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Schematic of experimental test.

Schematic of experimental test.

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The laser direct structuring (LDS) and the molded interconnect devices (MID) processes become more popular in the electronics industry. In order to produce micro MID products with highest circuit lines quality, it is very important to understand the complex relationship among the laser direct structuring parameters, the dimensions of the groove at...

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... order to study the relationship among the LDS parameters and the minimum line space, two circuit lines have been created in this experiment tests with different proposal space (Ps) width between these two lines, as shown in figure 2. The values of the Ps distance have been supposed as a function for laser beam diameter (2Χd, 3Χd, 4Χd), where d is the laser beam diameter. ...

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... Therefore, a further inspection was essentially carried out to realize the relation between the LDS process parameters and the groove characteristics. Consequently, a deep understanding is obtained for the impact of grooves on the metallization structure [17]. Experimental investigations and optimization of the LDS process were conducted in [17]. ...
... Consequently, a deep understanding is obtained for the impact of grooves on the metallization structure [17]. Experimental investigations and optimization of the LDS process were conducted in [17]. In this study, the researchers employed the design of experiment method (DoE) to investigate the influence of the laser power, the laser speed, and laser frequency on the groove dimensions (width and depth), groove profile and quality of the LDS process. ...
... The structural area under these LDS parameters appears as a circle, because the amount of the laser fluence and the irradiation dose are not sufficient to produce a continuous structured area or continuous produced groove. Thereby, the structured area or the groove formation will appear in this form with puffiness or blowing surface [17] [42]. This behavior can be prevented by increasing the laser fluence, irradiation dose, and the pulse numbers. ...
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Die Arbeit dieser Arbeit konzentriert sich auf die MID-LDS-Technologie. Im Allgemeinen konzentriert sie sich auf die Wirkung von LDS-Parametern, einschließlich Lasereinfallwinkel, Brennweite, Schraffur, Laserleistung, Lasergeschwindigkeit und Laserfrequenz auf die endgültigen Eigenschaften des strukturierten Bereichs, Genauigkeit, Qualität und Zuverlässigkeit des endgültigen MID-Produkts. Es enthält eine experimentelle Untersuchung, die auf dem DoE-Tool basiert, um die Korrelation zwischen angenommenen Parametern und entsprechenden Antworten zu beschreiben. Eine Computer-Simulation und Modellierung werden auch verwendet, um die Prozessleistung mit einfach zu modifizierenden Computermodellen vorherzusagen.
... It is an important attempt to propose a mathematical model which correlates the relation among the traditional process parameters and the groove dimensions, as well as the surface roughness (Ra). Experimental investigation and optimization for the LDS process is conducted in [5]. In this study, the effect of the laser speed, power, and frequency on the quality of the LDS products were investigated. ...
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The molded interconnected devices (MID) technology is vastly growing as an important innovative technology in the field of electronics production. The laser direct structuring (LDS) method is one of the most common available technologies for building up MID’s products. The current existing knowledge in industry and in research about the standards in the respective manufacturing processes and process parameters is up to now not fully comprehensive in terms of mutual influencing and dependencies on each other. This is particularly the case for the three-dimensional applications and micro products. In the present contribution, a new simulation procedures based on a three-dimensional finite element model (FEM) has been developed. The effect of each of latent heat of fusion and temperature on the material properties as well as the 3D Gaussian heat source for the laser beam has been considered in this work. The used material was a polymer plate poly ether ether ketone (PEEK). The effect of the process parameters including laser power, speed, frequency, hatching percent or overlap between the laser lines, the laser incident angle, and the focal length have been investigated in experiments and simulations. The present simulation can be used to predict, temperature distribution, maximum temperature, groove dimensions, and groove profile at different process parameters setup. The theoretical and the experimental results can show a good accordance. It can be concluded that the FEM simulation can be used efficiently for predicating, analyzing, and optimizing the 2D/3D laser parameters for the LDS process.
... In fact, fine products depend on the quality of the micro channel or the groove after the LDS step, which depends on the groove dimensions (groove width and depth), groove lap dimensions (lap width and height) and finally the interaction width, which refers to the width of the circuit line, see Fig.1. All the above dimensions as well as the groove profile after the LDS process depend on the LDS parameters such as laser power, laser speed and laser frequency (Bassim & Jörg, 2014;Bassim & Jörg, 2015). Another important requirement for the quality and reliability of the MID products is the adhesion strength of the MID structures. ...
... In case of fine line/space products, the interactive width and the lap width must decrease as much as possible. Previously mentioned that the interactive width affects the width of the circuit line, and the lap width affects the space between two circuit lines (Bassim & Jörg, 2015). ...
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Laser direct structuring (LDS) is very important step in the MID process and it is a complex process due to different parameters, which influence on this process and its final product. Therefore, it is very important to use a reliable model to predict, analyze and control the performance of the (LDS) process and the quality of the final product. In this work we develop mathematical models by using Artificial Neural Network (ANN) and Response Surface Methodology (RSM) to study this process. The proposed models are used to study the effect of the LDS parameters on the groove dimensions (width and depth), lap dimensions (groove lap width and height) and finally the heat effective zone (interaction width), which are important to determine the line width/space in the MID products and the metallization profile after the metallization step. We also study the relationship between the LDS parameters and the surface roughness which is very important factor for the adhesion strength of MID structures. Moreover these models capable of finding a set of optimum LDS parameters that provide the required micro-channel dimensions with the best or the suitable surface roughness. A set of experimental tests are carried out to validate the developed ANN and the RSM models. It has been found that the predicted values for the proposal ANN and RSM models were closer to the experimental values, and the overall average absolute percentage errors were 4.02 % and 6.52%, respectively. Finally, it has been found that, the developed ANN model could be used to predict the response of the LDS process more accurately than RSM model.
... In fact, fine products depend on the quality of the micro channel or the groove after the LDS step, which depends on the groove dimensions (groove width and depth), groove lap dimensions (lap width and height) and finally the interaction width, which refers to the width of the circuit line, see Fig.1. All the above dimensions as well as the groove profile after the LDS process depend on the LDS parameters such as 554 laser power, laser speed and laser frequency (Bassim & Jörg, 2014;Bassim & Jörg, 2015). Another important requirement for the quality and reliability of the MID products is the adhesion strength of the MID structures. ...
... In case of fine line/space products, the interactive width and the lap width must decrease as much as possible. Previously mentioned that the interactive width affects the width of the circuit line, and the lap width affects the space between two circuit lines ( Bassim & Jörg, 2015). Consequently the optimum parameters that give minimum interactive width and lap width as well as the highest Ra and groove depth are: First laser power 0f 9 W, laser speed of 1900 mm/s and laser frequency of 79 kHz and the second laser power of 9 W, laser speed of 2200 mm/s and laser frequency of 78 kHz. ...
... In fact, fine products depend on the quality of the micro channel or the groove after the LDS step, which depends on the groove dimensions (groove width and depth), groove lap dimensions (lap width and height) and finally the interaction width, which refers to the width of the circuit line, seeFig.1. All the above dimensions as well as the groove profile after the LDS process depend on the LDS parameters such as laser power, laser speed and laser frequency (Bassim & Jörg, 2014; Bassim & Jörg, 2015). Another important requirement for the quality and reliability of the MID products is the adhesion strength of the MID structures. ...
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Laser direct structuring (LDS) is very important step in the MID process and it is a complex process due to different parameters, which influence on this process and its final product. Therefore, it is very important to use a reliable model to predict, analyze and control the performance of the (LDS) process and the quality of the final product. In this work we develop mathematical models by using Artificial Neural Network (ANN) and Response Surface Methodology (RSM) to study this process. The proposed models are used to study the effect of the LDS parameters on the groove dimensions (width and depth), lap dimensions (groove lap width and height) and finally the heat effective zone (interaction width), which are important to determine the line width/space in the MID products and the metallization profile after the metallization step. We also study the relationship between the LDS parameters and the surface roughness which is very important factor for the adhesion strength of MID structures. Moreover these models capable of finding a set of optimum LDS parameters that provide the required micro-channel dimensions with the best or the suitable surface roughness. A set of experimental tests are carried out to validate the developed ANN and the RSM models. It has been found that the predicted values for the proposal ANN and RSM models were closer to the experimental values, and the overall average absolute percentage errors were 4.02 % and 6.52%, respectively. Finally, it has been found that, the developed ANN model could be used to predict the response of the LDS process more accurately than RSM model.
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Full-text available
Laser direct structuring (LDS) is critical in the integration of circuits onto 3D‐shaped plastic parts, such as antennas and radio frequency components. The LDS process encompasses three stages: deposition of 3D parts, laser structuring, and metallization. While laser‐direct structurable parts have been manufactured through plastic injection molding, material extrusion (MEX) is a favored additive manufacturing process for economic low‐volume production and fast prototyping advantages. Although injection‐molded LDS literature is available, 3D‐printed laser‐direct structured components merit further investigation. This study focuses on the MEX of catalyst‐loaded polycarbonate (PC) parts and its LDS process. The parameters from the nanosecond fiber laser, including scan speed, power, and frequency, are thoroughly analyzed to understand the surface property changes and metallization performance of the printed PC parts. The single scan track width, which corresponds to the accuracy of conductive path width and metallization thickness, is employed to elucidate the findings. A process map is built to keep the track width constant aimed at enhancing the uniform metallization of intricate components. Thresholds are established, identifying a minimum track width of 22.1 μm and metallization thickness of 2.5 μm. These delineate clusters of process parameters that yield conductivity levels suitable for various applications.