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Microstructure of alumina (a) sintered at 1000°C for 20 min with the SiC molding set and (b) sintered at 1150°C for 20 min with the graphite molding set. The heating rate is 50°C/min for both cases. Owing to the low etching temperature (900°C) for the SiC set, the grain boundaries in (a) are less clear. The inset is an appearance of the sintered alumina of 1 mm in thickness.  

Microstructure of alumina (a) sintered at 1000°C for 20 min with the SiC molding set and (b) sintered at 1150°C for 20 min with the graphite molding set. The heating rate is 50°C/min for both cases. Owing to the low etching temperature (900°C) for the SiC set, the grain boundaries in (a) are less clear. The inset is an appearance of the sintered alumina of 1 mm in thickness.  

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Fully dense transparent alumina is obtained after spark plasma sintering at 1000°C by using the electrically conductive SiC molding set. Compared to the conventional graphite set, the new mold material lowered the sintering temperature by 150°C for full densification. The SiC set has a lower electrical conductivity than that of the graphite set, wh...

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... After the initial heating by the outer graphite mold, SiC gains adequate electrical conductivity and can function as a resistive heating element at high temperatures. Incidentally, the lower electrical conductivity of SiC may result in a stronger field effect during sintering which can enhances diffusion, as suggested by Kim et al. [44]. ...
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