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A technology for efficiently designing a multilayer metal film with strong adhesion to a soft resin was developed by combining a molecular simulation with an orthogonal array. In this technique, the adhesion strength of the interface between the metal film and resin is evaluated by calculating the adhesive fracture energy by use of a molecular-dyna...
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Appropriate ceramic materials with strong adhesion to a resin, which is used for thin-film devices, were selected by using a combination of an orthogonal array and a response-surface method. In this technique, at the first step, important factors that significantly influence the adhesion strength were selected from various factors that characterize...
A technology for efficiently designing an appropriate metal material with strong adhesion to a ceramic material was developed by using a combination of an orthogonal array and a response-surface method, and it was applied to the interface adhesion between metals and an example ceramic, alumina (Al2O3) in nanoscale thin-film devices. In this optimum...
We applied Taguchi experimental design to a nano-structure multilayer film. An L9 orthogonal array and a molecular dynamics simulation were used to design a metal film made up of eight atomic layers so that the metal film was made to have strong adhesion to a resin with a polyphenyl chain (a sequential benzene-ring chain). By carrying out sensitivi...
Appropriate ceramics with strong adhesion to single-stranded ribonucleic acids (RNAs), which are used in biomedical and electronics devices, was selected by using an efficient materials-informatics technology based on a combination of an orthogonal array and a response-surface method. In this technology, at the first stage, important factors that s...
Citations
Semiconductor packaging technology is moving towards three-dimensional packages due to the need for high speed/high performance in mobile devices. Consequently, laminate materials for the packages of today need to be thinner and thinner. However, the lower stiffness of the total substrate leads to increased warpage of packages made with the thinner materials. Therefore, in order to reduce this warpage, it is necessary to reduce the coefficient of thermal expansion (CTE) of the laminate materials. At Hitachi Chemical, we have developed laminate materials by focusing attention on polycyclic aromatic resins, and we have investigated indicators for low CTE resins using molecular simulation technology. This paper introduces (1) the features of those polycyclic aromatic resins that show low CTE and their stacking effects, and (2) the design of low CTE resins with the help of compatibilizing energy as an indicator.
