The surface reaction uniformity of the copper electrode was studied by using the interfacial impedance method, and the change of the surface uniformity with the addition of various concentrations of some additives was discussed. The additives were sulfic acid, benzotriazole (BTA), gelatin, tiourea, nonyl-phenyleicosa-ethylene-glycol-ether (NP-20) and sodium chloride. According to the Cole-Cole's
... [Show full abstract] law, when the surface of the electrode was heterogeneous, the impedance diagram was semicircular with its center under the real axis. The angle, θ, between the horizontal axis and the center of the semicircle was related to the surface reaction uniformity. The uniformity was discussed in terms of Rp, θ and the time constant τ0. Rp, θ and τ0 decrease with increasing sulfic acid. With increasing additions of BTA, gelatin, tiourea and NP-20, Rp and τ0. increase and θ decrease. The increase of Rp, or τ0, suggests the decrease of the effective reaction area or the inhibition of surface reaction. With increasing additions of the additives, the reaction uniformity of the electrode surface was higher, but the activity became higher in the case of sulfic acid and lower in the case of BTA, gelatin, tiourea and so on. The above results show that the impedance method is available for assessment of the surface reaction uniformity and the surface activity.