Image of PCB focused on the a) SMD components, b) IC's surface, and c), d) edge detections 

Image of PCB focused on the a) SMD components, b) IC's surface, and c), d) edge detections 

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The paper deals with the issue of multifocal image fusion. Two techniques of the hierarchical image representation are analyzed herein. The first one is hierarchical decomposition based on the Laplacian pyramid and the second one is based on integer discrete wavelet transformation. After the analysis of the above-mentioned decompositions techniques...

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... edges than the blurred image. Hence, the energy of the differentiated version of the focused image must be higher than the energy of the blurred one. By simple comparison of the blocks energy of the differentiated images, the approximation image used for the image fusion can be obtained. The input microscopic multifocal images of PCB are shown in Fig. 4a), b). The images show Integrated Circuit (IC) with high package and SMD components. The image where the microscope is focused on the surface of SMDs and PCB is shown in Fig. 4a), while in Fig. 4b), on the contrary, the microscope is focused on the surface of IC. Fig. 4c), d) shows the results of edge detection for the first level of GP. ...
Context 2
... blocks energy of the differentiated images, the approximation image used for the image fusion can be obtained. The input microscopic multifocal images of PCB are shown in Fig. 4a), b). The images show Integrated Circuit (IC) with high package and SMD components. The image where the microscope is focused on the surface of SMDs and PCB is shown in Fig. 4a), while in Fig. 4b), on the contrary, the microscope is focused on the surface of IC. Fig. 4c), d) shows the results of edge detection for the first level of GP. Fig. 5 represents a block diagram of the complete algorithm of the multifocal image fusion. Fig. 5 shows that input images (A and B) are decomposed into subimage of IDWT or LP. ...
Context 3
... differentiated images, the approximation image used for the image fusion can be obtained. The input microscopic multifocal images of PCB are shown in Fig. 4a), b). The images show Integrated Circuit (IC) with high package and SMD components. The image where the microscope is focused on the surface of SMDs and PCB is shown in Fig. 4a), while in Fig. 4b), on the contrary, the microscope is focused on the surface of IC. Fig. 4c), d) shows the results of edge detection for the first level of GP. Fig. 5 represents a block diagram of the complete algorithm of the multifocal image fusion. Fig. 5 shows that input images (A and B) are decomposed into subimage of IDWT or LP. Subimages of ...
Context 4
... can be obtained. The input microscopic multifocal images of PCB are shown in Fig. 4a), b). The images show Integrated Circuit (IC) with high package and SMD components. The image where the microscope is focused on the surface of SMDs and PCB is shown in Fig. 4a), while in Fig. 4b), on the contrary, the microscope is focused on the surface of IC. Fig. 4c), d) shows the results of edge detection for the first level of GP. Fig. 5 represents a block diagram of the complete algorithm of the multifocal image fusion. Fig. 5 shows that input images (A and B) are decomposed into subimage of IDWT or LP. Subimages of details are directly fused by application of (6). Thus, the combined subimages are ...

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