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![Zn rich portion of the binary Zn–Sb phase diagram. Selected nominal alloy compositions are shown by vertical blue lines [29]. (Color figure online)](publication/327349303/figure/fig1/AS:941621570965518@1601511485435/Zn-rich-portion-of-the-binary-Zn-Sb-phase-diagram-Selected-nominal-alloy-compositions.png)
Zn rich portion of the binary Zn–Sb phase diagram. Selected nominal alloy compositions are shown by vertical blue lines [29]. (Color figure online)
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In this study, the newly developed Zn based solder alloys with different amount of Sb doping (i.e. Zn–1.2 wt% Sb, Zn–1.7 wt% Sb and Zn–2.2 wt% Sb) were investigated for microstructural, thermal, mechanical and electrical properties. The microstructure of Pb-free eutectic Zn–1.7 wt% Sb alloy was found finer lamellar structure and observed better pro...
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Mo-Si compound-based ultrahigh temperature structural material (UHTM) is a new high-temperature structural material with great potential due to its high melting point, high hardness, and suitable density. As an important material to meet the demands of advanced high-temperature structural applications in the range 1200–1600 °C, in oxidizing and agg...
Citations
... The study [17] dealt with Zn-Sb-based binary alloys destined for higher application temperatures. The alloy with a eutectic composition of Zn with 1.7 wt. ...
The aim of this study was to characterize a Zn-Mg type soldering alloy and direct soldering of SiC ceramics with a copper substrate. The Zn1.5Mg solder exerts a wider melting interval. The temperature of the eutectic reaction was 365 °C, and the liquidus temperature was 405 °C. The microstructure of the soldering alloy is comprised of a zinc matrix. Segregation of binary eutectics in the form of (Zn) + Mg2Zn11 lamellas occurred on the boundaries of Zn grains. Additionally, the presence of a MgZn2 magnesium phase was observed in the solder matrix. The SiC/solder bond was formed due to magnesium distribution from solder to the boundary with SiC ceramics, where magnesium reacts with silicon, which is infiltered in SiC ceramics. By a mutual interaction, a new Mg2Si phase is formed. An interaction between the molten zinc solder and Cu substrate occurred on the boundary of the Cu/substrate joint at the formation of a transition zone composed of two new phases, namely the γCu (Cu5Zn8) non-wettable phase type, approximately 30 µm wide, and a wettable (CuZn4) phase type ε, approximately 12 µm wide. The average shear strength of a combined SiC/Cu joint fabricated using Zn1.5Mg solder was 44 MPa.
... The development of Pb-free solders has become an important issue because of the toxicity of lead to human health and the environment. [1][2][3] Pb-free solder systems that have been proposed in the literature so far include Sn-based, [3][4][5] Au-based, 6,7 Bi-based 8,9 and Znbased [10][11][12][13][14][15][16][17][18][19][20][21][22][23][24][25][26] alloys. All these materials suffer from either an intermediate melting range, high cost or poor mechanical, electrical and interconnection properties. ...
... Studies to date have reported the effects of adding different alloying agents to Zn, including Al, Cu, Sn, Cr, Mg, Mo, Ni, Ga and Sb. [10][11][12][13][14][15][16][17][18][19][20][21][22][23][24][25][26] Zn-Sn alloys present higher ductility compared to other Zn-based alloys. They also offer good electrical properties and higher resistance to oxidation in adverse thermal and humid conditions. ...
... Rahman et al. studied the mechanical and creep characteristics of Zn-Sb alloys. 11,12 The mechanical strength of Zn was found to be compromised when alloyed with Sb. Mallick et al. studied the microstructure and thermal, mechanical and electrical properties of a Zn-Ni binary system with 0.7-1.5 wt.% of Ni in Zn, 27 and observed an increase in both the size and quantity of Zn-Ni intermetallic particles with the increase in Ni content in the alloy. ...
Lead-based solders are widely used for making interconnections between electronic chips and a circuit board that is expected to perform at high temperatures. The substitution of traditional lead-bearing solders is one of the key challenges to electronic industries in the current drive for eco-friendly manufacturing. In the present study, a minor amount of Ni is alloyed with Zn to investigate the effect of Ni on the microstructure and the thermal, mechanical and electrical properties of the newly developed solder. The microstructures of the Ni-Zn solder alloys are composed of β-Zn and Ni-Zn intermetallics (γ-phase). The appearance of a γ-phase Ni-Zn intermetallic (NiZn5) instead of a δ-phase intermetallic in a eutectic structure, grain boundary particles and an irregular second phase is discussed in detail. Addition of Ni results in enhanced mechanical properties, keeping the electrical properties unchanged. The suitability of Ni-Zn alloy as high-temperature solder is evaluated in comparison with traditional Pb-Sn solders and other Zn-based alloys.
... Researchers proposed different Pb-free solder systems; i.e. Sn-(Zn/ Bi/Ag/Au/Sb) systems [4][5][6][7][8], Au-(Sn/Ge) systems [9,10], Bi-(Ag/Sb) systems [11][12][13], Cu-(Zn/Sb) systems [14,15] and Zn-(Al/Cu/Sn/Cr/Ni/Mg/Mo/Ga/In/Sb) systems [16][17][18][19][20][21][22][23][24][25][26][27]. All these materials suffer from either of intermediate melting range, high cost, poor mechanical, electrical and interconnection properties. ...
Lead-based alloys are conventionally used for soldering interconnections that are expected to perform at high temperatures. Because of the concerns of lead toxicity, the development of lead-free solders became important. Till now, none of the proposed alloys have the characteristics that can completely substitute the Pb-bearing solders for high-temperature soldering application. Recently, researchers studied many ternary and quaternary systems near Zn–Al binary eutectic composition and reported prospects in soldering applications. However, the bulk solder properties of the Zn–Al binary system near the eutectic composition is rare in the literature. In the present study, the microstructure and thermal, mechanical and electrical characteristics of eutectic and near-eutectic Zn–Al alloys are investigated as replacement of traditional lead-bearing high-temperature solders. Mechanical and electrical properties of Zn was enhanced by alloying with Al, without altering much of the thermal expansion co-efficient. Finally, the material properties of the prepared Zn–Al alloys and other Zn-based alloys are compared with the conventional Pb–Sn solders. Research shows, 7 wt% Al–Zn alloy has multiple times higher magnitude of ultimate tensile strength, Vicker’s microhardness and electrical conductivity than the traditional Pb–Sn high-temperature solders. The melting temperature of the alloys was a bit higher than the Pb–Sn solders. A suitable ternary element addition to the system can potentially replace the conventional Pb-based high-temperature solders.
Highly reliable bonding materials have attracted tremendous interest due to a growing demand for high-temperature electronics. We developed a fluxless and binder-free paste comprising Cu nanoparticles (NPs), Sn-58Bi (SnBi) particles, and polyvinylpyrrolidone (PVP) dispersing agent, which enables pressureless, low-temperature (190–250 °C) formation of robust joints (over 7 MPa) by means of transient liquid phase sintering (TLPS). Microstructural evolution of the joint was investigated under variations in PVP molecular weight (MW; 10,000, 55,000, 360,000, or 1,300,000) and bonding conditions including temperature and time. In a die-shear test, the joint formed with PVP MW 360,000 was the strongest due to its proper particle dispersion and the formation of intermetallic compounds (IMCs). Conditions of excessive PVP MW, bonding temperature, and time impeded the bonding characteristics of the TLPS joint, with formation of voids and increasing brittleness. TLPS bonding with the optimal dispersing agent enabled pressureless die attach without chip damage, demonstrating applicability as a simple, robust interconnection for high-temperature electronics.
