In etch plasmas used for semiconductor processing, concentrations of the precursor gas NF3 and of the etch product SiF4 are measured online and in situ using a new diagnostic arrangement, the Q-MACS Etch system, which is based on quantum cascade laser absorption spectroscopy (QCLAS). In addition, the etch rates of SiO2 layers and of the silicon wafer are monitored including plasma-etching endpoint detection. For this purpose the Q-MACS Etch system is working as an interferometer arrangement. The experiments are performed in an industrial, dual-frequency, capacitively coupled, magnetically enhanced, reactive ion etcher (MERIE), which is a plasma reactor developed for dynamic random access memory (DRAM) technologies. In the spectral range 1028 ± 0.3 cm–1, the absorption cross-sections of SiF4 and NF3 are determined to be σ = (7.7 ± 0.7) × 10–18 cm2 molecule–1 and σ = (8.7 ± 0.8) × 10–20 cm2 molecule–1, respectively.