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Proposed mechanism of interfacial energy transfer and experimental schematic
a, Hot electron injection: the process typically assumed to occur at metal/semiconductor interfaces after photoexcitation of the metallic contact. In this case, hot electrons are first generated in the Au (1). At sufficiently high electron temperatures, the electrons traverse the interface and add charge to the conduction band (CB) of the semiconductor (2). b, Ballistic thermal injection (BTI): our proposed process for metal/semiconductor interfaces after an ultrafast excitation of the metal contact. This mechanism relies on hot-electron generation in the metal (1); prior to the electron–phonon coupling (less than a couple of picoseconds), energy propagates ballistically towards the metal/semiconductor interface. The electron energy front reaches the interface, whereby the electrons transfer their energy (2), rather than charge, to the pre-existing free electrons in the semiconductor’s conduction band. The pre-existing semiconductor’s electrons are now at an elevated temperature (see electron temperature profile in c, depicted by the purple and blue curves), and are promoted to elevated states in the conduction band (3) (for example, intraband excitations). Note that the scattering processes after either charge injection or the proposed BTI energy transfer mechanism, such as hot electron–electron scattering, are excluded for clarity. c, Schematic of our ultrafast ENZ experiment to spatially resolve the electron energy distribution after the potential injection processes. The 520 nm pump beam excites the Au surface at the Au/air interface, and a subpicosecond probe pulse monitors the ENZ mode of a thin Y:CdO film. EF, Fermi energy; MIR, mid-infrared; Te, electron temperature; VB, valence band.

Proposed mechanism of interfacial energy transfer and experimental schematic a, Hot electron injection: the process typically assumed to occur at metal/semiconductor interfaces after photoexcitation of the metallic contact. In this case, hot electrons are first generated in the Au (1). At sufficiently high electron temperatures, the electrons traverse the interface and add charge to the conduction band (CB) of the semiconductor (2). b, Ballistic thermal injection (BTI): our proposed process for metal/semiconductor interfaces after an ultrafast excitation of the metal contact. This mechanism relies on hot-electron generation in the metal (1); prior to the electron–phonon coupling (less than a couple of picoseconds), energy propagates ballistically towards the metal/semiconductor interface. The electron energy front reaches the interface, whereby the electrons transfer their energy (2), rather than charge, to the pre-existing free electrons in the semiconductor’s conduction band. The pre-existing semiconductor’s electrons are now at an elevated temperature (see electron temperature profile in c, depicted by the purple and blue curves), and are promoted to elevated states in the conduction band (3) (for example, intraband excitations). Note that the scattering processes after either charge injection or the proposed BTI energy transfer mechanism, such as hot electron–electron scattering, are excluded for clarity. c, Schematic of our ultrafast ENZ experiment to spatially resolve the electron energy distribution after the potential injection processes. The 520 nm pump beam excites the Au surface at the Au/air interface, and a subpicosecond probe pulse monitors the ENZ mode of a thin Y:CdO film. EF, Fermi energy; MIR, mid-infrared; Te, electron temperature; VB, valence band.

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Article
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Light–matter interactions that induce charge and energy transfer across interfaces form the foundation for photocatalysis1,2, energy harvesting³ and photodetection⁴, among other technologies. One of the most common mechanisms associated with these processes relies on carrier injection. However, the exact role of the energy transport associated with...

Citations

... The concomitant electronic relaxation and scattering processes during these non-equilibrium conditions for metals can have significant influence on several of their physical properties [12,[17][18][19][20][21][22]. In particular, during such highly nonequilibrium conditions, thermal transport processes in noble metals can be drastically different as compared to equilibrium or near-to-equilibrium conditions [17,19,[23][24][25], which can critically underpin the design considerations and engineering of the aforementioned applications. For instance, in photothermal therapy, the knowledge of thermal transport coefficients is highly desirable to quantitatively describe the heat transfer processes [26][27][28], critical in quantitatively determining the amount of laser energy absorbed by gold nanoparticles. ...
... Using equation (23) in the integral with dash in equation (22), we get, ...
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... Several applications relevant for next generation electronics are based on metal semiconductor interfaces. These rely on ultrafast thermionic carrier injection from the metal film to the semiconductor layer under conditions when the metal electron temperatures are highly elevated with respect to its lattice temperature [11,12]. On a more fundamental level, the thermal management and ultrafast cooling dynamics of localized hot spots on optically excited metal surface [13] or metal nano structures [14] on dielectrics is important for investigations on heat transport. ...
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... Unlike at metal/metal interfaces, at metal/non-metal interfaces, the negligible number density of free electrons available in the non-metal leads to the electron−electron thermal boundary conductance becoming a nonexistent heat transfer pathway, consistent with the diffuse mismatch model for electrons described above. In the case that the non-metal is doped to increase the free electron number density, this electron−electron thermal pathway can begin to contribute to thermal conductance, 138 which we describe in more detail later in this section. Given this, the three assumed mechanisms for electron−phonon coupling heat transfer at metal/non-metal interfaces are (i) electrons in the metal coupling to phonons in the non-metal across the metal/non-metal interface, (ii) electrons in the metal coupling to phonons in the metal on the metal side of the metal/non-metal interface, and (iii) subsequent phonon−phonon conductance across the interface. ...
... A CLE process between hot electrons in a metal and electrons and phonons in a doped non-metal was recently observed by Tomko et al. 138 at Au/doped CdO interfaces, a process deemed "ballistic thermal injection" (BTI). Ballistic thermal injection (BTI) is a recently discovered energy transduction mechanism that arises from the CLE dynamics at metal/non-metal interfaces. ...
... 154,155 However, this process has only begun to be studied, and thus, additional investigations into different material interfaces and the role of CLE on enhancing this BTI process are warranted and would result in hotelectron-based control over various material functionalities. For example, in the work from Tomko et al., 138 they used this BTI process to control the infrared plasmonic response of CdO via ultrafast thermal modulation of CdO's epsilon near zero mode. ...
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... While Coulomb attraction between the transferred electrons and remaining holes limits the charge transfer, the energy transfer does not have such limitation and large amounts of energy can flow rapidly by the charge-charge scattering mechanism. Reproduced, with permission, from [79]. ...
... Focusing on an Au/CdO interface, Tomko et al. [79] reported experimentally that in cases of strong nonequilibrium, photoexcited metals can undergo an electron-mediated ballistic energy transfer to a non-metal substrate, without charge injection. They termed this effect ballistic thermal injection (BTI). ...
... TD-DFT also represents a unique tool to investigate the photoinduced charge transfer mechanisms taking place at the plasmonic NP surface [144,145]. First-principles techniques have for instance been employed to corroborate experimental observations of a ballistic thermal injection at a metal/semiconductor interface [146], to rationalize ultrafast electron transfer dynamics in heterostructures [147] and 2D materials [148], or to gain insight into the effects of plasmons in photocatalysis [149]. Unfortunately, these calculations suffer from an applicability upper limit, set by numerical complexity. ...
Article
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... The main advantage of this system lies in facilitating charge separation across the interfacial Schottky barrier [109,148]. The carrier lifetimes can be extended by spatially separation of hot electrons from holes over metal-semiconductor interface [149]. Besides, the depletion region built within semiconductor can sweep hot-electrons away from the metal-semiconductor interface, further reducing the charge recombination [150]. ...
Article
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Preprint
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