Golzar Alavi

Institut für Mikroelektronik Stuttgart

A flexible and adaptive energy-efficient high-speed wireless hub is developed in polymer foil as a Hybrid System-in-Foil (HySiF) using Chip-Film Patch (CFP) technology. In this matter, the SiGe BiCMOS silicon chips (2.39 × 1.65 mm ² ) are thinned down to 45 μm and are embedded face-up inside a two-polymer CFP carrier. The active pads of the embedde...

This paper reports on the status of a comprehensive ten-year research and development effort towards Hybrid System-in-Foil (HySiF). In HySiF, the merits of high-performance integrated circuits on ultra-thin chips and of large-area and discrete electronic component implementation are combined in a complementary fashion in and on a flexible carrier s...

Hybrid System-in-Foil exploits the complementary benefits of integrating embedded silicon chips with on-foil passive and active electronic components. In this work, the design, fabrication and characterization of three on-foil components, namely a humidity sensor, near field communication antenna and organic thin-film transistors, are investigated.

This paper reports a transformer-based integrated class-A Differential Power Amplifier (DPA) for the Internet of Things (IoT) applications. The proposed 5–6 GHz fully integrated differential PA is fabricated in a cost-effective 95 GHz-fmax, 0.25 μm SiGe BiCMOS technology (IHP process SGB25V). The amplifier utilizes a thin Si chip with a thickness o...

In this paper, a unique adaptive layout methodology for accurate interconnection between two or more functional chips at the wafer level is presented. The methodology is based on an automatic layout modification for each embedded chip with considering exact related offset and rotation after chip embedding. As a result, a wafer-level embedding and a...

This paper presents the design, fabrication and characterization of digital logic gates, flip-flops and shift registers based on low-voltage organic thin-film transistors (TFTs) on flexible plastic substrates. The organic transistors are based on the p-channel organic semiconductor dinaphtho[2,3-b:2′,3′-f]thieno[3,2-b]thiophene (DNTT) and have chan...

A new concept for an on-chip millimeter-wave dielectric resonator antenna is presented. A spherical dielectric resonator is placed on the chip surface and is excited by an on-chip microstrip feed. A shallow crate is etched in the polymer layers atop the bulk semiconductor, in close proximity of the microstrip feed. The dielectric sphere placed into...

The micro-hybrid system in foil (HySiF) involves ultra-thin chips embedded and interconnected in polymer foil for diverse flexible electronic applications. In this paper, the concepts and results of wafer level embedding and interconnection of ultra-thin dies in polymers are presented. The significant achievement of the presented HySiF is the accur...

Organic electronics have an enormous potential over a wide spectrum of promising low-cost and large-area applications, such as RFID tags, bio-sensors and flexible displays [1]. The organic thin-film transistor (OTFT) is an important building block for these novel applications. In fact, an OTFT-based circuit is integrated with other technologies (e....

The invention relates to a magnetoresistive wheatstone measuring bridge (10, 12, 14, 16, 18, 20, 22, 24), comprising bridge branches that are parallel­connected between a supply potential Vb, wherein in each bridge branch, two series­connected resistance arrangements R1 and R3, or R2 and R4 having an intermediate measuring potential Vout are arrang...

Implantable biosensors are key enablers for continuous diagnosis and monitoring of various disorders and the effects of drug intake on tissue and organs. The SMARTImplant consortium developed highly-integrated systems for in vivo biosensor applications [1]. The recent advancement of ultra-thin Application Specific Integrated Circuits (ASICs) fabric...

Ultra-thin silicon chips with thickness below 20 μm and excellent mechanical stability are embedded in a composite (benzocyclobutene and polyimide) foil substrate. Chemical vapor deposition (CVD) of Si3N4 on the silicon carrier substrate, on which that composite substrate is being processed, is proposed to compensate for the otherwise unavoidable w...