Optical micrographs of cross-sections at the weld interface: (a-c) microasperities; ( d-f) locations with attached Al fragments.

Optical micrographs of cross-sections at the weld interface: (a-c) microasperities; ( d-f) locations with attached Al fragments.

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Ultrasonic metal welding (USMW) is widely used in assembling lithium-ion (Li-ion) battery packs due to its advantages in joining dissimilar and conductive materials in the solid state. However, the welding process and mechanisms are not yet clearly understood. In this study, dissimilar joints of aluminum alloy EN AW 1050 to copper alloy EN CW 008A...

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... optical micrographs of cross-section I at different welding times in Stage I are shown in Figure 6. To learn the weld formation process, we focused on two characteristic regions: the microasperities (a-c) and the locations with attached Al fragments (d-f) on the Cu surface, which were mainly localized under the indentation of the sonotrode. ...
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... shown in Figure 6a,d, a gap was located at the weld interface in both regions when the welding time was shorter than 75 ms. Nevertheless, the attached Al fragments were discovered on the copper surface in the unbonded regions, which indicated that a metallurgical bonding between Al and Cu was already achieved at this time. ...
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... the attached Al fragments were discovered on the copper surface in the unbonded regions, which indicated that a metallurgical bonding between Al and Cu was already achieved at this time. Furthermore, Figure 6d shows that the Al surface fits the outline of the Al fragments. It is suggested that the initial bonding between Al and Cu fractured on the Al side under the shear stress, resulting in the formation of attached Al fragments on the Cu surface. ...
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... gap between Al and Cu was clearly reduced, and the microasperity of Cu penetrated into Al at a welding duration of 100 ms. As shown in Figure 6b, a strong bonding was formed on the top of the microasperity. Simultaneously, local bonding between the Al and Al fragments can be observed in Figure 6e, which was characterized by bonding with some inside cracks. ...
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... shown in Figure 6b, a strong bonding was formed on the top of the microasperity. Simultaneously, local bonding between the Al and Al fragments can be observed in Figure 6e, which was characterized by bonding with some inside cracks. Additionally, more and more unbonded regions on the Cu surface were covered by attached Al fragments, which could have promoted the formation of the bonding between the Al and Al fragments. ...
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... a result, a continuous weld line was observed at the weld interface. As shown in Figure 6c, the microasperity penetrated completely into the Al, where mechanical interlocking could be generated and enhance the joint strength. Nevertheless, there were still a few microcracks that appeared on the Al side, which further confirmed the bonding formed between the Al and attached Al fragments. ...
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... the welding time was 75 ms, minimal residual Al remained on the surface, and traces of Al oriented in line with the RD. Because no actual joint was form at this time, this residual Al should have been the attached Al fragments shown in Figu 6. This suggests that the initial Al/Cu bonding mainly concentrated on the microasperiti As the welding duration increased, the microwelds grew in the OD, and large continuo welded areas were formed. ...
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... the welding time was 75 ms, minimal residual Al remained on the Cu surface, and traces of Al oriented in line with the RD. Because no actual joint was formed at this time, this residual Al should have been the attached Al fragments shown in Figure 6. This suggests that the initial Al/Cu bonding mainly concentrated on the microasperities. ...

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... The relation between copper and aluminum cross-sections under optimized parameters (a) associated with Al cross-sections (b) associated with Al cross-sections under different locations and (c) associated with Al and Cu cross-sections. Reproduced with permission from IOP-MDPI publisher[39,128]. ...
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