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Trench filling by different electrolytic plating processes. (I): before plating, (A): after 40 min plating at 10 A with tank A, (B): after 40 min plating at 10 A with tank B
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... samples had trenches with 20 µm width, 60 µm length and 5 µm depth. After 40 minutes of electrolytic copper plating at 10 A in each process, profiles of the plated trenches were observed with an optical profiler ( figure 7) and thickness of copper on the sample surface was measured with an electrical thickness gauge. From tank A, plated copper thickness on the surface was 5 µm and the depth of the dimple was 3.2 µm. ...
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... The approach of photovias has been scaled down to 5 µm by Samsung Electro-Mechanics (SEMCO) [1] and 10 µm by Shinko [2]. The excimer laser ablation approach has also scaled down the microvia diameter in polymer dielectrics down to 3-8 µm [3,4] at Georgia Tech and 5 µm [5] as shown by Fraunhofer IZM, both in collaboration with SUSS Microtec. However, there have been very limited studies on the reliability studies of microvias below 5 µm diameter in dry film polymer dielectrics. ...
... The dielectric material is available in the form of a dry film. The small size of filler particles in ABF GX-T61, similar to ABF GY50, enable drilling of < 5 µm microvias and trenches in the dielectric using excimer laser [3]. One of the main concerns for ultra-thin polymer dielectric films is their coefficient of thermal expansion (CTE). ...
... The advantages of using a perpendicular nozzle flow technology are discussed by Yuya et. al. [3]. The overburden plated copper thickness in this study was about 5 µm. ...
