Wei-Ping Dow

National Chung Hsing University | NCHU · Department of Chemical Engineering

An organosulfide, 3‑(2‑benzthiazolylthio)‑1‑propanesulfonsäure (ZPS), is used as an accelerator and formulated with a suppressor (polyethylene glycol, PEG) and chloride ions (Cl⁻) in the copper plating solution containing electrolytes (Cu sulfate and sulfuric acid) to prepare the Cu films. Microstructural characterization using focus ion beam (FIB)...

Impurity incorporation in the Cu electrodeposits as a result of the addition of organic additives in the Cu plating solution is investigated with four additive formulas. A common suppressor (polyethylene glycol, PEG) and chloride ions (Cl⁻) are added in the plating solution as a control additive formula. Three organosulfides, 3-mercaptopropanesulfo...

This study focuses on the effects of plating additives and forced convection on microstructure and surface roughness of a copper foil at high current densities. A pilot Cu plating bath was designed according to the simulation of flow field using COMSOL Multiphysics. Accordingly, accurate fluid flow rates and the streamline patterns thereof were obt...

Three substrates, Al2O3, AlN and glass, were directly metallized by copper electroplating using Al-doped ZnO (AZO) as an adhesive and conducting layer between these substrates and the electroplated copper layer. The AZO was synthesized in sol-gel solution, where the Al content in the AZO sol-gel was 2 at.%. Because the AZO is a conductor that can b...

An electrodeposition (ED) formula and approach are proposed to manufacture smooth copper foils on both the matte and shiny sides in this work. The interactive effects of additives and flow rate on the surface morphology of copper are investigated. The scanning electron microscopic images show that 3-mercapto-1-propanesulfonate (MPS) renders the for...

Electroplating Cu technique becomes more and more important in advanced three-dimensional integrated circuit (3D-IC) packaging because of its advantages in the electrical/thermal conductivity, low cost, and hole-filling performance. Formula of the Cu electroplating solution, especially the additive like suppressor, accelerator, and leveler, plays a...

Sn/Cu solder joints serve as electrical pathways and mechanical supports in microelectronic packaging. This study demonstrates that the Cu plating formula has a strong effect on the incorporation of impurities in the Cu deposit and, consequently, affects the microstructural evolution of the Sn/Cu interface. An additive formula with polyethylene gly...

Copper electroplating formulas composed of CuSO4, H2SO4, chloride ions, polyethylene glycol (PEG), bis (3-sulfopropyl) disulfide (SPS), and different levelers for microvia filling of a printed circuit board (PCB) were studied. The influence of the copper electroplating parameters, accelerator and leveler concentrations and cathodic current density...