Gagan Srivastava

Rice University · Department of Mechanical Engineering and Materials Science

For hip implant designs made of polyethylene, the wear process for acetabular cups plays a crucial role in joint lifetime. Though much of the wear occurs in the mixed lubrication regime, which is characterized by both fluid dynamics and contact mechanics related behaviors, current wear modeling approaches often ignore the interplay of these dominan...

In a nuclear power plant, the thermal energy from the reactor chamber is transported out to the steam generators through a fluid called reactor coolant. Pumps circulating the reactor coolant in a closed loop have a multistage sealing system including a controlled leakage face seal. It is crucial to understand and predict the performance of this mec...

Abstract Chemical mechanical polishing (CMP) is a complex, multi-scale problem with several order of physics. As it is a subtractive manufacturing process, it involves cutting tool-workpiece interaction. The cutting tool in CMP are nanoscale abrasives trapped in the contact between the workpiece (wafer) and a soft, rotating pad. These abrasives are...

Considered a self-lubricating, abrasion-resistant biomaterial, ultra-high-molecular-weight polyethylene (UHMWPE) has become the most common acetabular cup material used in artificial hip joints. Artificial hip joints exist primarily in the boundary and mixed regimes, which can lead to premature failure due to surface wear, debris generation, and su...

Chemical mechanical polishing is an integral part of the electronics fabrication process. Lab scale experimentation and corresponding modeling studies have shed invaluable insight into the mechanism of CMP. Several models have been successful at predicting the interfacial fluid pressure, and overall MRR incurred in a benchtop polishing operation. H...

Most chemical mechanical polishing (CMP) researchers assume that the polishing occurs in the mixed-lubrication regime, where the applied load on the wafer is supported by the hydrodynamic slurry pressure and the contact stress generated during the pad-wafer contact. Consequently, the particle augmented mixed lubrication (PAML) approach has been emp...

A new multiphysics, multiscale framework is presented which is capable of capturing and predicting both wafer-scale and feature-scale defects. Through physics-based modeling, the empirical wear/Preston coefficient often found in popular feature scale models has been eliminated. Simulation results show the topography evolution of an actual metal 1 l...

Fabrication of integrated circuits is a multi-step process that involves chemical mechanical polishing (CMP) for planarizing the deposited layers. Although dependent on the consumables and machine operating conditions, most CMP researchers assume that the polishing occurs in the mixed-lubrication regime, where the applied load on the wafer is suppo...