Figure 1 - uploaded by Mahmood R. S. ShirazY
Content may be subject to copyright.
Source publication
Thermal performance of a commercial LED array module has been studied by experimental, numerical and analytical approaches to find the dominant thermal resistance in the thermal circuit. The light quality, lifetime and reliability of the LED modules depend strongly on the junction temperature which can be obtained and modified by a suitable thermal...
Contexts in source publication
Context 1
... can be seen in Figure 1, a LED module is typically composed of a LED package mounted on a printed circuit board (PCB) and a heat sink to transfer the heat to the ambient. The LED package consists of die, die attach, heat conducting slug enclosed in a ceramic package, thermal slug pad, encapsulation and lens. ...
Context 2
... of a LED module is shown in Figure 1. The LED die is made by Bridgelux ™ and has 1W power and a luminous efficiency of 15% (85% of the power is therefore converted to heat). ...
Context 3
... 4 shows the simplified configuration of the LED module with its corresponding boundary conditions. Comparing this configuration with Figure 1 shows that some components of the LED module are ignored to simplify the geometry. In the LED package, the lens, encapsulation and ceramic package are ignored due to their very low thermal conductivities. ...
Context 4
... simulate the conditions occurring in the case of the MC PCB without a heat sink, another model without the heat sink base plate is also developed which can be observed in Figure 2a. Figure 10 shows the temperature profile of the LED module both experimentally by IR imaging and numerically. Ambient temperature in both numerical and experimental studies is 23 o C based the measured laboratory ambient temperature. ...
Context 5
... can be seen in Figure 10b, the maximum temperature occurs at the die surface and is around 60 o C whereas the maximum measured temperature in the IR image is 47.7 o C (Figure 10a). This shows that the die temperature cannot be measured directly from the IR imaging due to the temperature loss in the lens and encapsulation. ...
Context 6
... can be seen in Figure 10b, the maximum temperature occurs at the die surface and is around 60 o C whereas the maximum measured temperature in the IR image is 47.7 o C (Figure 10a). This shows that the die temperature cannot be measured directly from the IR imaging due to the temperature loss in the lens and encapsulation. ...
Context 7
... shows that neglecting the copper layers in the analytical model is a valid assumption. Figure 11 shows the MC PCB surface temperature profile along the line identified in Figure 10b from the MC PCB mid- plane (x=0) to the edge. Experimental results show that the temperature is relatively uniform when the heat sink is attached and the temperature decrease from the MC PCB center to the edge is less than 2 o C. ...
Context 8
... shows that neglecting the copper layers in the analytical model is a valid assumption. Figure 11 shows the MC PCB surface temperature profile along the line identified in Figure 10b from the MC PCB mid- plane (x=0) to the edge. Experimental results show that the temperature is relatively uniform when the heat sink is attached and the temperature decrease from the MC PCB center to the edge is less than 2 o C. ...
Context 9
... MC PCB surface temperature under 5 LEDs can be seen in Figure 12 for two cases of complete module with heat sink and MC PCB without heat sink. The LEDs are the lower row on the MC PCB shown in Figure 10b with their corresponding numbers. ...
Context 10
... MC PCB surface temperature under 5 LEDs can be seen in Figure 12 for two cases of complete module with heat sink and MC PCB without heat sink. The LEDs are the lower row on the MC PCB shown in Figure 10b with their corresponding numbers. It can be seen that the analytical and numerical results are in good agreement. ...
Context 11
... can be seen that the analytical and numerical results are in good agreement. The difference between the MC PCB temperature under the LEDs and that of the visible MC PCB (Figure 11) is approximately 10 o C. This shows the very low spreading capacity of the dielectric layer and hence, its high thermal resistance. ...
Similar publications
Numerical modeling using Comsol Multiphysics, with Finite Element Method, has been carried out to study fracture initiation, linkage, and deflection of the Blue Lias Formation. Data were from outcrop observation where hydrofractures were well observed. Three models were set up to understand how fractures initiated, linked and arrested. The Young’s...
Aiming at the requirement of workpiece integrity for parts processing line, on-line detection using inductive heating thermography for the moving workpieces on the assembly line is studied. In this paper, the detection mechanism of pulsed eddy current thermography for moving workpieces defects is analysed. A two-dimensional model of a magnetic mate...
![Table 2 : Comparison between experimental results of [9] with...](profile/Dhafer-Hachim/publication/317568016/figure/tbl1/AS:670452578013185@1536859759045/Comparison-between-experimental-results-of-9-with-theoretical-results-of-present-work_Q320.jpg)
Based on the energy saving design in cold winter and hot summer zone like Iraq weather conditions, a prototype of sandwich wall panel (SWP) is analyzed by COMSOL Multiphysics ver. 5.0 programe. A new design of sandwich wall panel that enhances thermal insulation of Iraqi buildings by adding an insulating multilayer inside the wall is presented....
