Is it possible to manipulate a 2DEG with a separate SAW device via Flip chip bonding?

This book is related to theory, design and application of SAW based sensors.

I am wondering if lower frequency SAW devices are less sensitive to changes to their acoustic wave path then higher frequency devices?

My thinking is as lower frequency devices have larger wavelengths, they may be less influenced by changes that occur along the delay line path if a sensing element meant to affect the acoustic wave in placed in it's path. Compared to devices that operate at a higher frequency, where the smaller wavelengths may be more strongly influenced.

Would this be a correct assumption to make?

If you have a negative and a positive and they are forming covalent bonds, how can you manipulate the polarity of what is causing its duplication process?

I am looking for a transparent wax to bond glass wafers with 100nm thick silicon chip that will stand with anisotropic TMAH etching at 90C. Please suggest me with a detailed recipe.

I am making microfluidic chips and trying to bond pmma to glass. what brand (model?) of psa do you recommend?

Hi,

Has anyone doing microfluidics work for cell culture started having problems recently with getting their Sylgard 184 PDMS to reliably and permanently bond to the glass substrate? We have tried replacing our PDMS elastomer base and curing agent recently but this has not fixed our problem. We have also tried using 10% less curing agent which didn’t help either.

Briefly our protocol involves the initial bake at 60 degrees C for 1.5 hours, cutting out chips the next day then cleaning the PDMS surface with adhesive tape, cleaning the glass surface with 70% ethanol and a blast of nitrogen, plasma treatment for 30 seconds at 50% power/~15W (Zepto ONE, Diener Electronic plasma cleaner), and then sticking the surfaces together. Final annealing overnight at 60 degrees C before checking my chips for any bonding issues.

Normally when I have improperly bonded chips it’s immediately obvious and I’d see a portion of the bonded PDMS stuck onto the glass. Recently I’ve noticed that too many of the chips come off the glass cleanly, leaving no residual PDMS. I also sometimes find that a chip may be properly bonded but then it comes undone at a much later stage. All this leads me to think that the bonding is no longer permanent like it should be. I’d appreciate any feedback or advice, or if anyone else has noticed this and what may have worked for you if you did. Thanks very much in advance!

Can anybody provides a datasheet of a a typical sub-miniature chip, bonded to an implantable rfid transponder, including its dimensions, electronic parameters, and so forth.

Hey,

I a modelling acoustic streaming as a result of a SAW wave. I have a model in comsol that calculates the dissipating pressure wave in the fluid and now I would like to calculate my fluid flow from that, is that possible?

Kind regards,

Jorik Waeterschoot