Table 4 - uploaded by Violeta Tsakiris
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Resistivity and electrical conductivity values of each metal and joints obtained by diffusion welding method.
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Diffusion Bonding is a solid state welding technology which allows joining of similar or different materials: metal-metal, metal-ceramics, ceramics-ceramics etc. A major advantage of this method is new developments of bimetals or dissimilar material couples. Many applications and emerging applications are dependent on dissimilar material joints. Th...
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... resistivity and electrical conductivity tests were realized with the Four-Point Method by TESLA BM 395 bridge. The measurements results are presented in Table 4. The obtained results have shown that the electrical properties for studied dissimilar metallic couples are included in the interval of the electrical conductivity (10 5 and 10 8 Ώ -1 x cm -1 ) and electrical resistivity (10 -5 and 10 -8 Ώ x cm), specific to the metallic materials [8]. ...
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Citations
... The electrical properties, including the electrical resistivity and the electrical conductivity of the metals (Cu and Al), are shown in Table 2 [29]. ...
... Electrical Properties of Aluminum 1050 and Copper[29] ...
Resistance spot welding (RSW) is widely used in the automotive industry, particularly for copper-aluminum alloys in electric cars. RSW joint conductivity is crucial for electric vehicles. Welded parts may fracture due to tension, altering conductivity. The study examines resistance spot post-weld joint metallurgy and deformation-induced conductivity changes. The electric resistance of similar and dissimilar RSW joints was examined during tensile tests. Metallurgical tests for RSW joints revealed an increase in grain size from the base metal (BM) to the heat-affected zone (HAZ) and finally the fusion zone (FZ). Satisfactory shear tension strength results were obtained for dissimilar joints (Al-Cu) at 690 N and similar joints (Al-Al) at 780 N, exceeding the minimum limit of 643 N. However, weld strength in similar joints (Cu-Cu) only achieved 933 N, less than the required strength of 1528 N. Furthermore, the relationship between deformation rate (i.e., applied stress) and electrical resistance has been shown. It was found that resistivity increases with increasing deformation stress, resulting in decreased electrical conductivity with a high percentage, which represents 99.8, 99.66, and 99.49% for Al-Cu, Al-Al, and Cu-Cu RSW joints, respectively. At the maximum force of 650 N and maximum stress of 33.1 MPa, the electrical resistance was measured, and the results show (15.7 Ώ, 5.9 Ώ, and 1.99 Ώ) and the electrical conductivities (0.063 IS, 0.169 IS, and 0.502 IS) for the joints (Al-Cu), (Al-Al), and (Cu-Cu), respectively.
... Conductivity coefficients of some metals[15] ...
This article investigates the feasibility of using pure aluminium for electromagnetic shielding in the 5G frequency region. With the growing proliferation of 5G wireless technologies, concerns over the potential health effects of electromagnetic interference have emerged, and effective shielding solutions are needed. The study examines the shielding effectiveness of pure aluminium at various thicknesses and frequencies, using experimental measurement method. The results indicate that pure aluminium is an effective shielding material in the 5G frequency range, with shielding effectiveness increasing with thickness. As known, aluminium is a cost-effective, easily available and applicable material which can be used alternatively to other shielding materials. In addition to its physical and commercial properties, aluminum has been used as a shielding material in the literature for many frequency regions due to its shielding properties. Electromagnetic shielding efficiencies of aluminium sheets designed in different ways have been measured in this study. The paper concludes that pure aluminium can be a viable solution for electromagnetic shielding in 5G applications. The study highlights the importance of considering shielding effectiveness when designing and implementing 5G systems, and underscores the potential of pure aluminium as a shielding material.
... Nevertheless, it is possible that the higher laser absorptivity of SiC compared to matrix promoted localized particle overheating. SiC has significantly lower electrical conductivity compared to Al matrix, and lower electrical conductivity would reduce the amount of local heating by EPBF electron beam [138][139][140]. At this time, little research can be found on this topic. ...
Many industries such as aerospace, power generation, and ground transportation demand structural materials with high specific strength at elevated temperatures. Up until now, many types of heat‐resistant materials including Ni‐based superalloys, intermetallic compounds, and dispersion‐strengthened alloys have been developed for specific applications in these industries. Moreover, with the recent development of additive manufacturing techniques, these industries can now benefit from the rapid prototyping abilities, geometric freedom, and increased mechanical properties that can be achieved through various additive manufacturing processes. With this in mind, the progress made in additive manufacturing of heat‐resistant intermetallic compounds and ceramic dispersion alloys is herein examined. A brief introduction is provided on the target industries, applications, and the compositions of heat‐resistant alloys of current research interest. Then, recent research on heat‐resistant intermetallic compounds and ceramic dispersion alloys fabricated by additive manufacturing processes such as laser powder bed fusion, laser direct energy deposition, and electron‐beam powder bed fusion are reviewed with information provided on microstructure, processing parameters, strengthening mechanisms, and mechanical properties. Finally, an outlook is provided with future research suggestions.
... The electrocatalytic activity of MPcs has been reported to follow the following order depending on the central metal Fe 2+ > Co 2+ > Mn 2+ > Ni 2+ ≅ Cu 2+ , with Co 2+ and Fe 2+ being the most extensively studied [17]. We explore the use of Cu as a central metal since it has a higher electric conductivity when compared to the metals listed above [18], hence a CuPc derivative has been shown to improve conductivity in dyesensitized solar cells [19]. CuPc derivatives have been employed as electrocatalysts for oxygen reduction reaction [17,20] and in the detection of catechol [21], however, this was done in the presence of complicated mixtures with surfactants or nanomaterials. ...
In this study, four new copper phthalocyanine complexes were synthesised and studied as electrocatalysts for the detection of catechol. Two of these complexes were derived from a symmetrical benzaldehyde phthalocyanine complex via the condensation of the benzaldehyde substituents with amine reagents. The electrocatalysts proved to be highly stable towards the detection of catechol. The oxidation peaks obtained using cyclic voltammetry range from 0.20 to 0.38 V. Detection limits were obtained via chronoamperometry and are as low as 0.16 µM and fairly high sensitives being obtained. Overall all four copper complexes exhibited excellent electrocatalytic activity towards the electrooxidation of catechol.
... The electrocatalytic activity of MPcs has been reported to follow the following order depending on the central metal Fe 2+ > Co 2+ > Mn 2+ > Ni 2+ ≅ Cu 2+ , with Co 2+ and Fe 2+ being the most extensively studied [17]. We explore the use of Cu as a central metal since it has a higher electric conductivity when compared to the metals listed above [18], hence a CuPc derivative has been shown to improve conductivity in dyesensitized solar cells [19]. CuPc derivatives have been employed as electrocatalysts for oxygen reduction reaction [17,20] and in the detection of catechol [21], however, this was done in the presence of complicated mixtures with surfactants or nanomaterials. ...
... 24 It has also been used as gas filler for increasing the brightness and life of lamps and as agent for welding alloys. 25,26 By the extraordinary progress of the electronics industry since the early 1980s, much effort has been devoted to the use of NF 3 as an etching cleaning agent, a laser and a cleaning gas. [27][28][29] Moreover, as an environmentally preferable substitute compound for sulfur hexafluoride or fluorocarbons, NF 3 is found to reduce ozone damage. ...
The competition of hydrogen, halogen and pnicogen bonding to the stability of the atmospheric complexes is interesting, especially where the molecules by the most abundant greenhouse effect in the atmosphere are subject of interest. In the present work, we have computationally studied the addition of H2O to the NF3 and CF2Cl2 molecules to reveal the electronic and structural features of the NF3-H2O and CF2Cl2-H2O complexes through DFT, MP2 and CCSD (T) methods. The interaction energies, geometry and electronic properties including charge transfer, energy gap, NEDA and AIM analyses of all the complexes were calculated to discuss the nature and strength of intermolecular interactions. The results indicate that the role of halogen bonding is more obvious than that of hydrogen and pnicogen bonding, and compared with the NF3, CF2Cl2 is more effectively stabilized by the H2O molecules. In the present work, we have studied the addition of H2O molecule to the NF3 and CF2Cl2 molecules to reveal the electronic and structural features of the NF3-H2O and CF2Cl2-H2O complexes through DFT, MP2 and CCSD (T) methods.
... According to Tsakiris et. al, the conductivity of the copper plate is nearly [28]. The average capacitance of the pair capacitors is 0.17 nF at the rest position as shown in Figure 2. The capacitance values of coupling capacitors are measured by capacitance meter as can be seen in Figure 2. The capacitance values of coupling capacitors are 0.18 nF and 0.16 nF. ...
The main idea of this study is to design a high efficient capacitive power transfer (CPT) system which consists of a load network, a series resonance L-C circuit and MOSFET. The MOSFET was used as a switch with 0.5 duty cycle. The system consists of two main parts which are the CPT system and E-class power amplifier circuit design. In order increase, the efficiency of wireless power transfer system E-class Power amplifier was used. The power telemetry has been realized by the copper capacitive plates with 100 cm2 surface area. The efficiency of the CPT system is 82.1%. Throughput and input power of the system are 4.99 W and 4.1 W, respectively. Also, the switching performance of the E-class power amplifier circuit has been analysed at 1.7 MHz frequency. The circuit was operated at its resonance frequency to increase the efficiency. Finally, the capacitive power transfer system has been designed with 81.2% efficiency at 1.7 MHz frequency and high SNR.
... In order to overcome these problems, solid state welding with a lower heat-input compared to the fusion processes has attracted more attention for welding of the aluminium to copper parts. A literature review shows that (linear) friction welding [1,[8][9][10], diffusion welding [1,4,11,12], friction stir welding [2,[13][14][15], roll welding [16,17], explosive welding [18] and ultrasonic welding [19] are the most commonly solid state processes used for the joining of aluminium to copper parts with various geometries and sizes. Generally speaking, the results of the most previous researches show that the formation of the relatively thick and diverse IMCs such as Al 2 Cu, AlCu and Al 4 Cu 9 leads to the decrease in the strength and increase in the electrical resistance of the joints [8][9][10][11][12][13][14][15][16][17][18][19]. ...
... A literature review shows that (linear) friction welding [1,[8][9][10], diffusion welding [1,4,11,12], friction stir welding [2,[13][14][15], roll welding [16,17], explosive welding [18] and ultrasonic welding [19] are the most commonly solid state processes used for the joining of aluminium to copper parts with various geometries and sizes. Generally speaking, the results of the most previous researches show that the formation of the relatively thick and diverse IMCs such as Al 2 Cu, AlCu and Al 4 Cu 9 leads to the decrease in the strength and increase in the electrical resistance of the joints [8][9][10][11][12][13][14][15][16][17][18][19]. ...
Upset resistance dissimilar welding of aluminium and copper narrow rods was performed. Effect of the interface characteristics was studied on the joint mechanical and electrical properties. Upset resistance welding (URW) was successful for production of joints with high strength and electrical conductivity between aluminium and copper rods. Reaction layer at the joint interface was composed of the Al2Cu cellular phase and lamellar eutectic structure of α-Al and Al2Cu. Enhancement of the welding current and decrease in the upset force increased the reaction layer thickness and strength of the joint. URW had no significant detrimental effect on the electrical conductivity of the weld zone. Neither the joint strength nor the joint electrical conductivity was improved by in situ post weld heat treatment.
... Also many different type of researcher study the structural materials, have made metallographic test on samples was carried out by optical and electron microscopy [7][8][9][10][11][12]. ...
... Recommended hereby for steels, which have a carbon content lower than 0,25 %. Also many different type of researcher study the structural materials, have made metallographic test on samples was carried out by optical and electron microscopy[3,6,8,9,10]. The aim of the analyze trend in the case of the three grades, in order to estimate. ...
The aim of the paper is to assess mathematical relationship between alloying elements and technological deformability indexes. The subject proposed is settled through a laboratory experiment, where plasticity is appraised by pressing tests. Three steel grades are used. (OLT 35 K, 16 Mo 3, 14 CrMo 4) in order to determine their grain growth trend and their initial grain size at austenitization temperature. Structural analysis examined surfaces was performed for each steel grade for the following purposes: to determine the trend of increasing grain; determining initial grain austenitization temperature used in attempts (T-a = 1200 degrees C) determine the deformation temperature austenitic grain.
