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Design of Vertically Stacked Waveguide Filters in LTCC

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This paper proposes four-pole quasi-elliptic function bandpass waveguide filters using multilayer low-temperature co-fired ceramic technology. The vertical metal walls of the waveguide resonators are realized by closely spaced metallic vias. Adjacent cavities are coupled by a narrow slot at the edge of the common broad wall or an inductive window on the sidewall. Two types of vertical coupling structures are utilized to achieve the cross coupling between nonadjacent resonators at different layers. With multilayer capability, there is more flexibility to arrange the cavities of coupled resonator filters in 3-D space. It is demonstrated by both the simulation and experiment that the proposed filter structures occupy a compact circuit area and have good selectivity. The filter with electric field cross coupling occupies a half area of a planar four-pole waveguide filter, while the filter with stacked vias cross coupling has 65% size reduction in comparison with a planar waveguide filter.
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IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 55, NO. 8, AUGUST 2007 1771
Design of Vertically Stacked
Waveguide Filters in LTCC
Tze-Min Shen, Chi-Feng Chen, Ting-Yi Huang, and Ruey-Beei Wu, Senior Member, IEEE
Abstract—This paper proposes four-pole quasi-elliptic function
bandpass waveguide filters using multilayer low-temperature
co-fired ceramic technology. The vertical metal walls of the
waveguide resonators are realized by closely spaced metallic vias.
Adjacent cavities are coupled by a narrow slot at the edge of
the common broad wall or an inductive window on the sidewall.
Two types of vertical coupling structures are utilized to achieve
the cross coupling between nonadjacent resonators at different
layers. With multilayer capability, there is more flexibility to
arrange the cavities of coupled resonator filters in 3-D space.
It is demonstrated by both the simulation and experiment that
the proposed filter structures occupy a compact circuit area and
have good selectivity. The filter with electric field cross coupling
occupies a half area of a planar four-pole waveguide filter, while
the filter with stacked vias cross coupling has 65% size reduction
in comparison with a planar waveguide filter.
Index Terms—Bandpass filter, cavity, coupling coefficient, low-
temperature co-fired ceramic (LTCC), stacked vias, quasi-elliptic
function.
I. INTRODUCTION
M
ODERN microwave communication systems require
high-performance bandpass filters with high selectivity,
low insertion loss, and compact size. Filters with a waveguide
structure can offer low loss and a high quality (
) factor, but
usually at the price of large size, heavy weight, and high cost.
The manufacturing of the waveguide also needs sufficient
accuracy in order to operate at the millimeter-wave frequency.
Recently, the concept of synthesized rectangular waveguide
structures [1] has attracted much interest. The waveguide is
dielectric filled and embedded into a substrate. The sidewall
of the rectangular waveguide can be realized by arrays of
metallic via or metallic grooves. This kind of waveguide not
only maintains a good
factor, but also suits the realization
of high-performance bandpass filters at the millimeter-wave
frequency regime.
Several direct-coupled cavity filters have been realized by
the synthesized waveguide structures on flip-chip modules [2],
printed circuit board [3], and thick-film technology [4]. These
filters usually occupy a large circuit area because of the planar
arrangement of the resonators. With the mature multilayer tech-
nology, synthesized waveguide filters are also fabricated on a
Manuscript received February 6, 2007; revised May 10, 2007. This work was
supported in part by the National Science Council, Taiwan, R.O.C., under Grant
NSC 93-2752-E-002-003-PAE and Grant NSC 94-2219-E-002-001 and by the
Industrial Technology Research Institute.
The authors are with the Department of Electrical Engineering and Grad-
uate Institute Communication Engineering, National Taiwan University, Taipei,
10617 Taiwan, R.O.C. (e-mail: rbwu@ew.ee.ntu.edu.tw).
Digital Object Identifier 10.1109/TMTT.2007.902080
low-temperature co-fired ceramic (LTCC) technology [5] and
micromachined process [6]. Multilayer filter technology pro-
vides significant benefits in terms of design flexibility and den-
sity. This makes vertical coupling between resonators possible
and cavities can be piled up in 3-D space, which will largely re-
duce the circuit area.
Frequency selectivity is also an essential feature of a high-
performance filter. Quasi-elliptic or elliptic filters will have
transmission zeros at finite frequencies and give more im-
proved stopband rejection than conventional direct-coupled
filters [7]–[9]. Such filter responses can be realized with cross
coupling between nonadjacent resonators [10]. The zeros are
then obtained by means of destructive interference between the
different signal path connecting the input and output ports [11].
Recently, a conventional parallel coupled microstrip filter with
a transmission line inserted inverter for realization of different
advanced filtering characteristics was presented in [12]. With
the additional cross-coupled transmission line, there is greater
flexibility in the arrangement of the cross coupling path to
achieve the desired frequency response.
In this paper, quasi-elliptic bandpass filters with a cross-cou-
pling architecture are developed in the multilayered LTCC tech-
nology, as shown in Figs. 1 and 2. An open-ended microstrip
line is used to excite the filters by a narrow slot etched on the
first/last cavity. The LTCC resonators can be stacked three-di-
mensionally to provide various coupling mechanisms required
in the design of quasi-elliptic bandpass filters, while achieving
compact sizes and good selectivity. The cross coupling between
nonadjacent resonators is achieved by a square aperture at the
center of the common wall in Fig. 1 or by additional stacked vias
and short-circuited coplanar waveguides (CPWs) in Fig. 2.
This paper is organized as follow. Section II describes the
key design parameters required to realize the quasi-elliptic
filter. Section III introduces several coupling structures and the
relation of coupling coefficients versus physical dimensions.
Section IV provides two design examples. The experiment data
are presented and compared with simulation results. Finally,
some brief conclusions are drawn in Section V.
II. F
ILTER DESIGN
A general coupling structure of a quasi-elliptic filter is de-
picted in Fig. 3 [10], where each node represents a resonator, and
the solid and dashed lines indicate the main and cross-coupling
paths, respectively. It is essential that the signs of the coupling
coefficients
and are opposite in order to
realize a pair of attenuation poles at the finite frequencies. This
means that the coupling routes of
and
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1772 IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 55, NO. 8, AUGUST 2007
Fig. 1. Structure of a four-pole quasi-elliptic waveguide lter in a multilayer
conguration. (a) 3D overview. (b) Side view.
(a)
(b)
Fig. 2. Structure of a vertically stacked quasi-elliptic waveguide lter. (a) 3-D
overview. (b) Side view.
need to be out of phase. However, it does not matter which one
is positive or negative, as long as their signs are opposite.
Fig. 3. General coupling structure of a quasi-elliptic lter.
The design parameters of bandpass lters, i.e., the coupling
coefcients and the external
factor in Fig. 3, can be deter-
mined in terms of the circuit elements of a low-pass prototype
lter [13].
After determining the required coupling coefcients and ex-
ternal
factor, the relationship between coupling coefcients
and physical structures of coupled resonators should be estab-
lished in order to determine the physical dimensions of the lter
against the design parameters. The coupling coefcients of cou-
pled resonators can be specied by two split resonate frequen-
cies resulting from electromagnetic coupling [14], i.e.,
(1)
In (1),
and are dened to be the lower and higher res-
onance frequencies, respectively. The sign of the coupling co-
efcient is dependent on the physical structure of the coupled
resonators. For lter design, the meaning of positive or negative
coupling is rather relative. The positive and negative coupling
will have an opposite phase response, which can be found by
the
-parameter of the coupling structure.
The external
factor can be characterized by [13]
(2)
where
and represent the resonance frequency and the
3-dB bandwidth of the input or output resonator. By (1) and
(2), design curves of the coupling coefcients and external
factor versus physical dimensions of coupled resonators can be
established. The sizes of coupling structures are also obtained
according to the design parameters.
III. R
EALIZATION OF COUPLING
COEFFICIENTS
A. LTCC Cavity Resonator
The cavity resonator is formed by several stacked dielectric
substrate with metal surfaces at the outer layers and via arrays
as vertical sidewalls, which is shown in Fig. 4. The resonant
frequencies of the cavity with a perfectly conducting wall can
be obtained by [15]
(3)
where
is the relative dielectric constant, is the speed of light,
and are the width, height, and length of the cavity, respec-
tively, and
and are the indices of the resonant mode. By
(3), the initial dimensions of the synthesized waveguide cavity
can be determined, and the nal values are optimized by the
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SHEN et al.: DESIGN OF VERTICALLY STACKED WAVEGUIDE FILTERS IN LTCC 1773
Fig. 4. Cavity resonator with metallic plates and via arrays.
Fig. 5. Field patterns of mode of a single rectangular cavity. (a) Electric
eld. (b) Magnetic eld. (c) Surface current on the metal plane.
eigenmode solution solver of a full-wave simulator, e.g., the
High Frequency Structure Simulator (HFSS). Besides, the
factor of a cavity resonator increases with the cavity height. To
get a higher
cavity, more substrate layers will be used to form
a synthesized cavity according to the fabrication limitation.
The cavity resonators in Figs. 1 and 2 operate in their funda-
mental mode
at a common center frequency. Fig. 5 shows
the eld patterns. The electric eld is mainly concentrated at
the center of the cavity and in the direction normal to the metal
plane. The magnetic eld is tangential to the metallic walls and
rotates in the cavity. The magnetic eld increases its strength
gradually when approaching the sidewalls. The surface current
will ow into the center of the metal plate in a radial shape.
Next, several structures of coupled resonators in LTCC tech-
nology are introduced. The cavities in the same layer are cou-
pled by an inductive window, while the cavities between dif-
ferent layers are coupled by a square aperture in the center of
Fig. 6. Coupling coefcients of the slot coupling structure.
the common wall, a narrow slot at the edge of the common wall,
or an additional thru via.
B. Magnetic Coupling by Broad-Wall Slots
To efciently couple two adjacent cavities in different layers,
a narrow slot in the common intermediate wall is placed near
the sidewalls of the cavity and in the direction perpendicular to
the surface current. It will signicantly interrupt the surface cur-
rent ow and introduce strong coupling, analogous to the design
principle of waveguide slot antenna [16]. Hence, the coupling
between adjacent cavities can be achieved by means of mag-
netic elds through the narrow slot in the common wall.
The coupling coefcient is affected by the length and position
of the narrow slot. To get strong direct coupling, the narrow
slot should be located as close to the sidewall of the cavity as
possible. The coupling strength is then controlled by the slot
length. Fig. 6 shows the relation between the slot length and
coupling coefcients of the stacked cavities. As mentioned in
Section II, the coupling coefcients are calculated by two split
resonate frequencies, which can be obtained by an eigenmode
solution solver of HFSS. Each cavity resonates at 31 GHz, with
the cavity size
mm and the
relative dielectric constant
. According to fabrication
limitation, the slot is located 0.2 mm from the cavity sidewall.
Due to the presence of the slot, the length of each cavity
should be adjusted to compensate for the shifted resonant fre-
quency [2].
will be the difference between the original cavity
length
and the modied cavity length for the frequency
compensation. The relation between the coupling coefcients
and the variation of the cavity length is also plotted in Fig. 6.
Both the adjustments in slot length and cavity length are nor-
malized to the cavity width
in Fig. 6.
C. Magnetic Coupling by Narrow-Wall Window
The pair of vias composing the inductive window are used
to control the coupling of the cavities at the same layer. It is a
common coupling structure in the planar waveguide lter [3].
The coupling strength is controlled by the separation of the via
pair. The wider the separation, the stronger the coupling can be.
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1774 IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 55, NO. 8, AUGUST 2007
Fig. 7. Coupling coefcient of the inductive window coupling structure.
Fig. 8. Coupling coefcients of the square aperture coupling structure.
Fig. 7 shows the relation of coupling coefcients versus the via
pitch (VP) and the cavity length variation
.
D. Electric Coupling by Broad-Wall Aperture
If a square aperture is opened at the center of two stacked
cavities, where the electric eld is a maximum, the coupling can
be achieved in terms of an electric eld normal to the aperture.
Fig. 8 shows the aperture length (AL) and cavity length devi-
ation
, which are both normalized to cavity width , versus
the coupling coefcients.
E. Cross Coupling by Vias Connecting Nonadjacent Cavities
As shown in Fig. 2, the rst and last cavities are coupled by an
additional through via, which provides the cross-coupling path
to achieving a quasi-elliptic frequency response [17]. The cross-
coupling structure is mainly formed by short-circuited CPW
feed lines with a main thru-hole via and two shorter buried vias
beside the main through via. The CPW feed lines are connected
to the rst and last resonators and the main thru-hole via is con-
nected to the CPW feed lines.
In the LTCC process, the electric eld of a grounded CPW is
mainly concentrated under the signal line because of the small
Fig. 9. Via coupling structure. (a) Overview. (b) Coupling coefcient.
substrate height and wide gap. The electric eld distribution of
a grounded CPW will be similar to that of
of a cavity
resonator and, therefore, energy can be gathered from the cavity
easily with a CPW feed line. The energy will pass down along
the main thru via and couple to the other cavity connected to the
CPW feed line. Two shorter buried vias provide current return
paths when energy is delivering.
The coupling coefcient between the rst and last cavities can
be extracted by a very weak excitation with the same method de-
scribed in [2]. Two split resonant frequencies can be seen clearly
from the
-parameter of the coupled resonators structure. The
strength of the cross coupling can be controlled by the length
of the CPW stretched into a cavity. When the short-circuited
end of the CPW is closer to the center of the cavity where the
electric eld is strongest, more energy can be gathered from the
resonator. The relation between the coupling coefcient and the
CPW length is shown in Fig. 9. The coupling coefcient basi-
cally increases with the CPW length.
Fig. 10 plots the
-parameter of coupled resonators with a
slot coupling structure and a via coupling structure. By com-
paring the phase responses in Fig. 10(a) and (b), it is clear that
they are out-of-phase. That is to say, two extracted coupling co-
efcients have opposite signs [18]. Therefore, slot coupling and
via coupling structures can be used to realize a quasi-elliptic
lter.
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SHEN et al.: DESIGN OF VERTICALLY STACKED WAVEGUIDE FILTERS IN LTCC 1775
Fig. 10. Phase response of coupled resonators. (a) Slot coupling structure.
(b) Via coupling structure.
IV. DESIGN EXAMPLES AND EXPERIMENTAL VERIFICATION
Next, two kinds of cross coupling structures are utilized to
realize the four-pole quasi-elliptic lters. When designing the
lters, perfect conductor sidewalls are assumed for calculation
efciency. Based on the above procedure, the initial dimensions
of the coupling slots, aperture, and inductive window are de-
cided. The cavities sizes with small variation are also known.
The entire lter structure is then optimized by HFSS to meet
the design specication. After the initial design of the lter is
accomplished, the metallic via arrays take the place of the per-
fect conductor sidewalls to complete the lter design.
A. Feeding Structure
The lter is excited by open-ended microstrip lines, as shown
in Fig. 1. The slot discontinuity at the return path of the mi-
crostrip line causes strong coupling for the same reason that
waveguide slot antenna radiates. To maximize the magnetic cou-
pling, a virtual short is placed at the center of each slot by using a
quarter-wavelength open stub beyond the slots center [19]. This
kind of feeding structure can not only avoid dc power loss, but
Fig. 11. External factor of the microstrip line feeding structure.
also contribute to fabrication simplicity. The external
factor
of the feeding structure is controlled by the external slot length
and position. Fig. 11 shows the relation of the external
factor
versus the slot length
and the cavity length variation .
B. Basic Stacked LTCC Filters Design
A canonical waveguide lter with coupling between nonadja-
cent cavities can be utilized to achieve an elliptic-function lter
response [20]. The cross couplings are achieved by a circle at
the center of the common wall or by a narrow slot at the edge
of the cavity. In the same concept, a quasi-elliptic lter realized
by LTCC technology is presented here.
The conguration of the basic stacked LTCC lter is shown
in Fig. 1. The coupling produced by means of electric and mag-
netic elds have opposite signs [21]; therefore, the lter archi-
tecture of Fig. 1 will conform to the general coupling structure
in Fig. 3, which results in a quasi-elliptic frequency response.
The four-pole quasi-elliptic waveguide lter is designed and
fabricated in LTCC. The specication of the lter is 10% frac-
tional bandwidth centered at 31 GHz with 20-dB passband re-
turn loss. The element values of the low-pass prototype lter
are found to be
and . By [13], the coupling coefcients
and I/O external
factor are
(4)
The relative dielectric constant of the substrate is 7.8 and its loss
tangent is 0.0078 at 30 GHz. The thickness of each metal layer
is 13
m and the dielectric layer thickness between two metal
layers is 50
m. The cavity height is 250 m, while the mi-
crostrip substrate height is 150
m. The via diameter is 100 m.
To allow on-wafer measurement by coplanar probes, the input
and output probe pad should be on the same layer. Therefore, a
vertical transition composed of thru-hole vias is utilized to con-
nect the bottom microstrip line to the top layer. Eight grounded
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1776 IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 55, NO. 8, AUGUST 2007
Fig. 12. (a) Hole structure of a four-pole quasi-elliptic waveguide lter with a
vertical transition. (b) Fabricated lter.
Fig. 13. Geometric parameters of the quasi-elliptic lter.
vias are located around the thru-hole via to mimic a coaxial
transmission line effect.
Fig. 12(a) shows the whole lter conguration and Fig. 12(b)
is a photograph of the fabricated lter. Geometric parameters
of the lter are illustrated in Fig. 13 and summarized in Table I.
The overall size of the four-pole quasi-elliptic LTCC waveguide
lter without the vertical transition is 4.46
2.72 0.8 mm ,
i.e., approximately
, where is the
guided wavelength on the substrate at the center frequency. A
full-wave simulator HFSS is used to calculate the
factor of a
cavity. The
factor is found to be approximately 103, which is
similar to the measured data of approximately 99.
The frequency response of the lter is shown in Fig. 14, where
the solid and dashed lines denote the measured and simulated re-
sults, respectively. The dasheddotted lines represent the ideal
TABLE I
G
EOMETRIC
PARAMETERS OF
THE QUASI-ELLIPTIC
FILTER
Fig. 14. Simulation and measurement results of the four-pole quasi-elliptic
LTCC bandpass lter.
circuit response. The simulation result is not fully identical with
the theoretical response. It can be contributed to the replacement
of vertical sidewalls of the cavities by via arrays in LTCC and the
vertical transitions for on-wafer measurement. When the perfect
sidewalls are substituted by the via arrays, the major difference
is the in-band return loss. This may be contributed to the varia-
tions in the coupling coefcients and external
factors, which
make the frequency response deviated from that by the theo-
retical one. When the vertical transition is taken into consider-
ation, The major discrepancy is the deterioration at the higher
frequency side of the passband.
The measured center frequency of the lter is 30.9 GHz and
the 3-dB bandwidth is 3.85 GHz. The passband insertion loss is
approximately 2.55 dB and the passband return loss is greater
than 12 dB. Two attenuation poles near the cutoff frequencies of
the passband can be clearly identied. The two attenuation poles
are located at 28.2 and 34 GHz. The measured results are in good
agreement with the full-wave simulation results by HFSS.
C. Fully Stacked LTCC Filters Design
The lter in Fig. 2 introduces a novel structure composed
of vertically stacked cavities to realize a quasi-elliptic function
lter. The conguration is re-plotted in Fig. 15, composed of
four vertically stacked synthesized rectangular cavities. Adja-
cent cavities are coupled to each other by a narrow slot near the
edge of the common wall. The cross-coupling path is realized
by short-circuited CPW feed lines connected to the rst and last
resonators with a main thru-hole via connection.
A vertically stacked four-pole quasi-elliptic waveguide lter
is designed and fabricated by the same LTCC process in the pre-
vious design example. The dimensions of other coupling slots
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SHEN et al.: DESIGN OF VERTICALLY STACKED WAVEGUIDE FILTERS IN LTCC 1777
Fig. 15. Layer sketch of a fully stacked quasi-elliptic waveguide lter without
via arrays.
Fig. 16. (a) Entire structure of a fully stacked four-pole quasi-elliptic wave-
guide lter with a vertical transition. (b) Fabricated lter.
and cavities can be determined under the same design guide.
Here, the specication of the lter is 10% fractional bandwidth
centered at 30.2 GHz with 20-dB passband return loss. Same el-
ement values of the low-pass prototype lter in the previous ex-
ample are used. The coupling coefcients and external
factor
are equal to (4) because the same fractional bandwidth is chosen.
The whole lter conguration and the photograph of the fab-
ricated lter are shown in Fig. 16. The cavity height is 150
m.
The microstrip line substrate height is 100
m. To simplify
the measurement, the input microstrip line at the top layer will
feed the lter from the opposite direction. A vertical transi-
tion connecting microstrip lines at the top and bottom layers is
used for on-wafer measurement, as mentioned in the previous
example. Geometric parameters of the lter are illustrated in
Fig. 17. Geometric parameters of the vertically stacked quasi-elliptic lter.
(a) Top view of the rst and fourth cavity. (b) Top view of the second and third
cavity.
TABLE II
G
EOMETRIC
PARAMETERS OF THE VERTICALLY
STACKED QUASI-ELLIPTIC FILTER
Fig. 17 and summarized in Table II. The size of the vertically
stacked four-pole quasi-elliptic LTCC waveguide lter without
the vertical transition is 3.67
2.4 0.8 mm , i.e., approxi-
mately
.
The frequency response of the lter is shown in Fig. 18, where
the solid and dashed lines denote measured and simulated re-
sults, respectively. The dasheddotted lines represent the ideal
circuit response. The measured center frequency of the lter is
29.5 GHz and the 3-dB bandwidth is 3.93 GHz. The passband
insertion loss is approximately 2.8 dB and the passband return
loss is greater than 12 dB. The two attenuation poles are located
at 26.85 and 33.05 GHz. The measured center frequency has
down shifted approximately 2% as compared to the simulation
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1778 IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 55, NO. 8, AUGUST 2007
Fig. 18. Simulation and measurement results of the vertically stacked four-pole
quasi-elliptic LTCC bandpass lter.
result. This may be contributed to the smaller LTCC shrinkage
due to more metal plates used in this lter conguration. There-
fore, the cavities are bigger than expected and will result in the
down-shifted center frequency.
V. C
ONCLUSION
New structures have been proposed to realize the various cou-
pling mechanisms required for quasi-elliptic bandpass lters de-
sign using stacked LTCC cavities. The idea has been validated
by presenting two four-pole quasi-elliptic function bandpass l-
ters in LTCC. Several coupling mechanisms between adjacent
and nonadjacent resonators have been described in details. By
this multilayer technology, the vertical coupling between cavi-
ties at different layers can be achieved and the lters will have
compact size as compared to the conventional planar lters.
The lter with the electric eld cross-coupling structure ap-
proximately occupies the size of two cavities, while the footprint
of the lter with fully stacked cavities and cross-coupling via
structure can achieve nearly 65% size reduction as compared to
the conventional planar four-pole waveguide lters. The cross
coupling between nonadjacent resonators is introduced to ex-
hibit a single pair of transmission zeros near the passband at
nite frequencies and, thus, much better selectivity. As a result,
the proposed structures of the lters occupy a compact circuit
area and have a good stopband response.
A
CKNOWLEDGMENT
The authors would like to thank Dr. H.-H. Lin, C.-L. Wang,
and C.-C. Chuang, all with the Computer and Communica-
tion Laboratory, Institute of Technology Industrial Research,
Hsinchu, Taiwan, R.O.C., for their help in the fabrication and
measurement of the LTCC lters.
R
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cies, IEEE Trans. Microw. Theory Tech., vol. 48, no. 7, pp. 10981107,
Jul. 2000.
[14] J. S. Hong and M. J. Lancaster, Couplings of microstrip square open-
loop resonator for cross-couple planar microwave lters,IEEE Trans.
Microw. Theory Tech., vol. 44, no. 12, pp. 20992109, Dec. 1996.
[15] D. M. Pozar, Microwave Engineering, 2nd ed. New York: Wiley,
1998, ch. 6.
[16] R. S. Elliott, Antenna Theory and Design. New York: Wiley, 2003,
ch. 3.
[17] T.-M. Shen, T.-Y. Huang, C.-F. Chen, and R.-B. Wu, Design of a ver-
tically stacked waveguide lter with novel cross coupling structures in
LTCC, in Asia–Pacific Microw. Conf. Dig., Dec. 2006, pp. 11611164.
[18] J. S. Hong and M. J. Lancaster, Microstrip Filter for RF/Microwave
Application. New York: Wiley, 2001, ch. 8.5.
[19] M. J. Hill, J. Papapolymerou, and R. W. Ziolkowski, High-
mi-
cromachined resonant cavities in a
-band diplexer conguration,in
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148, no. 5, pp. 307312.
[20] A. E. Atia and A. E. Williams, Nonminimum-phase optimum-ampli-
tude bandpass waveguide lters, IEEE Trans. Microw. Theory Tech.,
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[21] T. Shen, H.-T. Shu, K. A. Zaki, and A. E. Atia, Full-wave design
of canonical waveguide lter by optimization, IEEE Trans. Microw.
Theory Tech., vol. 51, no. 2, pp. 504511, Feb. 2003.
Tze-Min Shen was born in Chiayi, Taiwan, R.O.C.,
on August 5, 1981. He received the B.S. degree in
electrical engineering and M.S. degree in communi-
cation engineering from National Taiwan University,
Taipei, Taiwan, R.O.C., in 2004 and 2006, respec-
tively, and is currently working toward the Ph.D.
degree in communication engineering at National
Taiwan University.
His research interests is the design of microwave
lters.
Authorized licensed use limited to: National Taiwan University. Downloaded on February 25, 2009 at 01:50 from IEEE Xplore. Restrictions apply.
SHEN et al.: DESIGN OF VERTICALLY STACKED WAVEGUIDE FILTERS IN LTCC 1779
Chi-Feng Chen was born in PingTung, Taiwan,
R.O.C., on September 3, 1979. He received the
B.S. degree in physics from Chung Yuan Christian
University, Taoyuan, Taiwan, R.O.C., in 2001, the
M.S. degree in electrophysics from National Chiao
Tung University, Hsinchu, Taiwan, R.O.C., in 2003,
and the Ph.D. degree in communication engineering
from National Taiwan University, Taipei, Taiwan,
R.O.C., in 2006.
His research interests include the design of
microwave lters and associated RF modules for
microwave and millimeter-wave applications.
Ting-Yi Huang was born in Hualien, Taiwan,
R.O.C., on November 12, 1977. He received the B.S.
degree in electrical engineering and M.S. degree in
communication engineering from National Taiwan
University, Taipei, Taiwan, R.O.C., in 2000 and
2002, respectively, and is currently working toward
the Ph.D. degree in communication engineering at
National Taiwan University.
His research interests include computational elec-
tromagnetics, the design of microwave lters, transi-
tions, and associated RF modules for microwave and
millimeter-wave applications.
Ruey-Beei Wu (M91SM97) was born in Tainan,
Taiwan, R.O.C., on October 27, 1957. He received
the B.S.E.E. and Ph.D. degrees from National Taiwan
University, Taipei, Taiwan, R.O.C., in 1979 and 1985,
respectively.
In 1982, he joined the faculty of the Department of
Electrical Engineering, National Taiwan University,
where he is currently a Professor. He is also with the
Graduate Institute of Communications Engineering,
which was established in 1997. From March 1986 to
February 1987, he was a Visiting Scholar with IBM,
East Fishkill, NY. From August 1994 to July 1995, he was with the Electrical
Engineering Department, University of California at Los Angeles. He was ap-
pointed the Director of the National Center for High-Performance Computing
from May 1998 to April 2000 and the Directorate General of Planning and Eval-
uation Division from November 2002 to July 2004, both under the National Sci-
ence Council. Since August 2005, he has been Chairperson of the Department
of Electrical Engineering, National Taiwan University. He has authored or coau-
thored over 150 papers in international journals or conferences. He served as an
Associate Editor of the
Journal of Chinese Institute of Electrical Engineering in
1996. His research interests include computational electromagnetics, transmis-
sion line and waveguide discontinuities, microwave and millimeter-wave planar
circuits, and interconnection modeling for computer packaging.
Dr. Wu is a member Phi Tau Phi and the Chinese Institute of Electrical
Engineers. He has been an associate editor for the IEEE T
RANSACTIONS ON
MICROWAVE
THEORY AND
TECHNIQUES
since 2005. He is an elected Executive
Committee member of the IEEE Microwave Theory and Techniques Society
(IEEE MTT-S) Taipei Chapter. He is an elected Executive Committee member
of the Institute of United Radio Science (URSI) Taipei Section. He was the
recipient of the Distinguished Research Award presented by the National
Science Council (1990, 1993, 1995, and 1997) and the Outstanding Electrical
Engineering Professor Award presented by the Chinese Institute of Electrical
Engineers (1999).
Authorized licensed use limited to: National Taiwan University. Downloaded on February 25, 2009 at 01:50 from IEEE Xplore. Restrictions apply.
... However, few design technologies of millimeter-wave BPFs can successfully balance the fabrication cost and filtering performance, such as low in-band loss and high selectivity. So far, numerous millimeter-wave BPFs based on various technologies have been reported [4], [5], [6], [7], [8], [9], [10], [11], [12], [13], [14], [15]. Among them, the SiGe/GaAs/silicon-based millimeter-wave BPFs [4], [5], [6], [7], [8] have undeniably small sizes, which can be naturally integrated with on-chip radio frequency circuits and front ends for the miniaturization of wireless communication systems. ...
... On the other hand, the substrate integrated waveguide (SIW) technology was employed for the design of millimeter-wave BPFs [9], [10], [11], [12], which could be fabricated on commercial single-layer or multilayer printed circuit board (PCB) with low cost. Moreover, some millimeter-wave BPFs based on low-temperature cofired ceramic (LTCC) technology were reported to realize the miniaturized sizes [13], [14], [15]. Unfortunately, the multilayer filter structure design was complicated, and the fabrication cost was also relatively high. ...
Article
A class of millimeter-wave E-plane waveguide bandpass filters (BPFs) based on spoof surface plasmon polaritons (SSPPs) have been presented in this article. Three kinds of SSPPs, with different patterns coated on the dielectric substrate, are inserted into the E-plane of WR-10 standard rectangular waveguide for the design of BPFs. To clarify the filtering characteristics of the proposed BPFs, the dispersive properties of different SSPP unit cells are investigated and discussed. The electromagnetic simulation results demonstrate that the bandwidths and center frequencies of the proposed E-plane waveguide BPFs can be flexibly adjusted by controlling the asymptotic frequencies of SSPP unit cells. For verifying the design feasibility, these three E-plane waveguide BPFs are fabricated and measured. Good agreement between measurements and simulations indicates that the proposed idea will be a good candidate for the BPF design with low insertion loss and flexible adjustment of center frequency and bandwidth.
... Figure I-13-Vue de dessus du filtre 4 pôles quasi-elliptique [20] Il est fabriqué sur un substrat LTCC (ε r =7,1, tan δ=0,0019). Il est centré à 62 GHz avec des T-M Shen [21] ...
... Figure I-15-Vue 3D du filtre -simulations et mesures de la réponse fréquentielle [21] Sur la Figure I Aucune extrémité des vias métalliques n'est connectée aux deux plans de masse ce qui nous donne un résonateur en circuit ouvert. Ce résonateur est fabriqué en technologie LTCC, il est centré à 45,5 GHz et présente un facteur de qualité mesuré de 230 ( Figure I-17). ...
Thesis
Ce mémoire est consacré au développement de technologies de filtrage novatrices qui apportent un gain en performance permettant de répondre aux besoins de filtrage pour télécommunications spatiales à moyen et long termes. Il s’inscrit dans le projet ANR ATOMIQ coordonné par Thales Alenia Space ayant comme partenaires le laboratoire SPCTS et la société 3D CERAM. Le premier chapitre est constitué d’une étude bibliographique sur les filtres en bande Q et V ainsi que les technologies de fabrication 3D. Le deuxième chapitre est consacré à l’élaboration d’une nouvelle formulation d’alumine très pure à faible pertes et stable en température. Le troisième chapitre présente une conception de filtres hyperfréquences en bande Q et V à base de cavités résonantes diélectriques. Le quatrième chapitre concerne la fabrication des filtres par usinage en cru ainsi que la présentation des différents démonstrateurs fabriqués par stéréolithographie et moulage basse pression. Il présente aussi des solutions de correction post-fabrication par tir laser. Ce travail est original par l’utilisation de la stéréolithographie céramique 3D ainsi que du moulage basse pression pour fabriquer des filtres hyperfréquences de petites tailles en bande Q et V.
... Miniaturization is always needed in the development of RF, microwave, and mmW components, devices, and systems, particularly in the design of gigahertz circuits and THz chips. Since the first invention and latter developments of SIW techniques [146], [147], [148], [149], [150], much efforts have already been invested in the miniaturization arts of SIW structures, basically embracing multilayered topologies using LTCC technology [151], modal partition techniques using half-/quarter-to 1/n th -mode SIW schemes based on modal symmetry theory [152], [153], [154], [155], folded [156], [157] and ridged [158], [159] SIW techniques, metamaterial and metasurface structures-loaded SIW solutions through lefthanded and right-handed combinations [160], and slow-wave effects [161], as the few examples listed in Fig. 18. Some of these schemes have also been applied to design miniaturized SIW multiband BPFs and multiplexers, such as using LTCCbased multilayered configurations [40], [62], [69], [73], [75], [111], [131], partial-mode techniques [53], [64], [82], [90], [94], [105]- [107], [128], folded [25] and ridged [32] schemes, and metamaterial cells-based solutions [33], [34], [35], [36], [37], [49], [50], [51], [52], [53]. ...
Article
Full-text available
Multiband bandpass filters (BPFs) and multiplexers are essential front-end modules in the development of multifunction, multistandard, and multiband wireless communication, sensing, and positioning systems that are required in current and future intelligent electronics applications. In this paper, numerous implementation schemes and topologies of multiband BPFs and multiplexers, which have been proposed, studied, and developed so far, are holistically summarized and elaborated in terms of their merits and drawbacks. Subsequently, various technical approaches and diverse design methodologies based on substrate integrated waveguide (SIW) technology are thoroughly examined and reviewed with respect to technical features, electrical performances, and practical applications. Finally, future research and development directions and prospects of SIW multiband BPFs and multiplexers are briefly unraveled.
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This letter presents our study on a compact and low-loss E-band bandpass filter (BPF) based on multilayer groove gap waveguide (GGW). Different from other reported planar GGW filters and vertically stacked substrate integrated waveguide (SIW) filters, the proposed filter realizes a cross-coupled quadruplet topology by introducing a pair of unique circular capacitive holes across layers, innovative ridges (capacitive iris), and conventional inductive irises on the same layer, which reduces the insertion loss (IL) while having a smaller size. By tuning the dimensions of the coupling structures and cavities, the filter is optimized to exhibit a superior performance in simulation. The designed filter is fabricated using CNC machining and verified in experiment. The measured results agree with the simulated ones quite well, showing an average IL of 0.45 dB and an 8% relative 3-dB bandwidth at a center frequency of 73.65 GHz. Therefore, the proposed multilayer GGW structure opens a new avenue in designing high-performance filters in millimeter-wave bands.
Article
This letter proposes a novel trisection filter by stacking three substrate-integrated waveguide (SIW) cavities vertically. The trisection topology can be divided into two cascaded second-order topologies in the vertical direction, which can make the filter structure more compact. Moreover, two transmission zeros can be controlled independently by changing the signs of coupling coefficients between the adjacent stacked SIW cavities. Finally, a third-order filter sample is fabricated using printed circuit board (PCB) technology, and the measured S-parameters have good agreement with the simulated ones.
Article
This work presents an approach to developing dual-mode dual-band substrate integrated waveguide (SIW) bandpass filter based on multilayer process. TE102/TE201 and TE101/TE102 modes are used to feature the two passbands, respectively. To begin with, large range of band location ratios are decided by the effective dimension of the SIW resonator. With reference to the field distribution, independent coupling schemes of the dual-modes are then realized by slots or circular apertures etched on the middle metal layer. It allows to not only introduce a large design freedom of bandwidth but also keep compactness. Finally, source-load and mixed couplings are deployed to produce transmission zeros around the passband in providing a sharp selectivity in the two filters, respectively. The details to independently control the center frequencies and bandwidth of two passbands are also presented. A two-order double-layered and a triple-layered SIW dual-band bandpass filter are prototyped to evaluate the proposed design approach, respectively. Results show a good agreement between simulations and measurements. The proposed filter exhibits flexible design freedom, high selectivity as well as good out-of-band rejection.
Article
In this paper, a new transversal configuration is presented for waveguide bandpass filters (BPFs) on stacked rectangular H-plane waveguide cavities. Different from the conventional ladder BPFs, cavities constituting the proposed transversal BPFs are arrayed in a stacked manner. Odd- and even-mode resonators of transversal BPF are realized by TE₁₀₁ and TE₁₀₂ modes of rectangular H-plane waveguides, respectively. Using the configuration proposed herein, the realization of an Nth-order filter could be decomposed into realizations of N first-order subfilters, and each subfilter could be realized independently, which is guaranteed by the unique array of resonators of transversal filters. Therefore, the complexity of realizing BPFs could be reduced, especially for filters with multiple transmission zeros (TZs). A class of transversal filters, including BPFs and dual-band filter, are synthesized, fabricated, and measured to verify the approach.
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Full-text available
Microwave diplexers are often used in transmit/receive systems to isolate a power transmit stage from a sensitive receive stage sharing a common antenna. For efficient bandwidth usage and optimum antenna performance, the transmit/receive frequencies are typically placed close together in the frequency spectrum. With today's requirements for high performance, small-size wireless devices, diplexers exhibiting close channel spacing, low insertion loss and small channel bandwidths are increasingly necessary. Utilising two high-Q micromachined silicon cavity resonators, a planar K-band diplexer has been designed, fabricated and tested. This diplexer shows transmit/receive bandwidths of 1.11 and 1.53% and insertion losses of 1.4 and 1.0 dB, respectively. Channel centre frequencies of 18.64 and 20.47 GHz provide a channel separation of approximately 9%, and channel-to-channel isolation greater than 26 dB over the entire measured frequency range. The diplexer can be accessed via microstrip lines and can be easily integrated with other planar circuits and structures, such as mixers, amplifiers, oscillators and patch antennas. The proposed design is the first step towards a more mature multi-pole diplexer with enhanced overall performance
Book
First published in 1981, Robert S. Elliott’s Antenna Theory and Design is one of the most significant works in electromagnetic theory and applications. In its broad-ranging, analytic treatment, replete with supporting experimental evidence, Antenna Theory and Design conveys fundamental methods of analysis that can be used to predict the electromagnetic behavior of nearly everything that radiates. After more than two decades, it remains a key resource for students, professors, researchers, and engineers who require a comprehensive, in-depth treatment of the subject. In response to requests from many of our members, IEEE is now reissuing this classic. Newly revised, it once again will be an invaluable textbook and an enduring reference for practicing engineers. The IEEE Press Series on Electromagnetic Wave Theory offers outstanding coverage of the field. It consists of new titles of contemporary interest as well as reissues and revisions of recognized classics by established authors and researchers. The series emphasizes works of long-term archival significance in electromagnetic waves and applications. Designed specifically for graduate students, researchers, and practicing engineers, the series provides affordable volumes that explore and explain electromagnetic waves beyond the undergraduate level. © 2003 by the Institute of Electronics & Electrical Engineers. All rights reserved.
Conference Paper
A new waveguide structure for millimeter wave has been developed. It is a dielectric waveguide, with conductor walls consisting of two lined via-holes, herein referred to as the "laminated waveguide." Applications for the laminated waveguide include antenna feed lines.
Conference Paper
CAD of rectangular waveguide filters with elliptic responses is described. The configuration uses capacitive and inductive irises in order to achieve the different coupling signs required to synthesize finite transmission zeros in the rejection bands. The input and output ports are realized by a coaxial probe that directly excites the input/output cavities. The analysis is done by the efficient mode-matching method, in order to allow a final full-wave optimization taking into account all the higher order mode interactions. The CAD results are verified with the HFSS and a filter was manufactured for testing.
Conference Paper
A canonical LTCC ridge waveguide filter for wide-band application is proposed. A new coupling scheme is employed to achieve the values of the cross couplings needed to increase the bandwidth. The change of the realization of the coupling sections from rectangular to narrow ridge waveguide is shown to eliminate detrimental undesired cross coupling. To validate the concept, rigorous mode matching method is used for full-wave analysis and optimization of a six pole filter. The response is verified with another numerical method, and a prototype is constructed for testing.
Conference Paper
This paper proposes a new cross coupling structure of a vertically stacked waveguide filter in a multilayer low-temperature co-fire ceramic technology. The filter is excited by open-ended microstrip lines. Adjacent cavities are coupled vertically by narrow slots. Cross coupling for quasi-elliptic response is realized by through vias and short-circuited CPW feed line. From the results, the circuit area of the filter can be reduced to about one single cavity size.
Conference Paper
Full-wave design of canonical waveguide filters by optimization is presented. For full-wave modeling, the filter structure is decomposed into the cascade connection of waveguide step discontinuities, waveguide T-junction discontinuities with branch waveguide cascaded with waveguide step or bifurcation discontinuities. Generalized scattering matrices of each discontinuity are obtained using the mode matching method, from which the filter response can be obtained using the cascading procedure. Interpolation tables of each discontinuity are used to speed up the optimization process. Full-wave synthesis of coupling iris dimensions is also described. A four-cavity filter design example is presented to demonstrate the feasibility of the approach
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This paper presents a recent investigation of a generalized configuration of the transmission line filter for realization of different advanced filtering characteristics that are demanded for wireless and mobile communication systems. We have demonstrated, theoretically and experimentally, several microstrip filters of this type
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This letter presents the design and experiment of a novel elliptic filter based on the multilayered substrate integrated waveguide (MSIW) technique. A C-band elliptic filter with four folded MSIW cavities is simulated by using high frequency structure simulator software and fabricated with a two-layer printed circuit board process, the measured results show good performance and in agreement with the simulated results.