Figure 5 - uploaded by Maxime Barriere
Content may be subject to copyright.
Download
View publication
Overview of the top-surface of the IGBT with silver-filled epoxy resin layer on the gate and emitter electrodes using profilometer 

Overview of the top-surface of the IGBT with silver-filled epoxy resin layer on the gate and emitter electrodes using profilometer 

Source publication
Figure 1: 3D silver sintering process setting 
Figure 2: Bridge rectifier using a double-sided cooling power package 
Figure 4: IGBT die before (left) and after (right) epoxy resin deposit. 
Figure 5: Overview of the top-surface of the IGBT with silver-filled...
Figure 6: Substrate after mechanical and chemical treatment (left) and...
Silver Sintered Double-Sided Cooling Power Package Process for Controlled Si Power Semiconductor Devices With Aluminum Top-Metallization
Research
Full-text available
  • Nov 2015
An innovative process to realize 3D packages with controlled Si-power semiconductor devices has been developed. We purpose, for the first time and based on a low-cost process, to make compatible the silver sintering process with aluminum top-metallization dice. The use of a silver epoxy resin allows to process the top metallization of silicon dice....
Cite
Download full-text

Context in source publication

Context 1
... conventional screen-printing method, it is possible to obtain a 40µm thick silver filled epoxy resin ( fig. 4). Silver layer is quiet regular as illustrated in figure 5 and is sufficient to perform silver sintering process on this new metallized surface. ...

Similar publications

Figure 14: Breakdown voltage and leakage current at 25°C  
Silver sintered double-sided cooling power package process for controlled Si power semiconductor devices with aluminum top-metallization
Conference Paper
Full-text available
  • May 2015
An innovative process to realize 3D packages with controlled Si-power semiconductor devices has been developed. We purpose, for the first time and based on a low-cost process, to make compatible the silver sintering process with aluminum top-metallization dice. The use of a silver epoxy resin allows to process the top metallization of silicon dice....
View