- Enhanced dielectric properties and thermal stability of epoxy induced by polyhedral oligomeric silsesquioxanes

a DSC curves at different heating rates, b heating rate–temperature curves of extrapolation method

Reference

Enhanced dielectric properties and thermal stability of epoxy induced by polyhedral oligomeric silsesquioxanes - Scientific Figure on ResearchGate. Available from: https://www.researchgate.net/figure/a-DSC-curves-at-different-heating-rates-b-heating-rate-temperature-curves-of_fig3_366952021 [accessed 30 Jun, 2024]

Caption

a DSC curves at different heating rates, b heating rate–temperature curves of extrapolation method

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<a href="https://www.researchgate.net/figure/a-DSC-curves-at-different-heating-rates-b-heating-rate-temperature-curves-of_fig3_366952021"><img src="https://www.researchgate.net/publication/366952021/figure/fig3/AS:11431281117839750@1675567206192/a-DSC-curves-at-different-heating-rates-b-heating-rate-temperature-curves-of.png" alt="a DSC curves at different heating rates, b heating rate–temperature curves of extrapolation method"/></a>