Figure 6 - uploaded by Jawad Haj-Yahya
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(a) Package layout of Skylake-S (high-end desktop) showing a single voltage domain for the cores (green), which combines the Core Ungated voltage domain (VCU ) and each of CPU core voltage domains, VC0G, VC1G, VC2G, VC3G). (b) Side view of die and package showing combined voltage domain in die, package's substrate, and package's decoupling capacitors.

(a) Package layout of Skylake-S (high-end desktop) showing a single voltage domain for the cores (green), which combines the Core Ungated voltage domain (VCU ) and each of CPU core voltage domains, VC0G, VC1G, VC2G, VC3G). (b) Side view of die and package showing combined voltage domain in die, package's substrate, and package's decoupling capacitors.

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To reduce the leakage power of inactive (dark) silicon components, modern processor systems shut-off these components' power supply using low-leakage transistors, called power-gates. Unfortunately, power-gates increase the system's power-delivery impedance and voltage guardband, limiting the system's maximum attainable voltage (i.e., Vmax) and, thu...

Contexts in source publication

Context 1
... shown in Fig. 6, the desktop package combines into a single voltage domain the ve voltages used in the mobile package shown in Fig. 1 [17]) and package (i.e., decaps [18]) between CPU cores, and 2) sharing of package routing resources between CPU cores. This architecture results in reducing both resistive and inductive voltage drops ...
Context 2
... shown in Fig. 6, the desktop package combines into a single voltage domain the ve voltages used in the mobile package shown in Fig. 1 [17]) and package (i.e., decaps [18]) between CPU cores, and 2) sharing of package routing resources between CPU cores. This architecture results in reducing both resistive and inductive voltage drops ...