Bocheng Jiang

Bocheng Jiang
Tsinghua University | TH · Department of Mechanical Engineering

Bachelor of Engineering

About

8
Publications
771
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Citations
Introduction
Skills and Expertise

Publications

Publications (8)
Article
During Through Silicon Via (TSV) wafer backside thinning process, excessive surface stress will cause undue warpage or fracture of wafer in subsequent de-bonding step, and further impair the precision of following wafer stacking and packaging. Therefore, it is considerable to investigate the evolution mechanism of wafer stress and how to control it...
Article
As an important optical component in laser system, silicon mirror surface is required to have micron-level flatness and subnanometer-level roughness. The research concentrates on how to improve roughness as far as possible while maintaining flatness of silicon mirror surface during chemical mechanical polishing (CMP) process. A polishing edge effec...
Conference Paper
In this paper, the residual stress of TSV wafer is investigated under different chemical mechanical polishing(CMP) conditions. An indirect calculation method is put forward to obtain residual stress value from wafer warpage. After that, a comparison of TSV wafer surface profile before and after CMP process is carried out. It can be seen that the co...
Article
Full-text available
With the rapid development of high-energy laser system, thick silicon mirror, as an important optical component to reflect laser, is required to have a surface with micron-level flatness, which poses significant challenges to silicon mirror manufacture process. Fine rotation grinding (FRG) is a typical efficient method for silicon mirror manufactur...
Conference Paper
In high-energy laser system, the silicon mirror is applied to reflect high-energy laser, which is vital for system performance. In order to guarantee favorable absorption and scattering rate of laser, the surface flatness and roughness of slicon mirror need to be controlled at the same time, which is a huge challenge for engineers in actual manufac...
Patent
本发明公开了一种化学机械抛光设备及其操作方法,化学机械抛光设备包括夹片组件,夹片组件上安装有抛光件;保持环,保持环设在夹片组件上,抛光件位于保持环内;抛光盘,抛光盘设在保持环和抛光件的下方;其特征在于,还包括:保持环调节装置,保持环调整装置包括:调节装置,调节装置包括向上调节保持环的拉杆和向下调节保持环的压杆;压力分布检测装置,压力分布检测装置设在抛光盘上以用于检测保持环与抛光盘以及抛光件与抛光盘之间的压力分布,调节装置根据压力分布检测装置的检测信息调节保持环。根据本发明的化学机械抛光设备,能够保证抛光件抛光后的面形精度,提高抛光效果。
Conference Paper
High-power laser reflecting mirror is a principal optical component in high energy laser system. With the rapid development of high power CW laser technology, the reflecting mirror will support higher and higher power intensity, which means traditional material and surface quality standard can not meet the demand of high power CW laser technology....
Patent
本发明提出一种硅衬底片抛光方法和装置,其中,方法包括:对硅衬底片进行粗略抛光;对粗略抛光后的硅衬底片进行精细抛光。该方法通过粗略抛光和精细抛光两个工艺步骤对硅衬底片进行抛光,减少了工艺步骤,缩短了加工工艺时间,且抛光后的硅衬底片的表面粗糙度更小。

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