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The dynamic behavior of a system is highly influenced by the energy dissipation due to its damping. To clearly understand dynamic behavior, an accurate measurement of damping is very important. One of the most commonly used methods for evaluating damping coefficients is the measurement of decay of free vibrations. The purpose of this study is to in...
Warpage is a critical concern in the microelectronics industry for several decades. It is a root cause of failures during manufacturing processes such as open solder joints. Also the excessive warpage generates the delamination and die cracking which degrade the package reliability. Thus, the accurate estimation of package warpage is one of the imp...
