b: 4 chips precision TJ connected

Source publication

Thin Film Transfer and Join Technology

Conference Paper

Full-text available

Mar 2002

Roy Yu
C. Prasad
B. Pogge
[...]
Tom Wassick

Thin film packaging has been used in MCM-D for IBM high-end servers for over a decade. This advanced packaging technology is characterized by high performance, high wiring density, high IO capability, and high reliability which are the key attributes for high-end server applications. A wide range of development with thin film type technology and pr...