate tunability of the channel conductance, ferroelectric polarization, and resistance‐switching ratio. The integration of vertical α‐In2Se3 memristors based on out‐of‐plane (OOP) polarization is demonstrated with a device density of 7.1 × 10⁹ in.⁻² and a resistance‐switching ratio of well over 10³. A multidirectionally operated α‐In2Se3 memristor is also proposed, enabling the control of the OOP (or IP) resistance state directly by an IP (or OOP) programming pulse, which has not been achieved in other reported memristors. The remarkable behavior and diverse functionalities of these ferroelectric α‐In2Se3 memristors suggest opportunities for future logic circuits and complex neuromorphic computing.
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The need for continuous size downscaling of silicon transistors is driving the industrial development of strategies to enable further footprint reduction1,2. The atomic thickness of two-dimensional materials allows the potential realization of high-area-efficiency transistor architectures. However, until now, the design of devices composed of two-dimensional materials has mimicked the basic architecture of silicon circuits3–6. Here, we report a transistor based on a two-dimensional material that can realize photoswitching logic (OR, AND) computing in a single cell. Unlike the conventional transistor working mechanism, the two-dimensional material logic transistor has two surface channels. Furthermore, the material thickness can change the logic behaviour—the architecture can be flexibly expanded to achieve in situ memory such as logic computing and data storage convergence in the same device. These devices are potentially promising candidates for the construction of new chips that can perform computing and storage with high area-efficiency and unique functions.
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High‐density memory is integral in solid‐state electronics. 2D ferroelectrics offer a new platform for developing ultrathin electronic devices with nonvolatile functionality. Recent experiments on layered α‐In2Se3 confirm its room‐temperature out‐of‐plane ferroelectricity under ambient conditions. Here, a nonvolatile memory effect in a hybrid 2D ferroelectric field‐effect transistor (FeFET) made of ultrathin α‐In2Se3 and graphene is demonstrated. The resistance of the graphene channel in the FeFET is effectively controllable and retentive due to the electrostatic doping, which stems from the electric polarization of the ferroelectric α‐In2Se3. The electronic logic bit can be represented and stored with different orientations of electric dipoles in the top‐gate ferroelectric. The 2D FeFET can be randomly rewritten over more than 10⁵ cycles without losing the nonvolatility. The approach demonstrates a prototype of rewritable nonvolatile memory with ferroelectricity in van der Waals 2D materials.
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2D ferroelectric material has emerged as an attractive building block for high‐density data storage nanodevices. Although monolayer van der Waals ferroelectrics have been theoretically predicted, a key experimental breakthrough for such calculations is still not realized. Here, hexagonally stacking α‐In2Se3 nanoflake, a rarely studied van der Waals polymorph, is reported to exhibit out‐of‐plane (OOP) and in‐plane (IP) ferroelectricity at room temperature. Ferroelectric multidomain states in a hexagonal α‐In2Se3 nanoflake with uniform thickness can survive to 6 nm. Most strikingly, the electric‐field‐induced polarization switching and hysteresis loop are, respectively, observed down to the bilayer and monolayer (≈1.2 nm) thicknesses, which designates it as the thinnest layered ferroelectric and verifies the corresponding theoretical calculation. In addition, two types of ferroelectric nanodevices employing the OOP and IP polarizations in 2H α‐In2Se3 are developed, which are applicable for nonvolatile memories and heterostructure‐based nanoelectronics/optoelectronics. The thinnest layered ferroelectric is demonstrated for the first time at room temperature. The semiconducting hexagonal α‐In2Se3 nanoflakes exhibit out‐of‐plane and in‐plane ferroelectricity that are closely intercorrelated. The polarization switching and hysteresis loops can be realized in the thickness as thin as ≈2.3 nm (bilayer) and ≈1.2 nm (monolayer). Two types of ferroelectric switchable devices are proposed to show the potential application in nonvolatile memories.
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Van der Waals (vdW) assembly of layered materials is a promising paradigm for creating electronic and opto-electronic devices with novel properties. Ferroelectricity in vdW layered materials could enable nonvolatile memory and low-power electronic and optoelectronic switches, but to date, few vdW ferroelectrics have been reported, and few in-plane vdW ferroelectrics are known. We report the discovery of in-plane ferroelectricity in a widely investigated vdW layered material, b′-In 2 Se 3. The in-plane ferroelectricity is strongly tied to the formation of one-dimensional superstructures aligning along one of the threefold rotational symmetric directions of the hexagonal lattice in the c plane. Surprisingly, the superstructures and ferroelectricity are stable to 200°C in both bulk and thin exfoliated layers of In 2 Se 3. Because of the in-plane nature of ferroelectricity, the domains exhibit a strong linear dichroism, enabling novel polarization-dependent optical properties.
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Interest in two-dimensional (2D) van der Waals materials has grown rapidly across multiple scientific and engineering disciplines in recent years. However, ferroelectricity, the presence of a spontaneous electric polarization, which is important in many practical applications, has rarely been reported in such materials so far. Here we employ first-principles calculations to discover a branch of the 2D materials family, based on In2Se3 and other III2-VI3 van der Waals materials, that exhibits room-temperature ferroelectricity with reversible spontaneous electric polarization in both out-of-plane and in-plane orientations. The device potential of these 2D ferroelectric materials is further demonstrated using the examples of van der Waals heterostructures of In2Se3/graphene, exhibiting a tunable Schottky barrier, and In2Se3/WSe2, showing a significant band gap reduction in the combined system. These findings promise to substantially broaden the tunability of van der Waals heterostructures for a wide range of applications.
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Mechanical exfoliation has been a key enabler of the exploration of the properties of two-dimensional materials, such as graphene, by providing routine access to high-quality material. The original exfoliation method, which remained largely unchanged during the past decade, provides relatively small flakes with moderate yield. Here, we report a modified approach for exfoliating thin monolayer and few-layer flakes from layered crystals. Our method introduces two process steps that enhance and homogenize the adhesion force between the outermost sheet in contact with a substrate: Prior to exfoliation, ambient adsorbates are effectively removed from the substrate by oxygen plasma cleaning; and an additional heat treatment maximizes the uniform contact area at the interface between the source crystal and the substrate. For graphene exfoliation, these simple process steps increased the yield and the area of the transferred flakes by more than 50 times compared to the established exfoliation methods. Raman and AFM characterization shows that the graphene flakes are of similar high quality as those obtained in previous reports. Graphene field-effect devices were fabricated and measured with back-gating and solution top-gating, yielding mobilities of ~4000 cm2/Vs and 12000 cm2/Vs, respectively and thus demonstrating excellent electrical properties. Experiments with other layered crystals, e.g., a bismuth strontium calcium copper oxide (BSCCO) superconductor, show enhancements in exfoliation yield and flake area similar to those for graphene, suggesting that our modified exfoliation method provides an effective way for producing large area, high-quality flakes of a wide range of 2D materials.
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Recently, several emerging technologies have been reported as potential candidates for controllable ambipolar devices. Controllable ambipolarity is a desirable property that enables the on-line configurability of n-type and p-type device polarity. In this paper, we introduce a new design methodology for logic gates based on controllable ambipolar devices, with an emphasis on carbon nanotubes as the candidate technology. Our technique results in ambipolar gates with a higher expressive power than conventional complementary metal-oxidesemiconductor (CMOS) libraries. We propose a library of static ambipolar carbon nanotube field effect transistor (CNTFET) gates based on generalized NOR-NAND-AOI-OAI primitives, which efficiently implements XOR-based functions. Technology mapping of several multi-level logic benchmarks that extensively use the XOR function, including multipliers, adders, and linear circuits, with ambipolar CNTFET logic gates indicates that on average, it is possible to reduce the number of logic levels by 42%, the delay by 26%, and the power consumption by 32%, resulting in a energy-delay-product (EDP) reduction of 59 % over the same circuits mapped with unipolar CNTFET logic gates. Based on the projections in [1], where it is stated that defectfree CNTFETs will provide a 5x performance improvement over metal-oxide-semiconductor field effect transistors, the ambipolar library provides a performance improvement of 7x, a 57% reduction in power consumption, and a 20x improvement in EDP over the CMOS library.
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Two-dimensional materials are attractive for use in next-generation nanoelectronic devices because, compared to one-dimensional materials, it is relatively easy to fabricate complex structures from them. The most widely studied two-dimensional material is graphene, both because of its rich physics and its high mobility. However, pristine graphene does not have a bandgap, a property that is essential for many applications, including transistors. Engineering a graphene bandgap increases fabrication complexity and either reduces mobilities to the level of strained silicon films or requires high voltages. Although single layers of MoS(2) have a large intrinsic bandgap of 1.8 eV (ref. 16), previously reported mobilities in the 0.5-3 cm(2) V(-1) s(-1) range are too low for practical devices. Here, we use a halfnium oxide gate dielectric to demonstrate a room-temperature single-layer MoS(2) mobility of at least 200 cm(2) V(-1) s(-1), similar to that of graphene nanoribbons, and demonstrate transistors with room-temperature current on/off ratios of 1 × 10(8) and ultralow standby power dissipation. Because monolayer MoS(2) has a direct bandgap, it can be used to construct interband tunnel FETs, which offer lower power consumption than classical transistors. Monolayer MoS(2) could also complement graphene in applications that require thin transparent semiconductors, such as optoelectronics and energy harvesting.
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The discovery of ferroelectricity in oxides that are compatible with modern semiconductor manufacturing processes, such as hafnium oxide, has led to a re-emergence of the ferroelectric field-effect transistor in advanced microelectronics. A ferroelectric field-effect transistor combines a ferroelectric material with a semiconductor in a transistor structure. In doing so, it merges logic and memory functionalities at the single-device level, delivering some of the most pressing hardware-level demands for emerging computing paradigms. Here, we examine the potential of the ferroelectric field-effect transistor technologies in current embedded non-volatile memory applications and future in-memory, biomimetic and alternative computing models. We highlight the material- and device-level challenges involved in high-volume manufacturing in advanced technology nodes (≤10 nm), which are reminiscent of those encountered in the early days of high-K-metal-gate transistor development. We argue that the ferroelectric field-effect transistors can be a key hardware component in the future of computing, providing a new approach to electronics that we term ferroelectronics.
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Overcoming the sub-5 nm gate length limit and decreasing the power dissipation are two main objects in the electronics research field. Besides advanced engineering techniques, considering new material systems may be helpful. Here, we demonstrate two-dimensional (2D) subthermionic field-effect transistors (FETs) with sub-5 nm gate lengths based on ferroelectric (FE) van der Waals heterostructures (vdWHs). The FE vdWHs are composed of graphene, MoS2, and CuInP2S6 acting as 2D contacts, channels, and ferroelectric dielectric layers, respectively. We first show that the as-fabricated long-channel device exhibits nearly hysteresis-free subthermionic switching over three orders of magnitude of drain current at room temperature. Further, we fabricate short-channel subthermionic FETs using metallic carbon nanotubes as effective gate terminals. A typical device shows subthermionic switching over five-to-six orders of magnitude of drain current with a minimum subthreshold swing of 6.1 mV/dec at room temperature. Our results indicate that 2D materials system is promising for advanced highly-integrated energy-efficient electronic devices.
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Ionic floating-gate memories Digital implementations of artificial neural networks perform many tasks, such as image recognition and language processing, but are too energy intensive for many applications. Analog circuits that use large crossbar arrays of synaptic memory elements represent a low-power alternative, but most devices cannot update the synaptic weights uniformly or scale to large array sizes. Fuller et al. developed an integrated device, ionic floating-gate memory, that has the gate terminal of a redox transistor electrically connected to a diffusive memristor. This low-power device enabled linear and symmetric weight updates in parallel over an entire crossbar array at megahertz rates over 10 ⁹ write-read cycles. Science , this issue p. 570
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Modern computers are based on the von Neumann architecture in which computation and storage are physically separated: data are fetched from the memory unit, shuttled to the processing unit (where computation takes place) and then shuttled back to the memory unit to be stored. The rate at which data can be transferred between the processing unit and the memory unit represents a fundamental limitation of modern computers, known as the memory wall. In-memory computing is an approach that attempts to address this issue by designing systems that compute within the memory, thus eliminating the energy-intensive and time-consuming data movement that plagues current designs. Here we review the development of in-memory computing using resistive switching devices, where the two-terminal structure of the devices, their resistive switching properties, and direct data processing in the memory can enable area- and energy-efficient computation. We examine the different digital, analogue, and stochastic computing schemes that have been proposed, and explore the microscopic physical mechanisms involved. Finally, we discuss the challenges in-memory computing faces, including the required scaling characteristics, in delivering next-generation computing. This Review Article examines the development of in-memory computing using resistive switching devices.
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Out-of-plane ferroelectricity with a high transition temperature in ultrathin films is important for the exploration of new domain physics and scaling down of memory devices. However, depolarizing electrostatic fields and interfacial chemical bonds can destroy this long-range polar order at two-dimensional (2D) limit. Here we report the experimental discovery of the locking between out-of-plane dipoles and in-plane lattice asymmetry in atomically thin In2Se3 crystals, a new stabilization mechanism leading to our observation of intrinsic 2D out-of-plane ferroelectricity. Through second harmonic generation spectroscopy and piezoresponse force microscopy, we found switching of out-of-plane electric polarization requires a flip of nonlinear optical polarization that corresponds to the inversion of in-plane lattice orientation. The polar order shows a very high transition temperature (∼700 K) without the assistance of extrinsic screening. This finding of intrinsic 2D ferroelectricity resulting from dipole locking opens up possibilities to explore 2D multiferroic physics and develop ultrahigh density memory devices.
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Spintronic and multiferroic systems are leading candidates for achieving attojoule-class logic gates for computing, thereby enabling the continuation of Moore's law for transistor scaling. However, shifting the materials focus of computing towards oxides and topological materials requires a holistic approach addressing energy, stochasticity and complexity.
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Enriching the functionality of ferroelectric materials with visible-light sensitivity and multiaxial switching capability would open up new opportunities for their applications in advanced information storage with diverse signal manipulation functions. We report experimental observations of robust intra-layer ferroelectricity in two-dimensional (2D) van der Waals layered -In2Se3 ultrathin flakes at room temperature. Distinct from other 2D and conventional ferroelectrics, In2Se3 exhibits intrinsically intercorrelated out-of-plane and in-plane polarization, where the reversal of the out-of-plane polarization by a vertical electric field also induces the rotation of the in-plane polarization. Based on the in-plane switchable diode effect and the narrow bandgap (~1.3 eV) of ferroelectric In2Se3, a prototypical non-volatile memory device, which can be manipulated both by electric field and visible light illumination, is demonstrated for advancing data storage technologies.
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A memristor is a resistive device with an inherent memory. The theoretical concept of a memristor was connected to physically measured devices in 2008 and since then there has been rapid progress in the development of such devices, leading to a series of recent demonstrations of memristor-based neuromorphic hardware systems. Here, we evaluate the state of the art in memristor-based electronics and explore where the future of the field lies. We highlight three areas of potential technological impact: on-chip memory and storage, biologically inspired computing and general-purpose in-memory computing. We analyse the challenges, and possible solutions, associated with scaling the systems up for practical applications, and consider the benefits of scaling the devices down in terms of geometry and also in terms of obtaining fundamental control of the atomic-level dynamics. Finally, we discuss the ways we believe biology will continue to provide guiding principles for device innovation and system optimization in the field.
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The computing demands of future data-intensive applications will greatly exceed the capabilities of current electronics, and are unlikely to be met by isolated improvements in transistors, data storage technologies or integrated circuit architectures alone. Instead, transformative nanosystems, which use new nanotechnologies to simultaneously realize improved devices and new integrated circuit architectures, are required. Here we present a prototype of such a transformative nanosystem. It consists of more than one million resistive random-access memory cells and more than two million carbon-nanotube field-effect transistors—promising new nanotechnologies for use in energy-efficient digital logic circuits and for dense data storage—fabricated on vertically stacked layers in a single chip. Unlike conventional integrated circuit architectures, the layered fabrication realizes a three-dimensional integrated circuit architecture with fine-grained and dense vertical connectivity between layers of computing, data storage, and input and output (in this instance, sensing). As a result, our nanosystem can capture massive amounts of data every second, store it directly on-chip, perform in situ processing of the captured data, and produce ‘highly processed’ information. As a working prototype, our nanosystem senses and classifies ambient gases. Furthermore, because the layers are fabricated on top of silicon logic circuitry, our nanosystem is compatible with existing infrastructure for silicon-based technologies. Such complex nano-electronic systems will be essential for future high-performance and highly energy-efficient electronic systems.
Article
Layered materials have been found to be the promising candidates for next-generation microelectronic and optoelectronic devices due to their unique electrical and optical properties. The p-n junction is an elementary building block for microelectronics and optoelectronics devices. Herein, using pulsed-laser deposition (PLD) method, we achieve the self-assembly of the lateral p-n heterojunction of In2Se3/CuInSe2 film. In comparison to the intrinsic In2Se3 one, the photodetectors based on the In2Se3/CuInSe2 heterojunction exhibit a tremendous promotion of photodetection performance and obvious rectifying behavior. The photoresponsivity and external quantum efficiency (EQE) of the fabricated heterojunction based device under 532 nm light irradiation are 20.1 A/W and 4698%, respectively. These values are about 7.5 times higher than those of pure In2Se3 devices. We attribute this promotion of photodetection to the suitable band structures of In2Se3 and CuInSe2, which greatly promote the separation of photoexcited electron-hole pairs. This work suggests an effective way to form lateral p-n junction, opening up a new scenario for designing and constructing high performance optoelectronic devices.
Conference Paper
Our challenge is clear: The drive for performance and the end of voltage scaling have made power, and not the number of transistors, the principal factor limiting further improvements in computing performance. Continuing to scale compute performance will require the creation and effective use of new specialized compute engines, and will require the participation of application experts to be successful. If we play our cards right, and develop the tools that allow our customers to become part of the design process, we will create a new wave of innovative and efficient computing devices.
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Hysteretic resistance effects based on a correlation between ferroelectric polarization and conductivity might become of particular interest for nonvolatile memory applications, because they are not subject to the scaling restrictions of charge based memories such as the ferroelectric random access memory. Two basic concepts, a metal-ferroelectric-metal structure and a metal-ferroelectric-semiconductor structure are discussed in the literature. This contribution discusses the principle of operation of those concepts in terms of the band model. A generalized model is proposed, which is based on a conductive metal-ferroelectric-semiconductor-metal structure. Here, the existence of a low and a high conductive state originates from a switch of the polarization in the ferroelectric layer and a resulting positive or negative polarization charge at the ferroelectric-semiconductor interface. Charge carriers in the film are attracted by or depleted at the interface giving rise to different local conductivities. By simulation, the effect of internal screening caused by mobile charge carriers on the hysteretic current-voltage behavior and the depolarizing field in the ferroelectric are estimated. The simulation discloses a switching ratio up to several orders of magnitude and a conductivity window, which scales with the donor concentration. It may also explain resistive switching in systems consisting only of one ferroelectric layer by assuming the presence of nonferroelectric interface layers.
Article
Single-transistor ferroelectric field effect transistor offers attractive features for future memory applications, such as scalable cell structure, high speed, and low power consumption. However, its relatively short retention time has prevented its application as a non-volatile memory. In order to investigate its retention mechanism, we have developed an automatic retention measurement technique, which enables direct flatband voltage tracking shortly after programming. Two mechanisms, based on the effects of the depolarization field and the gate leakage followed by trapping, respectively, have been identified responsible for the memory window loss in different time regimes, according to the data obtained from this technique.
Article
We developed a model with no adjustable parameter for retention loss at short and long time scales in ferroelectric thin-film capacitors. We found that the predictions of this model are in good agreement with the experimental observations in the literature. In particular, it explains why a power-law function shows better fitting than a linear-log relation on a short time scale ( 10<sup>-7</sup> s to 1 s) and why a stretched exponential relation gives more precise description than a linear-log plot on a long time scale (≫100 s ) , as reported by many researchers in the past. More severe retention losses at higher temperatures and in thinner films have also been correctly predicted by the present theory.
Article
Over the past 30 years electronic applications have been dominated by complementary metal oxide semiconductor (CMOS) devices. These combine p- and n-type field effect transistors (FETs) to reduce static power consumption. However, CMOS transistors are limited to static electrical functions, i.e., electrical characteristics that cannot be changed. Here we present the concept and a demonstrator of a universal transistor that can be reversely configured as p-FET or n-FET simply by the application of an electric signal. This concept is enabled by employing an axial nanowire heterostructure (metal/intrinsic-silicon/metal) with independent gating of the Schottky junctions. In contrast to conventional FETs, charge carrier polarity and concentration are determined by selective and sensitive control of charge carrier injections at each Schottky junction, explicitly avoiding the use of dopants as shown by measurements and calculations. Besides the additional functionality, the fabricated nanoscale devices exhibit enhanced electrical characteristics, e.g., record on/off ratio of up to 1 × 10(9) for Schottky transistors. This novel nanotransistor technology makes way for a simple and compact hardware platform that can be flexibly reconfigured during operation to perform different logic computations yielding unprecedented circuit design flexibility.
Article
The authors of the International Technology Roadmap for Semiconductors-the industry consensus set of goals established for advancing silicon integrated circuit technology-have challenged the computing research community to find new physical state variables (other than charge or voltage), new devices, and new architectures that offer memory and logic functions beyond those available with standard transistors. Recently, ultra-dense resistive memory arrays built from various two-terminal semiconductor or insulator thin film devices have been demonstrated. Among these, bipolar voltage-actuated switches have been identified as physical realizations of 'memristors' or memristive devices, combining the electrical properties of a memory element and a resistor. Such devices were first hypothesized by Chua in 1971 (ref. 15), and are characterized by one or more state variables that define the resistance of the switch depending upon its voltage history. Here we show that this family of nonlinear dynamical memory devices can also be used for logic operations: we demonstrate that they can execute material implication (IMP), which is a fundamental Boolean logic operation on two variables p and q such that pIMPq is equivalent to (NOTp)ORq. Incorporated within an appropriate circuit, memristive switches can thus perform 'stateful' logic operations for which the same devices serve simultaneously as gates (logic) and latches (memory) that use resistance instead of voltage or charge as the physical state variable.
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A breakthrough in materials could refresh and sustain the information technology revolution.
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A silicone-based one-transistor nonvolatile memory cell has been implemented by integration of a ferroelectric polymer gate on a standard n- type metal oxide semiconductor field effect transistor. The polarization reversal in the gate results in a stable and reproducible memory effect changing the source-drain current by a factor 102–103, with the retention exceeding 2–3 days. Analysis of the drain current relaxation and time- resolved study of the spontaneous polarization via piezoforce scanning probe microscopy indicates that the retention loss is controlled by the interface- adjacent charge injection rather than the polarization instability. A semiquantitative model describes the time-dependent retention loss characterized by an exponential decay of the open state current of the transistor. The unique combination of properties of the ferroelectric copolymer of vinylidene fluoride and trifluoroethylene, including an adequate spontaneous polarization and low dielectric constant as well as rather benign processing demands, makes this material a promising candidate for memories fully compatible with silicon technology.
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A Schottky contact consisting of a semiconducting ferroelectric material and a high work function metal shows a bistable conduction characteristic. An on/off ratio of about 2 orders of magnitude was obtained in a structure consisting of a 0.2 μm ferroelectric PbTiO3 film, a Au Schottky contact, and a La0.5Sr0.5CoO3 Ohmic bottom electrode. The observations are explained by a model in which the depletion width of the ferroelectric Schottky diode is determined by the polarization dependence of the internal electric field at the metal-ferroelectric interface.
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Long viewed as a topic in classical physics, ferroelectricity can be described by a quantum mechanical ab initio theory. Thin-film nanoscale device structures integrated onto Si chips have made inroads into the semiconductor industry. Recent prototype applications include ultrafast switching, cheap room-temperature magnetic-field detectors, piezoelectric nanotubes for microfluidic systems, electrocaloric coolers for computers, phased-array radar, and three-dimensional trenched capacitors for dynamic random access memories. Terabit-per-square-inch ferroelectric arrays of lead zirconate titanate have been reported on Pt nanowire interconnects and nanorings with 5-nanometer diameters. Finally, electron emission from ferroelectrics yields cheap, high-power microwave devices and miniature x-ray and neutron sources.
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Integrated electronics has come a long way since the invention of the transistor in 1947 and the fabrication of the first integrated circuit in 1958. Given feature sizes as small as a few nanometres, what will the future hold for integrated electronics?
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It is well-known that conventional field effect transistors (FETs) require a change in the channel potential of at least 60 mV at 300 K to effect a change in the current by a factor of 10, and this minimum subthreshold slope S puts a fundamental lower limit on the operating voltage and hence the power dissipation in standard FET-based switches. Here, we suggest that by replacing the standard insulator with a ferroelectric insulator of the right thickness it should be possible to implement a step-up voltage transformer that will amplify the gate voltage thus leading to values of S lower than 60 mV/decade and enabling low voltage/low power operation. The voltage transformer action can be understood intuitively as the result of an effective negative capacitance provided by the ferroelectric capacitor that arises from an internal positive feedback that in principle could be obtained from other microscopic mechanisms as well. Unlike other proposals to reduce S, this involves no change in the basic physics of the FET and thus does not affect its current drive or impose other restrictions.
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In principle, a memory field-effect transistor (FET) based on the metal-ferroelectric-semiconductor gate stack could be the building block of an ideal memory technology that offers random access, high speed, low power, high density and nonvolatility. In practice, however, so far none of the reported ferroelectric memory transistors has achieved a memory retention time of more than a few days, a far cry from the ten-year retention requirement for a nonvolatile memory device. This work will examine two major causes of the short retention (assuming no significant mobile ionic charge motion in the ferroelectric film): 1) depolarization field and 2) finite gate leakage current. A possible solution to the memory retention problem will be suggested, which involves the growth of single-crystal, single domain ferroelectric on Si. The use of the ferroelectric memory transistor as a capacitor-less DRAM cell will also be proposed.
Ferroelectricity in hafnium oxide thin films
  • Boescke
Programmable nanowire circuits for nanoprocessors
  • Yan