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In this contribution, we report on a novel hybrid laser-plasma method for material processing applications. This method is based on the combination of both an ArF excimer laser (λ = 193 nm) and a low-temperature atmospheric pressure plasma jet source for the chemical reduction of glass surfaces. Here, a hydrogen-containing plasma gas was applied. Due to the layer of silicon suboxide that is generated in this vein, the absorption of the incoming machining laser beam is significantly increased after 15 minutes of plasma-treatment. Several machining experiments in terms of front-side ablation were performed on fused silica. Here, both pure and plasma-treated surfaces were ab-lated using single laser pulses with a pulse duration of 20 ns. By introducing the presented hybrid technique, the ablation threshold for micro-structuring was reduced significantly by a factor of 4.6 whereas the peak-to-valley height Rz of the machined area was decreased by a factor of 2.3. Further, back-side ablation using the presented method was considered. By a terminal tempering process, the initial transmission characteristics of fused silica can be reconstituted.
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JLMN-Journal of Laser Micro/Nanoengineering Vol. 7, No. 1, 2012
73
Hybrid Laser-Plasma Micro-Structuring of Fused Silica Based on
Surface Reduction by a Low-Temperature Atmospheric Pressure Plasma
Stephan BRÜCKNER*, Jennifer HOFFMEISTER**, Jürgen IHLEMANN***, Christoph GERHARD*, Stephan WIENEKE**
and Wolfgang VIÖL**
*Clausthal University of Technology, Institute of Energy Research and Physical Technologies, Leib-
nizstraße 4, 38678 Clausthal-Zellerfeld, Germany
**HAWK - University of Applied Sciences and Arts, Laboratory of Laser and Plasma Technologies,
Vo n -Ossietzky-Straße 99, 37085 Göttingen, Germany
***Laser Laboratory Göttingen e.V., Hans-Adolf-Krebs-Weg 1, 37077 Göttingen, Germany
E-mail: vioel@hawk-hhg.de
In this contribution, we report on a novel hybrid laser-plasma method for material processing
applications. This method is based on the combination of both an ArF excimer laser = 193 nm)
and a low-temperature atmospheric pressure plasma jet source for the chemical reduction of glass
surfaces. Here, a hydrogen-containing plasma gas was applied. Due to the layer of silicon suboxide
that is generated in this vein, the absorption of the incoming machining laser beam is significantly
increased after 15 minutes of plasma-treatment. Several machining experiments in terms of front-
side ablation were performed on fused silica. Here, both pure and plasma-treated surfaces were ab-
lated using single laser pulses with a pulse duration of 20 ns. By introducing the presented hybrid
technique, the ablation threshold for micro-structuring was reduced significantly by a factor of 4.6
whereas the peak-to-valley height Rz of the machined area was decreased by a factor of 2.3. Further,
back-side ablation using the presented method was considered. By a terminal tempering process, the
initial transmission characteristics of fused silica can be reconstituted.
Keywords: hybrid laser-plasma technology, atmospheric pressure plasma, fused silica, silicon sub-
oxide, micro-structuring
1. Introduction
Due to its specific properties, fused silica is a well-
established and suitable optical medium for the production
of a variety of optical components such as UV-transparent
optics, semiconductor devices and integrated micro-optical
elements. Regarding laser based methods for the manufac-
ture of such components, material removal of fused silica
and glasses in general can be achieved by several tech-
niques such as laser ablation using UV-, IR- or NIR-laser
radiation [1-3], or laser induced backside wet etching [4,5].
Further, laser induced etching techniques introducing UV-
absorbing films such as toluene [6] and carbon [7] or laser
induced plasma-assisted ablation [8] can be applied. Be-
yond, an indirect processing method of fused silica surfaces
consists of the vacuum deposition and laser structuring of
UV-absorbing silicon suboxide layers (SiOX) and their sub-
sequent oxidation to SiO2 [9]. Also, since fused silica con-
sists of pure silicon dioxide (SiO2), its surface can be di-
rectly reduced to silicon suboxide (SiOX, where 1<X<2) or
silicon monoxide (SiO) by applying hydrogenous gases at
high temperatures [10].
The presented hybrid laser-plasma removal method is
based on the surface reduction of fused silica by a low-
temperature atmospheric pressure plasma and a subsequent
laser ablation. To our best knowledge, this is the first work
on surface processing of fused silica using such a plasma
source. In contrast to the pulsed laser deposition met hod
(PLD) [11] or the deposition of metastable silicon suboxide
by vacuum evaporation [9], the introduced plasma gener-
ates atomic hydrogen from the used forming gas which
directly generates a suboxidal layer onto the fused silica
substrate. This effect allows a significant decrease in re-
quired energy for laser ablation of fused silica.
2. Experimental setup and experimentation
For the plasma-treatment of the investigated 2 mm-
thick fused silica samples, a low-temperature potential-free
atmospheric pressure plasma jet “kinpen 09” from neoplas
tools GmbH was applied. The plasma source was directed
perpendicular onto the sample’s surface. During the plas-
ma-treatment, the samples were moved by a xy-linear stage.
The working distance of the plasma jet nozzle to the fused
silica surface was 1 mm. In order to initialise the reduction
process, forming gas 90/10 (consisting o f 90% nitrogen and
10% hydrogen) was used as working gas. The treatment
time at each point of the sample surface was varied in the
range from 0 to 15 minutes with a gas flow rate of 25 slm.
After 5 and 15 minutes, transmission spectra (including
reflexio n lo sses) were taken in order to verify the reduction
progress with respect to a pure fused silica sample.
The subsequent laser ablation was performed after a
maximum plasma-treatment duration of 15 minutes using
an ArF excimer laser “LPX 315” from Lambda Physik
= 193 nm). By an optical setup, consisting of two con-
vex lenses (f1 = 750 mm, f2 = 100 mm), a mask imaging
was realised in order to image a diaphragm on the fused
silica sample’s surface as shown in figure 1.
DOI:10.2961/jlmn.2012.01.0014
JLMN-Journal of Laser Micro/Nanoengineering Vol. 7, No. 1, 2012
74
Fig. 1 Schematic and functional principle of the setup for plasma
pre-treatment and subsequent front-side ablation of fused silica.
The aperture of this diaphragm was 3 mm. The demag-
nification was about 15-times, leading to an irradiated spot
of about 200 µm in diameter on the front-side of the sample.
In addition to this standard front-side configuration, some
experiments in the back-side configuration (where the
beam passes through the sample and the image plane is on
the back-side [1]) have been carried out.
In order to investigate the influence of the plasma-
treatment on the machining properties of the fused silica
surface, the fluence threshold Φmin for substrate ablation of
both treated and untreated reference surfaces was deter-
mined by applying a series of single laser pulses with in-
creasing energy. The pulse duration t was 20 ns. Following,
ablation experiments were performed just above the partic-
ular ablation threshold.
3. Results and discussion
By applying the plasma-treatment, the transmission of
the investigated fused silica samples was reduced signifi-
cantly as shown in figure 2.
Fig. 2 Transmission spectra of a pure fused silica sample (solid
line) and after plasma-treatment for 5 min (dashed line) and 15
min (dotted line).
In comparison to a pure fused silica sample, the trans-
mission at the wavelength of the used laser of 193 nm was
reduced by a total percental value of 5.8% after 5 minutes
and 14.1% after 15 minutes plasma-treatment.
For front-side ablation of pure fused silica using a sin-
gle laser pulse with a pulse duration of t = 20 ns, an abla-
tion threshold of 6 J/cm² was determined. In comparison,
the plasma-treated surfaces show a significant decrease in
required fluence for ablation due to the increased absorb-
ance by means of the reducing-acting forming gas. Here,
front-side ablation was already achieved at a fluence of
1.3 J/c. Hence, the ablation threshold was reduced by a
factor of 4.6 by applying the plasma-treatment. Further-
more, disturbing effects such as micro-cracks and melt are
avoided in this vein. The resulting geometry was measured
using a confocal scanning microscope “PLµ2300” from
Sensofar as shown in figure 3.
Fig. 3 Isometric projection (above) and cross-section (below) of
pure (left) and plasma-treated (right) fused silica surfaces after
single pulse front-side ablation near the particular ablation thresh-
old (6 J/cm² left, 1.8 J/cm² right).
In addition to the above-mentioned reduction of abla-
tion threshold, the peak-to-valley height Rz of the plasma-
treated machined area (Rz =34.7 nm) is reduced by a factor
of 2.3 with respect to pure laser ablated fused silica, where
Rz = 79.8 nm. As shown in figure 4, in the case of the
plasma-treated surface. the complete irradiated spot of
about 200 µm diameter is ablated with a smooth surface
and perfect contour accuracy according to the mask dia-
phragm. In contrast, for the untreated surface, the ablated
area looks quite porous and does not fill the complete irra-
diated spot.
Fig. 4 Microscope image of the pure (a) and plasma-treated (b)
fused silica sample after front-side ablation with a single pulse
near the particular ablation threshold (6 J/cm² left, 1.8 J/cm² right).
JLMN-Journal of Laser Micro/Nanoengineering Vol. 7, No. 1, 2012
75
In comparison to pure laser ablation, a lower ablation
depth is achieved by the presented laser-plasma hybrid
method. However, this enables precise control of the abla-
tion profile by fine adjustment of the fluence.
Furthermore, a comparison of both front-side and back-
side ablation of plasma-treated fused silica surfaces was
carried out. Whereas single pulse back-side ablation of
untreated samples is not possible with this setup, because
ablation starts already at the front-side at the required high
fluence, for single-pulse back-sid e ablation of plasma-
treated samples at 1.3 J/cm², a higher removal rate was
observed. Figure 5 shows both an isometric projection and
cross-section of an ablated spot at the back-side of the
sample.
Fig. 5 Isometric projection (left) and cross-section (right) of a
plasma-treated fused silica surface after single pulse back-side
ablation at a fluence of 1.3 J/cm².
Compared to front-side ablation, where the depth of ab-
lat ion d was 45 nm, the depth of ablation was increased by
a factor of 3.9 in the case of single-pulse back-side ablation
at a fluence of 1.3 J/cm² (d = 175 nm). Comparable in-
creases were also found for higher fluences as shown by
the corresponding ablation depths in figure 6.
Fig. 6 Ablation depth vs. fluence for both front-side and back-
side single-pulse ablation of plasma-treated fused silica
In addition, for back-side ablat ion, the peak-to-valley
height Rz of 14.5 nm is 2.4 times lower in comparison to
single-pulse front-side ablation at a fluence of 1.3 J/c.
Such significant differences in front- and back-side abla-
tion were already observed in previous work and could be
explained by the attenuation of the ablating laser pulse by
the plume of the removed material, which is only effective
for front side irradiation [1]. In the case of ablation at high-
er number of pulses, the ablation depth increased linearly.
When applying 35 laser pulses at 2.4 J/cm², an ablation
depth of approx. 11 µm was achieved, still featuring good
machining quality.
After the micro-structuring, the transmission can be in-
creased by a tempering process. For this purpose, the sam-
ple was tempered at 1000°C in air for inducing a re-
oxidisation of the plasma-treated layer. As shown in fig-
ure 7, the transmission at λ = 193 nm amounts to 83.8%
after 24 hours and 86.8% after 48 hours of tempering.
Fig. 7 Transmission spectra of a plasma-treated fused silica sam-
ple (dotted line) after 24 hours (dashed line) and 48 hours (solid
line) of tempering.
In comparison, a transmission of 88.4% at λ = 193 nm
was measured for the pure, untreated fused silica sample at
the beginning. Thus, almost the initial transmission charac-
teristics can be reconstituted in this vein.
4. Conclusion
In terms of front-side ablation, the presented hybrid la-
ser-plasma micro-structuring method allows a significant
decrease of required fluence for ablation of fused silica by
a factor of 4.6. In addition, a significant enhancement of
the contour accuracy of the imaged mask was observed.
Further, the resulting peak-to-valley height Rz of the ma-
chined area is reduced by a factor of 2.3. The depth of abla-
tion is reduced by 20% in the case of laser-plasma single-
pulse ablation.
The resulting surface roughness was furthermore re-
duced by applying back-side ablation. Here, a higher re-
moval rate was obtained additionally.
By a terminal tempering, the plasma-treated samples
can be re-oxidised, almost resulting in the initial transmis-
sion characteristics. Thus, this technique offers a novel and
economic alternative for the manufacture of high-precisio n
micro-structures in fused silica substrates. Further im-
provement could be achieved by introducing a laser beam
homogeniser to the presented optical setup.
Acknowledgments
The authors gratefully acknowledge the support by the
European Regional Development Funds (EFRE) and the
Workgroup Innovative Projects of Lower Saxony (AGiP) in
the frame of the Lower Saxony Innovation Network for
Plasma Technology (NIP). Further, the support by the Fed-
eral Ministry of Economics and Technology (BMWi) in the
frame of the research project PROKLAMO is gratefully
acknowledged.
JLMN-Journal of Laser Micro/Nanoengineering Vol. 7, No. 1, 2012
76
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(Received: November 22, 2011, Accepted: January 4, 2012)
... It was shown that in comparison to pure laser ablation, the laser ablation fluence threshold for fused silica could be reduced by a factor of 4.6. Further, the surface roughness of the ablated area was decreased by a factor of 2.3 [18,19]. This ablation technique was also successfully adapted to multi-component optical flint glass where a considerable improvement in contour accuracy (by a factor of 1.9 compared to pure laser ablation) and a mitigation of debris deposition were achieved [20]. ...
... The plasma treatment duration-dependent continuous decrease in transmission (Figure 3, right) at those wavelengths can be described by an asymptotic interrelation, theoretically reaching its saturation of 2.14% after t plasma ≈ 170 min. In previous work, a decrease in transmission of 14.1% was achieved after plasma treatment duration of 15 min by applying the presented plasma pre-treatment to fused silica, a single-component glass [18]. It can thus be stated that in the present case merely a comparatively low plasma-induced effect on the UV-transmission of the investigated photovoltaic cover glass was obtained. ...
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In this paper, we present sequential atmospheric pressure plasma-assisted laser ablation of photovoltaic cover glass. First, glass samples were plasma pre-treated using a hydrogenous plasma process gas in order to accomplish a modification of the near-surface glass network by a chemical reduction and the implantation of hydrogen. As a result, the transmission at a wavelength of 355 nm was reduced by approximately 2% after plasma treatment duration of 60 min. Further, the surface polarity was increased by approximately 78%, indicating an increase of the near-surface index of refraction. Subsequently to the plasma pre-treatment, the samples were laser ablated applying the above-mentioned laser wavelength of a Nd:YAG nanosecond laser. Compared to untreated samples, a significant decrease of the form error by 45% without any mentionable change in the ablation rate was obtained in the case of pre-treated samples. For comparison, the results and findings are discussed with respect to previous work, where the presented plasma-assisted ablation procedure was applied to optical glasses.
... This allows an improved energy deposition into the glass surface during laser ablation processes as discussed hereafter. By a tempering process and the accompanying re-oxidisation of the silicon suboxide layer as well as a calcination of the implanted hydrogen, the initial transmission characteristics of fused silica can almost be reconstituted after 48 hours [5]. Moreover, such re-oxidisation is also achieved by a long-term storing of plasmatreated glass. ...
... For instance, in the case of laser scribing of fused silica using excimer laser irradiation at a wavelength λ of 193 nm, the energy density threshold that is required for ablation was reduced by a factor of 4.6. At the same time, the peak-to-valley height rz of the machined area was decreased by a factor of 2.3, attended by a significant improvement of the contour accuracy [5]. ...
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Due to its particular optical and mechanical properties, fused silica is one of the most relevant materials for the production of optical, opto-mechanical and opto-electrical components and systems. Since such glasses feature a high transmittance in the ultraviolet (UV) spectral range, deep UV-laser irradiation or several hybrid methods are usually applied in laser-based manufacturing of optically operative micro-structures on fused silica substrates. Against this background, the development of novel methods for increasing the UV-absorption temporarily is of great interest for laser scribing of optical gratings, micro optics and integrated optical systems. Here, cost- and energy-efficient plasma treatment techniques at atmospheric pressure offer different approaches that can also be applied to other optical glasses.
... In terms of laser ablation subsequent to the plasma pretreatment, the increase in absorption allows a notable reduction of the laser ablation threshold up to a factor of 4.6 when using an argon-fluoride excimer laser with an emission wavelength of 193 nm [36]. Due to the accom‐ panying decrease in energy deposition into the glass, a higher contour accuracy and lower roughness of the ablated area is achieved as exemplified in Figure 10. ...
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In the last few years, the combination of laser irradiation with atmospheric pressure plasmas, also referred to as laser–plasma hybrid technology, turned out to be a powerful technique for different materials processing tasks. This chapter gives an overview on this novel approach. Two methods, simultaneous and sequential laser-plasma processing, are covered. In the first case, both the plasma and the laser irradiation are applied to the substrate at the same time. Depending on the process gas and the discharge type, the plasma provides a number of species that can contribute to the laser process plasma-physically or plasma-chemically. Sequential plasma-enhanced laser processing is based on a plasma-induced modification of essential material properties, thus improving the coupling of laser energy into the material during subsequent laser ablation. Simultaneous plasma-assisted laser processing allows increasing the efficiency of a number of different laser applications such as cleaning, microstructuring, or annealing processes. Sequential plasma-assisted laser processing is a powerful method for the processing of transparent media due to a reduction in the laser ablation threshold and an increase in the ablation rate at the same time. In this chapter, the possibilities, underlying mechanisms, performance, and limits of the introduced approaches are presented in detail.
... In addition to the deposition of a SiO or SiO x coating onto the surface, a near-surface layer within the fused silica silicon dioxide (SiO 2 ) bulk material can be chemically reduced to SiO x with the aid of hydrogenous atmospheric pressure plasmas [11]. This technique represents an alternative solution for decreasing the required laser ablation threshold fluence [12,13]. ...
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The impact of stoichiometry and hydrogen content on the ArF excimer laser ablation characteristics of fused silica is investigated. Near-surface substoichiometic SiOx with x < 2 diminishes the ablation threshold as a result of increased absorption. The ablation rate is raised by an elevated hydrogen content. As confirmed by mass spectrometric analysis, the laser-induced formation of substoichiometric near-surface layers within the ablation spot sustains absorption and ablation for consecutive laser pulses.
... As plasma source, a low-temperature atmospheric pressure plasma jet is used. Beside an increased ablation rate, the required fluence threshold for laser ablation of plasma-treated fused silica is reduced significantly in comparison to untreated fused silica [11]. The presented method thus allows ablation of fused silica at lower laser energies, resulting in both an advanced ecological efficiency and costs reduction for production. ...
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... By an atmospheric pressure plasma treatment of fused silica using a hydrogenous process gas, optical parameters of the bulk material such as its UV-absorbance can be modified [14]. This effect can be used for improving nanosecond laser micro-structuring properties and reducing the energy required for ablation [15]. ...
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In the last decades, laser machining of fused silica has gained in importance where the main challenge is to overcome the high transmission of this medium in order to achieve surface absorption. One approach is plasma treatment using hydrogenous process gases. In doing so, a near-surface glass layer is chemically modified by a removal of oxygen and an implantation of hydrogen, resulting in the formation of optically active defects and an increase in absorption. Against this background, the impact of the plasma power on plasma-induced increase in absorption of fused silica was investigated in the present work. Here, the highest efficiency of the plasma treatment process was found at the lowest applied plasma power whereas for higher plasma powers, a notably lower increase in absorption was observed. This effect is attributed to the decomposition of plasma species required for initiating the formation of optically active defects within the glass. Such decomposition increases with rising power due to the corresponding increase in electric field strength within the plasma. This finding is of substantial interest for an extensive understanding of plasma-glass interactions.
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We report on an atmospheric pressure plasma (APP) treatment of fused silica and its related surface and near-surface effects. Such treatment was performed in order to improve laser micro-structuring of fused silica by a plasma-induced modification of the glass boundary layer. In this context, an APP jet applying a hydrogenous process gas was used. By the plasma treatment, the transmission of the investigated glass samples was significantly decreased. Further, a decrease in the superficial index of refraction of approx. 3.66 % at a wavelength of 636.7 nm was detected ellipsometrically. By surface energy measurements, a decrease of the surface polarity of 30.23 % was identified. These determined modifications confirm a reduction of silicon dioxide to UV-absorbing silicon suboxide as already reported in previous work. Further, a change in reflexion by maximum 0.26 % was detected which is explained by the superposition of constructive and destructive interferences due to a surface wrinkling. With the aid of atomic force microscopy, an increase of the surface root mean squared roughness by a factor of approx. 19 was determined. It was found that both the surface energy and the strength of the fused silica surface were reduced by the plasma treatment. Even though such treatment led to a clustering of carbonaceous contaminants, a surface-cleaning effect was confirmed by secondary ion mass spectroscopy and energy-dispersive X-ray spectroscopy. The increase in UV-absorption allows enhanced laser ablation results as shown in previous work.
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  • R Ebner
  • W Lenz
  • C Suess
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J. Ihlemann: Appl. Surf. Sci. 54, (1992) 193-200.
  • T Sato
  • Y Kurosaki
  • A Kawaguchi
  • H Narazaki
T. Sato, R Kurosaki, Y. Kawaguchi, A. Narazaki, H. Niino: J. Laser. Micro. Nanoen. 5/3, (2010) 256-262
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  • K Sugioka
J. Zhang, K. Sugioka, K. Midorikawa: Opt. Let., 23, (1998) 1486-1488.
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  • P Blandin
  • M Hanna
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C. Gerhard, F. Druon, P. Blandin, M. Hanna, F. Balembois, P. Georges, F. Falcoz: Appl. Opt., 47/7, (2008) 967-974.
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J. Wang, H. Niino, A. Yabe: Appl. Phys. A 68, (1999) 111-113.