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Schematic of workpiece surface morphology coordinate system

Schematic of workpiece surface morphology coordinate system

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Fig.2 Simplified geometric model of the abrasive particle
Fig.3 The model of diamond wire saw morphology
Fig.6 Schematic of abrasive particle trajectory coordinate...
Fig.8 Schematic of workpiece surface morphology coordinate system
+8 Fig.11 Schematic of wafer surface formation in mixed material removal mode
Prediction And Verification of Wafer Surface Morphology in Ultrasonic Vibration Assisted Wire Saw (UAWS) Slicing Single Crystal Silicon Based On Mixed Material Removal Mode
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Full-text available
  • Sep 2021
Monocrystalline silicon is one of the most important semiconductor materials, widely used in chip manufacturing, solar panels. Slicing is the first step in making chips and the surface quality of silicon wafers directly affects the quality of later processing and accounts for a large proportion in the chip manufacturing cost. Ultrasonic vibration a...
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Context 1
... convenience, the modeling area was rotated 90°. As shown in Fig.8, the workpiece surface morphology coordinate system is established, and the origin í µí±œ is set at 0.5í µí°· í µí°µ away from the center of the cross section of the wire saw. ...
Context 2
... brittle removal does not occur, Eq. (32) can be used for sampling. Due to the shape of the material being removed in brittle mode is spherical crown, several sampling sections adjacent to sampling cross section n will be affected as shown in Fig.18. The intersection points of brittle removal contour and ideal workpiece surface are C7 and C8. ...

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Schematic of UAWS slicing
An image of wire saw measured by optical microscope
Simplified geometric model of the abrasive particle
The model of diamond wire saw morphology
+22 The position of abrasive particle i in the wire saw coordinate system
Prediction and verification of wafer surface morphology in ultrasonic vibration assisted wire saw (UAWS) slicing single crystal silicon based on mixed material removal mode
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Monocrystalline silicon slicing is the first step in making chips, and the surface quality of silicon wafers directly affects the quality of later processing and accounts for a large proportion in the chip manufacturing cost. Ultrasonic vibration assisted wire saw (UAWS) is an effective sawing process for cutting hard and brittle materials such as...
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