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A novel system-in-package (SiP) implementation is presented for a transmitter (TX) module which makes use of electromagnetic coupling between the TX chip and package antennas at 5.2 GHz. The TX chip is realized in 0.13 mum CMOS process and comprises an on-chip antenna. This on-chip antenna serves as the oscillatorpsilas inductor as well. The TX chi...
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Citations
... LTCC-based circuits have an extensive range of applications in areas such as telecommunications, automotive aeronautics, radio frequency (RF) modules (Mobile phone, Bluetooth, Home RF, IEEE 802.11), microwave modules, optoelectronic modules, and medical, military, and sensors packaging [17][18][19]. Many researchers have investigated the feasibility of antenna in package (AiP) and system on package (SOP) using LTCC technology, and some major accomplishments are reported in the literature [20][21][22][23][24][25][26][27][28][29]. ...
??????This paper presents a chronological review of the research carried out on antennas in low-temperature cofired ceramics
(LTCC) technology over the last ten years or so. Major breakthroughs in LTCC technologies and its shortcomings
are highlighted. The current state of the art of LTCC-technology-based antennas is then evaluated. All
realizable features of the LTCC-based antennas, which are compact and of light weight and offer high-speed functionality
for portable electronic devices, are illustrated. Different techniques used by researchers for broadbanding,
multiband designs, and fabrication of LTCC-based antennas are also presented. This paper ends with some recommendations
and concluding remarks.
... The measured results in [10] are obtained using a microstrip feed and via combination, which does not reflect the complexities of real chip-to-package coupling. Our previous work [11] alleviated the above problems by proposing a novel SoP concept, which employs a wireless interconnect between the RF chip and the LTCC antenna. The design makes use of electromagnetic coupling from the on-chip loop antenna, which also acts as an inductor for the Transmitter (TX) Voltage Controlled Oscillator (VCO), to a slot in the ground plane and eventually to the LTCC patch antenna. ...
... However, the use of an off-chip antenna requires the buffer amplifiers to isolate the VCO from any loading. Our previous work [11] clearly demonstrates that the power consumption of the TX module increased to 38 mW with a conventional connection to an off-chip antenna. On the contrary, a wireless connection such as the proposed aperture coupled technique can avoid this additional power consumption. ...
A novel System-on-Package (SoP) implementation is presented for a transmitter (TX) module which makes use of electromagnetic coupling between the TX chip and the package antenna. The TX chip is realized in 0.13μm CMOS process and comprises an on-chip antenna, which serves as the oscillator's inductor as well. The TX chip is housed in a Low Temperature Co-fired Ceramic (LTCC) package with a patch antenna. The on-chip antenna feeds the LTCC patch antenna through aperture coupling, thus negating the need for RF buffer amplifiers, matching elements, baluns, bond wires and package transmission lines. This is the first ever demonstration of wireless-interconnect between on-chip and package antennas which increases the gain and range of the TX module manyfold with respect to the on-chip antenna alone. Though the range of the TX SoP increases considerably, power consumption remains the same as that of the TX chip only. A simple analytical model for the new wireless-interconnect has been developed which helps determine the optimum position of the chip with respect to the aperture in the ground plane.
... Our previous work has demonstrated that the aperturecoupled technique is very suitable for LTCC medium [10]. We have also demonstrated that antenna gain can be enhanced manifolds utilizing a magnetic superstrate in LTCC SoP design [11]. ...
A novel Low Temperature Co-fired Ceramic (LTCC) based SoP for automotive radar applications is presented. For the first time a combination of a relatively low dielectric constant LTCC substrate and a high dielectric constant LTCC superstrate has been incorporated to enhance the overall gain of the module. The superstrate can provide additional protection to the integrated circuits (IC) in the harsh automotive environment. A custom cavity in the LTCC substrate can accommodate the IC, which feeds an aperture coupled patch antenna array. The cavity is embedded below the ground plane that acts as a shield for the IC from antenna radiation. It is estimated that with mere 10 dBm of transmitted RF power the miniature SoP module (sized 2.0 cm × 2.0 cm × 0.22 cm) can communicate up to 67 m. The design's compactness, robustness, transmission power and resultant communication range are highly suitable for Universal Medium Range Radar (UMRR) applications.
The inter-chip wireless connection structure based on PCB medium is presented, and a 60 GHz monopole antenna is designed. The radius of the antenna is 0.04 mm, and it is 0.84 mm in length. Antenna 1, 2, 3 and 4 replace four pins of four different chips and penetrate into the PCB's medium, whose thickness is 2 mm, area is 20 mm×20 mm. Take antenna 1 as the transmitter and others as the receivers. The S-parameters of the model are simulated by using HFSS software. The simulation results of S11, S21, S31 and S41 are -19.00, -64.75, -64.75 and -76.30 dB, respectively. When the source is driven by a 60 GHz sine wave with the amplitude of 5 V, the amplitudes of signal received by the antenna 2, 3 and 4 are respectively 4.80, 4.80 and 0.47 mV. When the source is alternated by the 120 Gbit/s pseudo random binary code, the eye diagram of the receiver is clear, which verifies the feasibility of the monopole antenna used for inter-chip wireless connection.
