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Maps of minority charge carrier lifetime (left, scale bar [0.14 ; 0.3] µs) and resistivity (right, scale bar [0.5 ; 2] Ω.cm) of solidified injection molded wafer (without last expelled liquid)  

Maps of minority charge carrier lifetime (left, scale bar [0.14 ; 0.3] µs) and resistivity (right, scale bar [0.5 ; 2] Ω.cm) of solidified injection molded wafer (without last expelled liquid)  

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Figure 1: Experimental septup of simplified vertical mono-wafer molding...
Figure 2: Optical microscopy in the cross section of solidified sample...
Figure 3: Optical microscopy in the cross section of solidified sample...
Figure 4: Crack free silicon wafer molded using the mono-wafer vertical...
Figure 10: Maps of minority charge carrier lifetime (left, scale bar...
Cristalline defects and segregation in directionally solidified molded Si wafers
Conference Paper
Full-text available
  • Oct 2012
Photovoltaic silicon wafers are currently obtained through ingot casting in silica crucibles covered by a porous silicon nitride coating which prevents sticking of solidified silicon to the crucible. The purpose of this work is to develop a new injection molding process of multicrystalline silicon wafers in order to avoid kerf losses due to the wir...
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Figure 1: Experimental septup of simplified vertical mono-wafer molding...
Figure 2: Optical microscopy in the cross section of solidified sample...
Figure 3: Optical microscopy in the cross section of solidified sample...
Figure 4: Crack free silicon wafer molded using the mono-wafer vertical...
Figure 10: Maps of minority charge carrier lifetime (left, scale bar...
Direct Silicon Wafer Molding
Article
Full-text available
  • Jan 2012
Photovoltaic silicon wafers are currently obtained through ingot casting in silica crucibles covered by a porous silicon nitride coating which prevents sticking of solidified silicon to the crucible. The purpose of this work is to develop a new injection molding process of multicrystalline silicon wafers in order to avoid kerf losses due to the wir...
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