Figure - available from: Journal of Materials Science: Materials in Electronics
This content is subject to copyright. Terms and conditions apply.
Schematic diagram of sample preparation

Schematic diagram of sample preparation

Source publication
Article
Full-text available
With the development of industrial technology, the power module has to suffer from high temperature, high voltage, and high frequency. Meanwhile the effect of temperature and space charge on dielectric properties is becoming more and more serious. The traditional epoxy cannot meet the requirements of high temperature and high insulation. In this wo...

Similar publications

Article
Full-text available
Flame–retardant cycloaliphatic epoxy systems have long been studied; however, the research suffers from slow and unsatisfactory advances. In this work, we synthesized a kind of phosphorus-containing difunctional cycloaliphatic epoxide (called BCEP). Then, triglycidyl isocyanurate (TGIC) was mixed with BCEP to achieve epoxy systems that are rich in...
Article
Full-text available
The size of solder joints in electronic packaging is gradually decreasing, which directly leads to a sharp increase in the current density experienced by the solder joints. Therefore, it is of great significance to study the effect of electromigration on the interface of the lead-free solder. In this paper, the effect of electromigration on the mic...