Figure 3 - available via license: Creative Commons Attribution 3.0 Unported
Content may be subject to copyright.
Source publication
This paper overviews existing digital communication buses which are commonly used in sensor networks, discusses sensor network architectures, and introduces a new sensor bus for low power microsystem applications. The new intra-module multi-element microsystem (IM2) bus is nine-line interface with 8b serial data which implements several advanced fe...
Context in source publication
Context 1
... objective of the standard is to provide a common digital interface between transducers and the network communications nodes, and consequently facilitate the transducer manufacturers to develop smart devices and to interface those devices to networks, systems, and instruments by incorporating existing and emerging sensor and networking technologies. The physical representation of IEEE P1451 standard is shown in Figure 3. as an integral part of the STIM, and it defines the TII bus. ...
Similar publications
Finite impulse response (FIR) filters are widely used in various DSP applications. The low-power or
low-area techniques developed specifically for digital filters can be found in. Many applications in digital
communication (channel equalization, frequency channelization), speech processing (adaptive noise
cancelation), seismic signal processing (no...
Citations
... In Europe and Asia is common the use of High Altitude Balloon for transmission and reception testing [7], reaching distance and energy-efficiency records in the new transmitters that in the future will use technology equipped with the Internet of Things [8]. Paulet-1 has 2 components: The Balloon and the Space Probe (composed by the Payload Module and the Communications Module), which are presented in Fig. 1. ...
... For sensors the I2C BUS [4] was used, and for storage the SPI BUS, which allows the conection of multiple devices [5] to be used as master-slave mode performance (Fig. 10) where 2 sensors are connected using the I2C BUS. For sending and receiving DATA, Atmega 328p-au microcontroller with one UART port [6] was used in order to communicate with the GPS and the GSM modules [8], as shown in Fig. 11, with the porpuse to receive information from the satellites to get location coordinates a GPS was used, and the GSM module to send DATA from the microcontroller through text messages. ...
... In recent years, the micro-electro-mechanical system (MEMS) has almost become a vital technology for modern society because of its small volume, low power consumption, low cost, and ease of integration into systems or modification [3]. The MEMS technology creates entirely innovative kinds of products, such as gyroscope sensor in camera-shake detection systems [4], multi-axis inertial motion sensors for smartphone-based navigation [5], and rehabilitation systems based on inertial measurement units (IMUs) [6]. ...
... CAN is a serial communication bus originally developed by the German company Bosch for the automotive industry, envisaged to replace the existing complex wiring harness with a two-wire bus[13]. It has a high immunity to electrical interferences, making it more suitable to use with big machines than other solutions such as the ones reviewed in[14]that include I 2 C. It has also self-diagnose and data error recovery capabilities. These features explain the CAN bus popularity in a wide variety of industrial domains including automotive, marine, medical, manufacturing and aerospace. ...
In this article, we present a CAN-based (Controller Area Network) distributed system to integrate sensors, actuators and hardware controllers in a mobile robot platform. With this work, we provide a robust, simple, flexible and open system to make hardware elements or subsystems communicate, that can be applied to different robots or mobile platforms. Hardware modules can be connected to or disconnected from the CAN bus while the system is working. It has been tested in our mobile robot Rato, based on a RWI (Real World Interface) mobile platform, to replace the old sensor and motor controllers. It has also been used in the design of two new robots: BellBot and WatchBot. Currently, our hardware integration architecture supports different sensors, actuators and control subsystems, such as motor controllers and inertial measurement units. The integration architecture was tested and compared with other solutions through a performance analysis of relevant parameters such as transmission efficiency and bandwidth usage. The results conclude that the proposed solution implements a lightweight communication protocol for mobile robot applications that avoids transmission delays and overhead.
... Zhou et al. reported that low cost and high reliability serial bus sensor network for intelligent sensor system. Several existing serial buses, I 2 C (integrated circuit commonly referred to as "two wire interface"), and SPI (serial peripheral interface), TII (transducer independent interface) have been reviewed for different applications [33]. Bissi et al. described the structure of IEEE 1451 standards multiprocessor control system and they also explained the RS232 asynchronous communication between STIM and NCAP [34], [35]. ...
In this paper, we have discussed the sensor-based applications and what is necessary for the dissimilarities in hardware realization and algorithm. This paper presents the existing state-of-the-art of IEEE 1451 standard-based sensor applications and is mainly focused on standard transducer interface module (STIM), network capable application processor (NCAP), and transducer-independent interface (TII). They have some major factors that are regularly imperative in the development of IEEE 1451 standard-based applications,
such as plug and play facility, for one or more than one STIM, communication protocols/network’s, architecture, reliability, maintenance, accuracy, easy to use, cost, transducer electronic data sheet, test facility, and so on. The above concerns are also summarized by reference to research articles on STIM, NCAP, and TII. Highlighting is on the predictability of dynamic applications that concentrate on the above mentioned criteria.
... Íåçàëåaeíèé ³íòåðôåéñ TII ÿâëÿº ñîáîþ 10òè ðîçðÿäíó øèíó, ïîáóäîâàíó íà áàç³ ïðîòîêîëó ïîñë³äîâíîãî ñèíõðîííîãî ³íòåðôåéñó SPI, ÿêèé øèðîêî âèêîðèñòîâóºòüñÿ äëÿ ð³çíèõ ñåíñîð³â. Àíàëîã³÷íî SPI, TII ³íòåðôåéñ òàêîae ìຠ8-ìè ðîçðÿäíó øèíó äàíèõ [9]. ...
... Ó áàãàòüîõ ñåíñîðíèõ ñèñòåìàõ âèêîðèñòîâóºòüñÿ òàêîae àëüòåðíàòèâíà àðõ³òåêòóðà çºäíàííÿ ³íòåëåêòóàëüíèõ ñåíñîð³â ³ ñåíñîðíèõ ìåðåae, ÿê³, â ñâîþ ÷åðãó, êåðóþòüñÿ ñèñòåìàìè á³ëüø âèñîêîãî ð³âíÿ [9]. Ïðè òàêîìó ï³äõîä³ êîaeíèé ñåíñîðíèé ìîäóëü ïîâèíåí ì³ñòèòè ÓÏ×Ê-1. ...
В статті описані розширення і адаптація стандарту IEEE 1451 для сенсорів частотно-часової групи. Показано, що при використанні одного універсального компонента – УПЧК-1 – будь-який існуючий частотний сенсор може бути перетворений в інтелектуальний з можливістю самоідентифікації і самоадаптації. Такий підхід до проектування IEEE 1451-сумісних сенсорів дає істотні переваги як виробникам, так і споживачам. Прогнозується збільшення ринку інтелектуальних сенсорів на 15-20 %.
... Zhou et al. reported that low cost and high reliability serial bus sensor network for intelligent sensor system. Several existing serial buses, I 2 C (integrated circuit commonly referred to as "two wire interface"), and SPI (serial peripheral interface), TII (transducer independent interface) have been reviewed for different applications [33]. Bissi et al. described the structure of IEEE 1451 standards multiprocessor control system and they also explained the RS232 asynchronous communication between STIM and NCAP [34], [35]. ...
In this paper, we have discussed the sensor-based applications and what is necessary for the dissimilarities in hardware realization and algorithm. This paper presents the existing state-of-the-art of IEEE 1451 standard-based sensor applications and is mainly focused on standard transducer interface module (STIM), network capable application processor (NCAP), and transducer-independent interface (TII). They have some major factors that are regularly imperative in the development of IEEE 1451 standard-based applications, such as plug and play facility, for one or more than one STIM, communication protocols/network’s, architecture, reliability, maintenance, accuracy, easy to use, cost, transducer electronic data sheet, test facility, and so on. The above concerns are also summarized by reference to research articles on STIM, NCAP, and TII. Highlighting is on the predictability of dynamic applications that concentrate on the above mentioned criteria.
... There are various interfaces between a sensor and a computer. They are anolog to digital conversion, serial communication, Serial Peripheral Interface (SPI), Inter-IC (I 2 C) bus interface and serial communication interface (RS-232) (Zhou and Mason, 2002). It is confusing for a computer to communicate with some sensors with different interfaces. ...
In the conservation of water environments, it is necessary to monitor the physico-chemical parameters, such as color of water, spectroscopic data of water surface, CO2 density, temperature and pressure around the shore. However, the designing of a flexible multi parameter sensing system using a computer is generally considered expensive. In addition, programming and circuitry of a multi-parameter sensing system is complex. A computer also requires electrical power. In this paper, we propose a new technique to modularize sensors. Applying this technique, a multi-parameter sensing system can be constructed with relative ease, and a controlling program of computer and an electrical circuit can be simplified. Using a small computer, a prototype measurement system was constructed and fundamental measurement was carried out. The power consumption and data acquisition process are also discussed.
... In addition, the SPI interfaces have multiple operating modes to support several different external components. For backwards compatibility, there is an environmental mode to support the UMSI chip interfaces [48].There is also a cochlear mode to interface directly with the custom Michigan Electrode Array [16]. ...
The National Science Foundation Wireless Integrated Microsystems (WIMS) Engineering Research Center at the University of Michigan developed Systems-on-a-Chip to achieve biomedical implant and environmental monitoring functionality in low-milliwatt power consumption and 1-2 cm3 volume. The focus of this work is implantable electronics for cochlear implants (CIs), surgically implanted devices that utilize existing nerve connections between the brain and inner-ear in cases where degradation of the sensory hair cells in the cochlea has occurred. In the absence of functioning hair cells, a CI processes sound information and stimulates the nderlying nerve cells with currents from implanted electrodes, enabling the patient to understand speech.
As the brain of the WIMS CI, the WIMS microcontroller unit (MCU) delivers the communication, signal processing, and storage capabilities required to satisfy the aggressive goals set forth. The 16-bit MCU implements a custom instruction set architecture focusing on power-efficient execution by providing separate data and address register windows, multi-word arithmetic, eight addressing modes, and interrupt and subroutine support. Along with 32KB of on-chip SRAM, a low-power 512-byte scratchpad memory is utilized by the WIMS custom compiler to obtain an average of 18% energy savings across benchmarks. A synthesizable dynamic frequency scaling circuit allows the chip to select a precision on-chip LC or ring oscillator, and perform clock scaling to minimize power dissipation; it provides glitch-free, software-controlled frequency shifting in 100ns, and dissipates only 480μW.
A highly flexible and expandable 16-channel Continuous Interleaved Sampling Digital Signal Processor (DSP) is included as an MCU peripheral component. Modes are included to process data, stimulate through electrodes, and allow experimental stimulation or processing. The entire WIMS MCU occupies 9.18mm2 and consumes only 1.79mW from 1.2V in DSP mode. This is the lowest reported consumption for a cochlear DSP.
Design methodologies were analyzed and a new top-down design flow is presented that encourages hardware and software co-design as well as cross-domain verification early in the design process. An O(n) technique for energy-per-instruction estimations both pre- and post-silicon is presented that achieves less than 4% error across benchmarks.
This dissertation advances low-power system design while providing an improvement in hearing recovery devices.
... Application layer is the interface for the users who are running their application software. More detailed description can be found in [20]. Presented layer architecture of wireless sensor network protocol stack can fluctuate from this universal configuration. ...
Wireless sensor networks have a wide range of applications and can be used for various purposes in different environments. Wireless sensors are small and they are mostly using battery supplies. Communication, sensing and computing have the most influence on performance and power consumption of wireless sensor networks. In this paper we describe layered architecture of wireless sensor network protocol stack and discuss the advantages of cross-layer approach. The articles that are using a cross-layer approach for improving performances and energy preservation in wireless sensor networks are reviewed and state of the art is presented. One of the fundamental problems for wireless sensor networks is how to systematically make a performance evaluation. Because there are plenty of different wireless sensor network optimization methods there should be a universal benchmark suite. We have proposed some useful guidelines for its development.
... The architecture of the overall microsystem plays a significant role in determining the required functions and performance of the interface circuit. To support the collection of a wide array of transducers in a modular and flexible system, we adopted our multilayered network structure [21] shown in Fig. 1. This scheme is tailored to low-power microsystems where transducer data is transported through a series of increasingly sophisticated electronics and power hungry resources are shared among sensor nodes. ...
... Through careful consideration of design tradeoffs between performance and versatility iterated over several generations of transducer interface circuits [4], [5], [13], the organization of functional blocks shown in Fig. 2 was determined to best meet these goals. A sensor bus interface block provides bidirectional communication with the microsystem controller over an intramodule microsystem sensor bus [21]. A built-in serial peripheral interface (SPI) can route bidirectional data between a selected peripheral device and the microsystem controller. ...
... The UMSI chip utilizes the sensor bus [21] which has evolved from prior work with microsystems [1]. ...
A reconfigurable transducer interface circuit that combines the communication and signal conditioning necessary to link a variety of sensors and actuators to a microsystem controller is reported. The adaptive readout circuitry supports high-resolution signal acquisition from capacitive, resistive, voltage and current mode sensors with programmable control of gain and offset to match sensor range and sensitivity. The chip accommodates sensor self test and self calibration and supports several power management schemes. It provides digital and analog outputs to control actuators and a standard interface to peripheral components. The 2.2times2.2 mm CMOS chip was fabricated in 0.5-mum, 3-metal, 2-poly process, dissipates ~50 muW at 3.3 V in a typical multisensor application utilizing periodic sleep mode, and can read out a wide range of sensors with high sensitivity. A prototype microsystem with a microcontroller and MEMS pressure, humidity, and temperature sensors has been implemented to characterize interface chip performance
