Yintang YangXidian University · School of Microelectronics
Yintang Yang
PhD
About
936
Publications
153,876
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8,598
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Introduction
I am a vice president of Xidian University on Research and Development. Main areas include IC design, SOC,and advanced devices.
Additional affiliations
November 1997 - present
Institute of Microelectronics
Position
- Managing Director
Description
- lead the academic research and teaching in microelectronics, faculty members about 50.
August 1984 - present
Education
March 1994 - December 1999
February 1982 - August 1984
March 1978 - January 1982
Publications
Publications (936)
This paper presents a hysteretic-current-control LED driver with the dual dimming mode. This novel monolithic driver includes an output switch and a high-side output current sensing circuit using an external resistor to set the nominal average output current (IOUTnom). By applying an external control signal to the DIM pin, it can alter flexibly the...
This article proposes a wide input voltage range DC-DC buck converter based on AOT control mode, which can be used in low-power applications such as the Internet of Things and automotive chips. It includes a zero current detector circuit that dynamically modifies the offset voltage, which can detect the inductor current when the buck circuit is ope...
In this paper, based on a 3D coarse model extraction method and the 3D convolutional neural network (3D CNN), a full-3D Artificial Intelligence(AI) method, namely C3D-CNN (Coarse 3D Convolutional Neural Network) is proposed to estimate the S-parameters and Z-parameters of interposer PDNs efficiently and accurately with TSVs considered. Three interp...
The development of high-temperature nondestructive testing (NDT) requires ultrasonic transducers with good temperature resistance and high sensitivity for improved detection efficiency. Piezoelectric composite can improve the performance of transducers because of its high electromechanical coupling coefficient and adjustable acoustic impedance. In...
The authenticated key agreement (AKA) method used in the Internet of Things (IoT) provides identity authentication and agreed symmetric keys to encrypt large amounts of communication messages for devices and servers. With the rapid development of quantum computers and quantum algorithms, classical cryptographic algorithms become vulnerable to attac...
With the wide application of packaging devices in weaponry, the reliability of packaging devices under high overload conditions has gradually become a focus of attention. In this paper, a failure rate prediction method for packaging devices based on a stress-strength interference model combined with finite element analysis and statistical methods i...
A new I-4 space group silicon allotrope is proposed in this paper. The electronics properties, mechanical properties and Ag(100)/I4Si(100) interface properties are studied using first principle calculations method. The results of the phonon show that I-4 Si is dynamically stable. Elastic constants reveal I-4 Si is dynamical stable. Electronics prop...
Optical imaging and phototherapy in deep tissues face notable challenges due to light scattering. We use encoded acoustic holograms to generate three-dimensional acoustic fields within the target medium, enabling instantaneous and robust modulation of the volumetric refractive index, thereby noninvasively controlling the trajectory of light. Throug...
With the ever-increasing integration density of electronic systems and reduced noise margins, maintaining high power integrity has become a formidable challenge in the design of high-performance 3D integrated circuits (3D ICs). To enhance power integrity, the insertion of decoupling capacitors has proven to be an important and effective solution. H...
In this research, based on the back propagation neural network (BPNN) model and particle swarm optimization with linear decreasing inertia weight (PSO-LDIW) algorithm, an electro-thermal and thermal-stress fields coupling optimization design method for coaxial through silicon via (CTSV) is provided. The irregular and complex relationship between th...
The utilization of modular chiplets in interposer-based 2.5-D heterogeneous systems simplifies fabrication and design, however, it also introduces significant noise challenges. This paper presents a collaborative jitter-aware optimization in 2.5-D integrated circuits (ICs), incorporating power supply induced jitter (PSIJ), system impedance, target...
In this paper, a co-optimization design method for thermal-stress coupling 3-dimensional integrated system with through silicon via is proposed based on the finite element method, support vector machine model and modified particle swarm optimization algorithm. In the cause of analyzing the effects of geometrical parameters (radius of through silico...
This article reports an area-power-efficient 7-bit 2-GS/s time-domain analog-to-digital converter (TD-ADC) based on a gated ring oscillator (GRO). A pulse generator (PG) with the dead-zone elimination technique is devised for maximizing the linearity of the gated signal. The GRO-based time-to-digital converter employs a robust interpolation that ef...
Enhancing the integration of directional couplers is a crucial challenge in the design of wireless communication circuits and systems. This article proposes a design strategy based on through-silicon via (TSV) insertion and neuro-transfer function (Neuro-TF) modeling to achieve miniaturization of coupled-line couplers. By embedding coupled TSV pair...
In this article, an intelligent design method of thermal through silicon via (TTSV) for thermal management of a Chiplet-based system is proposed based on the finite element method (FEM), back propagation-neural network (BP-NN) model, and particle swarm optimization (PSO) algorithm. In order to analyze the effect of design parameters of TTSV (TTSV p...
The intelligent codesign strategy is proposed to balance the thermal management and cost control for 3-D integrated system with thermal through-silicon via (TTSV). The complex relationship between the thermal performance indexes and parameters of TTSV in the 3-D integrated system is investigated by the COMSOL Multiphysics software. According to the...
With the continuous progress in integrated circuit technology, single-event effect (SEE) has become a key factor affecting the reliability of aerospace integrated circuits. Simulating fault injection using the computer simulation technique effectively reflects the SEE in aerospace integrated circuits. Due to various masking effects, only a small nu...
In this research, a high-efficiency design method of the capacitive MEMS accelerometer is proposed. As the MEMS accelerometer has high precision and a compact structure, much research has been carried out, which mainly focused on the structural design and materials selection. To overcome the inconvenience and inaccuracy of the traditional design me...
SiC/Si and GaN/Si heterojunction technology has been widely used in power semiconductor devices, and SiC/Si VDMOS and GaN/Si VDMOS were proposed in our previous paper. Based on existing research, breakdown point transfer technology (BPT) was used to optimize SiC/Si VDMOS. Simulation results showed that the BV of the SiC/Si heterojunction VDMOS was...
The simple acoustic field generated by conventional transducers limits the development of ultrasound applications. Current methods rely on passive acoustic lenses or active arrays to manipulate ultrasonic waves, but they face challenges such as low transmission efficiency with bulky morphology for lenses, and complex systems with high-cost for arra...
Spiking neural network (SNN) is a brain-inspired model with more spatio-temporal information processing capacity and computational energy efficiency. However, with the increasing depth of SNNs, the memory problem caused by the weights of SNNs has gradually attracted attention. In this study, we propose an ultra-low latency adaptive local binary spi...
In this article, an intelligent multifield collaborative optimization method of a through silicon via (TSV) array with performance constraints is proposed. The multiphysical field-coupled cosimulation of the TSV array is carried out using COMSOL and ANSYS, and the effects of design parameters (radius, oxide thickness, pitch, offset angle, and heigh...
Ultra-high frequency (>100 MHz) acoustic waves feature biocompatibility and high sensitivity and allow biomedical imaging and acoustic tweezers. Primarily, excellent spatial resolution and broad bandwidth at ultra-high frequency is the goal for pathological research and cell selection at the cellular level. Here, we propose an efficient approach to...
The piezoelectric composite is an innovative approach to enhance the performance of ultrasonic transducers. Their enhancement is reflected in broad bandwidth and high sensitivity. Recently, a multidimensional composite structure with outstanding properties has been proposed. However, the complex nonlinear relationship between composite structure pa...
Environment-friendly lead-free potassium sodium niobate-based piezoelectric materials have been widely used in acoustic device applications because of its high piezoelectric response, high Curie temperature, and low acoustic impedance. In our previous works, samarium modified 0.915(K0.45Na0.5Li0.05)NbO3–0.075BaZrO3–0.01(Bi0.5Na0.5)TiO3 (Sm–KNLN–BZ–...
In this research, an efficient thermal-stress coupling design method for a Chiplet-based system with a coaxial through silicon via (CTSV) array is developed by combining the support vector machine (SVM) model and particle swarm optimization algorithm with linear decreasing inertia weight (PSO-LDIW). The complex and irregular relationship between th...
The authenticated key agreement (AKA) method used in the Internet of Things (IoT) provides identity authentication and agreed symmetric keys to encrypt large amounts of communication messages for devices and servers. With the development of the quantum computing techniques and corresponding algroithms, classical authenticated key agreement methods...
Brain-inspired spiking neuron networks (SNNs) have attracted widespread research interest due to their low power features, high biological plausibility, and strong spatiotemporal information processing capability. Although adopting a surrogate gradient (SG) makes the non-differentiability SNN trainable, achieving comparable accuracy for ANNs and ke...
High-power microwave damage to enhanced-mode GaN high electron mobility transistors (HEMT) is studied considering the mechanical-electrical synergy effect due to the strong piezoelectric properties of GaN, which has a wurtzite crystal structure. Based on the piezoelectric constitutive equation, the mechanical and electrical energies were equivalent...
A novel unified analytical model concerning the surrounded plate field is proposed for extended drain MOSFETs (EDMOS) in this article for the first time. The SFP analytical model demonstrates the edge-assisted depletion (AD) effect and the multidimensional AD effect through the dielectric-layer (DL) potential function and 3-D Poisson equation. The...
With the increased number of vehicles, infrastructure, and demand for various road services, the traditional Internet of Vehicles (IoV) architecture fails to provide quality services to users. New frameworks combining the vehicular network with cloud computing to extend storage capacity and processing power are highly sought. The vehicles communica...
This article presents an analytical model for a thin silicon-on-insulator (SOI) device based on the enhancement of silicon critical breakdown field technology. Solving the 2-D Poisson equation in the thin drift region reasonably explains the physical mechanism that the thin silicon layer enhances the critical breakdown field of silicon material. Me...
Inspired by the optical imaging algorithm, the Fourier Ptychography (FP) algorithm is adopted to improve the resolution of ultrasonic array imaging. In the FP algorithm, the steady-state spectrum is utilized to recover the high-resolution ultrasonic images. Meanwhile, the parameters of FP algorithm are empirical, which can affect the imaging qualit...
Focused ultrasound featuring non-destructive and high sensitivity has attracted widespread attention in biomedical and industrial evaluation. However, most traditional focusing techniques focus on the design and improvement of single-point focusing, neglecting the need to carry more dimensions of multifocal beams. Here we propose an automatic multi...
A novel VDMOS with the GaN/Si heterojunction (GaN/Si VDMOS) is proposed in this letter to optimize the breakdown voltage (BV) and the specific on-resistance (Ron,sp) by Breakdown Point Transfer (BPT), which transfers the breakdown point from the high-electric-field region to the low-electric-field region and improves the BV compared with convention...
The explosive growth of the IoT continues to change the way people live, followed by a plethora of IoT-based scenarios resources and applications, such as smart homes, smart grids, and smart transportation. In these scenarios, many IoT nodes form a complex the distributed system through the network, and these devices must have synchronized clocks t...
The anti-ESD characteristic of the electronic system is paid more and more attention. Moreover, the on-chip electrostatic discharge (ESD) is necessary for integrated circuits to prevent ESD failures. In this paper, the mixed TCAD model of the ESD protection circuit is built and simulated, and the negative transmission line pulse (TLP) injection dam...
A novel Silicon Carbide gate-controlled bipolar field effect composite transistor with polysilicon region (SiC GCBTP) is proposed. Different from the traditional electrode connection mode of SiC VDMOS, the P+ region of P-well is connected with the gate in SiC GCBTP, and the polysilicon region is added between the P+ region and the gate. By this met...
Through-silicon via (TSV) provides vertical interconnectivity among the stacked dies in three-dimensional integrated circuits (3D ICs) and is a promising option to minimize 3D solenoid inductors for on-chip radio-frequencyapplications. In this paper, a rigorous analytical inductance model of 3D solenoid inductor is proposed based on the concept of...
Network on chip (NoC) is a promising solution to the challenge of multi-core System-on-Chip (SoC) communication design. Application mapping is the first and most important step in the NoC synthesis flow, which determines most of the NoC design performance. NoC mapping has been confirmed as an NP-hard (Non-Polynomial hard) problem, which could not b...
Network on chip (NoC) is the main solution to the communication bandwidth of a multi-processor system on chip (MPSoC). NoC also brings more route requirements and is highly prone to errors caused by crosstalk. Crosstalk has become a major design problem in deep-submicron NoC communication design. Hence, a crosstalk error model and corresponding rel...
As known, the piezoelectric polarization effect makes GaN HEMT have unique electrical characteristics and more widely applications compared with other III-V semiconductor devices. In this letter, a novel electromechanical coupling theory is proposed and verified for the first time for the GaN HEMT heterojunction structure by applying the mechanical...
In order to meet the requirements of high performance, miniaturization, low cost, low power consumption and multi-function, three-dimensional (3D) integrated technology has gradually become a core technology. With the development of 3D integrated technology, it has been used in imaging sensors, optical integrated microsystems, inertial sensor micro...
A substrate integrated waveguide (SIW) diplexer has been designed based on the dual-mode resonator operating with TE
<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">301</sub>
and TE
<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">103</sub>
modes in this le...
Microsystems are widely used in 5G, the Internet of Things, smart electronic devices and other fields, and signal integrity (SI) determines their performance. Establishing accurate and fast predictive models and intelligent optimization models for SI in microsystems is extremely essential. Recently, neural networks (NNs) and heuristic optimization...
In this paper, two optimized autofocusing metasurfaces (AFMs) with different desired focal distances are designed by using particle swarm optimization (PSO) algorithm. Based on the finite element simulation software COMSOL Multiphysics, the performance of ultrasound transducer (UT) with AFM at different design parameters in Airy distributions (r0,ω...
In this paper, a thermal-stress coupling optimization strategy for coaxial through silicon via (TSV) is developed based on the finite element method (FEM), artificial neural network (ANN) model and particle swarm optimization (PSO) algorithm. In order to analyze the effect of design parameters on the thermal-stress distribution of coaxial TSV, the...
We have designed 2D borocarbonitrides with outstanding material properties and potential applications in a variety of important technological fields, including nano-mechanics, electronics, photocatalysis, and photovoltaics.
Ciphertext retrieval for Cloud-based Internet of Things has been widely explored with the increasing popularity of cloud computing. However, in most existing solutions, the security and efficiency of the retrieval process are difficult to achieve simultaneously. To this end, we develop a novel secure matrix index, and we utilize identity-based encr...
Searchable encryption for Cloud-based Internet of Things has been widely explored with the increasing popularity of cloud computing. The public-key encryption with keyword search (PEKS) system support multi-user retrieval. However, the PEKS search time is linearly increasing as the index keyword number growth, and the search time would be huge if t...
As a new machine learning paradigm, Federated Learning (FL) empowers different participants to jointly train a more effective model than traditional Machine Learning (ML). Unlike Horizontal Federated Learning (HFL), which expands the sample space by aggregating local models, Vertical Federated Learning (VFL) is suitable for scenarios where the samp...
In Industry 4.0, Artificial Intelligence (AI) has been successfully applied in scenarios such as fault prediction, traffic analysis, and production decision-making. However, due to the sensitivity and security of data, privacy regulations prohibit the transfer and exchange of industrial data between entities, resulting in training data being fragme...
In this paper, we firstly reveal the performance degradation and physical failure mechanism of a lab-designed GaN power amplifier (PA) module based on a commercial GaN High-Electron-Mobility-Transistor (HEMT) with high power electromagnetic pulse injected. We carried out a systematic step pulse injection experiment to hunt out the degradation and f...
To overcome the challenges of urbanization and population growth, smart cities use cutting-edge technologies such as IoT and AI to offer improved public services. Although these advancements have brought convenience, they have raised security and privacy concerns. Blockchain technology has the potential to address these concerns, but existing block...
The smart grid, which is an important component of smart cities, is developing rapidly nowadays, while the confidentiality and integrity of consumption data of customers become significant security issues. Although existing privacy-preserving aggregation schemes reduce the communication overhead and protect the privacy of users’ multidimensional po...
In recent years, the Internet of Things (IoT) has gained immense popularity in various aspects of work, learning, and daily life. Within the Internet of Things realm, there is a growing concern regarding communication security issues between users and servers. However, addressing the communication security between servers is equally imperative, whi...
In this paper, a high-efficiency optimization design method is proposed for a two-stage Miller-compensated operational amplifier (TSMCOA). In the proposed method, the parameters and performance metrics of TSMCOA are simulated by Cadence software. Then, the neural network (NN) models are utilized to describe the relationship between its parameters a...
Aerial computing is gradually playing an essential role in edge and fog computing paradigms by virtue of mobility, availability, scalability, flexibility, and simultaneity, where the Low-altitude Computing (LAC) platform, as the end close to the data sources, is mainly responsible for data collection and storage. However, because of the long physic...
A low-profile self-triplexing antenna supported by a substrate integrated waveguide (SIW) cavity is proposed for Ku-band wireless communications. The insertion of an improved slot in the uppermetal layer of the SIW cavity provides the conditions for independent tuning and interference immunity between the three ports. To demonstrate the tuning effe...
The fine-grain of ciphertext-policy attribute-based encryption (CP-ABE) offers advantages through the amalgamation of key and user attributes; however, it also brings the issue of key misuse. To circumvent the tracking mechanisms of the white-box algorithm, malicious users manipulate the decryption key and encryption algorithm, encapsulating them t...
Ultra-wideband (UWB) technology has been applied in many fields, such as radar and indoor positioning, because of its advantages of having a high transmission rate, anti-multipath interference, and good concealment. In the UWB physical layer, the transmitting link, including an encoder and a pulse generator, is used to improve the anti-interference...
Link failure and network congestion have a serious
impact on the performance degradation of network on chip (NoC).
Adaptive routing algorithms, which have the capability of fault
tolerance and congestion awareness, can make NoCs adapt to
complex and changeable applications. The proposed algorithm in
this paper is an adaptive routing algorithm based...
This letter presents an accurate magnetic coupling coefficient (
$k$
) model for a through-silicon via (TSV)-based 3-D transformer. The
$k$
factor can be precisely derived from the self-inductance and mutual inductance, which are calculated by various analytical formulas based on physical geometries. The results of this model correspond well wit...
Interposer and chiplet-based 2.5-D integrated circuit (IC) designs have become a new trend for block-level heterogeneous integration. In this paper, a new hybrid metaheuristic algorithm named Metropolis-based differential particle swarm optimization (MDP) is designed to jointly optimize the multiconstraints and impedance-based hybrid objective func...
Wide spectrum, highly sensitive photodetectors are of great importance for many optoelectronic applications. MoS
$_{\text{2}}$
is an extremely desirable two-dimensional (2-D) material for fabricating high-performance photodetectors by forming van der Waals heterojunctions with conventional semiconductors. To address this issue, a p-i-n-type MoS
$_...
The security of Federated Learning (FL)/Distributed Machine Learning (DML) is gravely threatened by data poisoning attacks, which destroy the usability of the model by contaminating training samples, so such attacks are called causative availability indiscriminate attacks. Facing the problem that existing data sanitization methods are hard to apply...
Ciphertext-Policy Attribute-based Encryption (CP-ABE) has been used as an important access control approach to protect the data security. The data owner uploads the access policy in the form of plaintext to the cloud, potentially disclosing personal information about the data owner. Hidden-Policy CP-ABE schemes have been proposed to partially hide...
In this article, a wide stopband substrate integrated waveguide (SIW) bandpass filter (BPF) centered at 36.48 GHz with a 3-dB fabrication bandwidth (FBW) of 1.78% is presented and developed based on the orthogonal transmission techniques. Fourth-order Chebyshev filtering response with two transmission zeros (TZs) located at 35 and 41 GHz can be obt...
The high-power microwave (HPM) effect heats solar cells, which is an important component of a satellite. This creates a serious reliability problem and affects the normal operation of a satellite. In this paper, the different HPM response characteristics of two kinds of solar cells are comparatively researched by simulation. The results show that t...
In order to reduce the specific ON resistance (
$\text{R}_{\mathbf {{ \mathrm{\scriptscriptstyle ON}},sp}}$
) of power device in the drift region, the folded accumulation lateral double-diffused MOSFET (FALDMOS) is manufactured and analyzed in this article. The drift region of the FALDMOS is etched to form the folded surface, which is similar to t...
It is a significant issue in the field of semiconductor devices and optoelectronic devices to find silicon allotropes with high mobility, direct band gap and high light absorption to replace traditional diamond silicon (d-Si). By constructing a zeolite framework, fifteen silicon allotropes with a direct band gap of 0.47-1.66 eV were screened from h...
The manipulation of acoustic waves plays an important role in a wide range of applications. Currently, acoustic wave manipulation typically relies on either acoustic metasurfaces or phased array transducers. The elements of traditional metasurfaces are usually designed with complex artificial structures and limited by the additive manufacturing cap...
A physical‐based analytical model for double‐layer inductors to reduce the on‐chip area occupied is presented. A simple DC inductance model is developed based on self‐inductance and mutual inductance of metal segments. A new method has been adopted to accurately estimate the nonuniform distribution of currents due to skin and proximity effects, and...
An accurate impedance modeling of a multi-stacked on-chip power distributed network (PDN) based on through-silicon-vias (TSVs) is vitally important to estimate the electrical performance in three-dimensional integrated circuits (3D ICs). This paper proposes a method for calculating the impedance matrix of the multi-stacked on-chip PDN, which mainly...
Spiking neural networks (SNNs) can utilize spatio-temporal information and have the characteristic of energy efficiency, being a good alternative to deep neural networks (DNNs). The event-driven information processing means that SNNs can reduce the expensive computation of DNNs and save a great deal of energy consumption. However, high training and...
The application of acoustic tweezers in many fields has driven the innovation of device optimization, such as cell characterization and manipulation, drug extraction and movement. The current application of acoustic tweezers faces certain challenges because it does not enable the capture of multi-size particles. In order to improve the adaptability...
Six new SiC phases with direct bandgaps were found by replacing carbon atoms with carbon and silicon atoms with a stoichiometric ratio of 1:1 in the SACADA-Samara Carbon Allotrope Database of 522 pure carbon structures via the global search method. The six newly discovered SiC phases are in the space groups of Pccn, P4/ncc, Pmn21, P63/m, I4¯3m, and...
Currently, severe electromagnetic circumstances pose a serious threat to electronic systems. In this paper, the damage effects of a high-power electromagnetic pulse (EMP) on the GaN high-electron-mobility transistor (HEMT) were investigated in detail. The mechanism is presented by analyzing the variation in the internal distribution of multiple phy...
Mapping optimization of network-on-chips (NoCs) for specific applications has become one of the most important keys of the SoC top-level design. However, the topology of NoC applied is usually regular topology, such as mesh, torus, etc., which may generate a large number of iso-morphic solutions during the process of NoC mapping, which may reduce t...
An original concept of 3-D through-silicon via (TSV)-based Marchand baluns and its design methodology is proposed for on- chip and 3-D integration. By utilizing a 3-D packaging process that includes a TSV and redistribution layer (RDL), a meander coupling path is established and embedded in the vertical direction of the substrate for balun design....