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Mechanical properties of PGA package substrate. 

Mechanical properties of PGA package substrate. 

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Table 1. Mechanical properties of PGA package substrate. 
Fig. 2. Failure modes of the PGA package[Ref. SAMSUNG...
Fig. 3. FEA model and analysis condition  
Fig. 4. Taguchi design factors and levels of PGA package.  
+3 Fig. 5. Main effects plot for SN ratios of the taguchi design factors.  
Stress Analysis and Lead Pin Shape Design in PGA (Pin Grid Array) Package
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  • Jan 2011
Research about the geometry design of lead pin was carried based on the normal or shear stress of the interface between a lead pin and a PCB in terms of delamination failure. The taguchi method with four design factors of three levels and FEA(Finite element Analysis) are carried under bending and 50 tension of lead pin. The contact width, d2, betwe...
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