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Intrinsic phonon-phonon scattering rates in silicon, temperature at 300, 600, and 1000 K, calculated within the RTA.

Intrinsic phonon-phonon scattering rates in silicon, temperature at 300, 600, and 1000 K, calculated within the RTA.

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The miniaturization and higher power density of modern electronics pose a significant challenge in thermal management. A key focus in addressing this challenge revolves around the advancement of thermal interfaces within microchip packaging, aiming to enhance thermal energy dissipation and optimization of performance. Copper nanowires are extensive...