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Schematic of the duplexer assembly.

Schematic of the duplexer assembly.

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Article
Full-text available
This paper provides a comprehensive methodology for accurate analysis and design of miniaturized radio frequency (RF) surface acoustic wave (SAW) duplexer package. Full-wave analysis based on the three dimensional (3-D) finite element method (FEM) is applied to get the package model. The die model. is obtained by combining the parasitics and acoust...

Contexts in source publication

Context 1
... cas- caded T-network is used for transmitter path and a Pi- network is used to implement the receiver path of the du- plexer [15]. The die is mounted using conductive epoxy to ensure ground on the backside of the die. The connections between the die and package are made using gold bonding wires. The schematic of the duplexer assembly is shown in Fig. ...
Context 2
... Af- ter combining the results of the package and die in ADS, we can change the positions of bonding wires to investigate the influence of the bonding wires. For the bonding wire scheme shown in Fig. 14, the bonding wire positions are changed for the Rx ground, and two more bonding wires are added compared with the bonding wire scheme shown in Fig. 3. The inductance to ground for the Rx channel is reduced. The isolation can be improved from 1.65 to 1.8 GHz and 4.6 dB improvement is achieved at 1.75 GHz as shown in Fig. 15. The solid line shows the new results with the new bonding wire scheme shown in Fig. 14. The dashed line shows the simulation results shown in Fig. 11. ...

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Citations

... This intrinsic problem can be overcome with the use of miniaturized surface acoustic wave (SAW) duplexers [4], utilizing a frequency division duplex (FDD) scheme. This approach occupies a very small footprint, but its complex architecture makes it difficult to design and fabricate for arbitrary frequency bands. ...
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Constant development of new wireless standards increases the demand for more radiating elements in compact end-user platforms. A decrease in antenna separation gives rise to increased antenna coupling, resulting in a reduction of the signal-to-interference-plus-noise ratio (SINR) between transmitter and receiver. This letter proposes a decoupling network that provides dual-band port isolation for a pair of distinct antennas. A prototype has been fabricated to verify the theory.
... The modeling approach is valid only if the size of the package is sufficiently smaller than the wavelength of the electromagnetic wave. At higher frequencies, however, more rigorous electromagnetic analysis is necessary [182, 202, 203]. In the numerical computation of capacitance and impedance matrices, the charge density and current, respectively, are represented using pulse functions. ...
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This dissertation discusses numerical simulations of microwave acoustic resonators and bandpass filters employed in wireless telecommunication systems. In the first part of the dissertation, tailored finite element method (FEM) software with efficient numerical techniques is implemented and applied in the modeling of thin-film bulk-acoustic wave resonators (FBARs). Simulations with 3D FEM models of FBARs are carried out to investigate the effect of the electrode shape on the spurious resonances that often are present in the electrical response. The modeling results are validated through comparison of simulated and measured mechanical vibration amplitudes. The usability of the FEM tool is further demonstrated in simulations of a resonator design that features a clean electrical frequency response, free of spurious resonance peaks caused by anharmonic modes. Additionally, a method is proposed for determination of the elastic constants of a piezoelectric thin-film material. The technique is based on fitting of the computed dispersion curves of Lamb-wave modes to those measured from an FBAR using a scanning laser interferometer. In the second part of this dissertation, numerical simulations are used to study propagation properties of longitudinal leaky surface acoustic wave (LLSAW) mode under periodic electrode array on YZ-cut lithium niobate (LN). A combined FEM/boundary element method is employed to compute the electric admittance of one-port synchronous LLSAW resonators. Simulations and experiments are used to derive the dependence of the resonator resonance frequencies and Q values on the electrode dimensions. Ladder-type bandpass filters exploiting the LLSAW mode are implemented on YZ-cut LN in the frequency range from 2.5 GHz to 5.2 GHz, with fundamental mode LLSAW resonators as building blocks. The results demonstrate that the high phase velocity of the LLSAW mode on YZ-cut LN allows inexpensive fabrication of wide-band, low-loss filters up to 5 GHz using conventional optical lithography. The third topic considered is comprehensive modeling of a SAW duplexer, including electromagnetic modeling of the ceramic package. The parasitic capacitive and inductive couplings in the package are obtained using rigorous computation, allowing one to estimate the package effects on the duplexer performance. TKK dissertations, ISSN 1795-4584; 5
... We can easily analyze the influence of each part based on the methodology developed in this dissertation. For the KPCS duplexer package, we have found several novel methods to improve the isolation at the Tx stopband [25]. ...
Article
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Chapter
Currently, there are two types of CSP packaging techniques: Flip-chip CSP (FC-CSP) [1] and Wafer-level CSP packaging (WLCSP) [2, 3]. FC packaging technology has been in use for over 40 years. It was first introduced by IBM in the 1970s and was subsequently adopted by other chip makers. The main advantage of FC-CSP packaging is its small size. Although there is no definite rule for how small the package should be, a typical FC-CSP packaged device is 50–100% larger than its original die (chip) size. It is a significant improvement from the traditional wire-bonding-based (SMD and QFN) packaging technologies [4].
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In full-duplex radio communication systems like e-UTRAN, CDMA-2000, the radio transmitter (Tx) is active at the same time as the radio receiver (Rx). The Tx and the Rx will be using separate dedicated frequency bands and the Tx-Rx isolation is ensured by duplex filters. However, agile duplexers required for multiband operation are almost nonexistent while dedicating a bank of narrowband filters is bulky and incurs considerable switching losses. In this paper, we propose an approach that dramatically reduces the complexity of the RF frontend, first by replacing the duplex filter with a spatial filter and second, by codesigning the filtering antennas and the RF frontend. The spatial filter is synthesized by equipping the Tx with redundant antennas. By properly weighting the Tx antennas, the Tx signal is selectively attenuated in the Rx direction. The spatial filter can be tuned to different frequency bands as long as the antennas are made tunable. Moreover, the spatial filter may directly benefit from the balanced architecture of the power amplifiers (PAs) thus reducing the total system complexity and insertion loss. Finally, simulation and initial measurement results are provided in a challenging low-frequency band, serving as a proof-of-concept.
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