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Nowadays, the development and improvement of physical and mechanical properties of lead-free solders have become a topic of interest for researchers, because the use of lead-containing solders has been banned. In this paper, Sn-5 wt% Sb-0.7 wt% Cu (SSC507) solder is microalloyed by germanium. Alloys were prepared by vacuum induction melting, and th...
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Citations
... Group I) Reactive materials such as Ni [6,7,[12][13][14][15], Fe [7,13,16,17], Cu [12,14,18], Ag [13,14,18], Bi [7,9,12,17], Co [7,[12][13][14]16,19], Ge [12,20], Ce [7,8,12], Ga [12], Sb [7,12], In [7,12], Ti [7,12,14], Al [7,14], Mn [7,8,[12][13][14], Zn [7,12,14], Te [6,16], Mg [12,21], Group II) Non-reactive materials such as oxides: Al 2 O 3 [14,22], Fe 2 O 3 [14,[23][24][25], CeO 2 [14,26,27], ZnO [14,28,29], ZrO 2 [14], TiO 2 [14,25,30], NiO [14,25], carbides: TiC [14,31], SiC [32], and carbon allotropes: CNT [10,13,14,33], MWCNT [13,34], graphene [11,14,[35][36][37] Group III) Core/shell materials such as Ag-GNSs [37][38][39][40] and Ni-GNSs [33,41]. ...
Microstructural modification and mechanical strength enhancement of lead-free Sn–Ag–Cu solder alloys using reinforcing particles have been a focus of the researcher's attention. In this research, Cobalt-decorated Graphene NanoSheets (Co-GNSs) as core/shell dopant particles with concentrations ranging from 0 to 0.5 wt% were added to the low silver Sn–0.3Ag–0.7Cu (SAC0307) solder and the influence of the composite formulation on the microstructure and mechanical properties of the solder bulk was comprehensively examined. Additionally, copper specimens were soldered using the composite solders, and the microstructure of the solder/copper substrate, along with its correlation to the tensile-shear strength of the soldered joint, was investigated. The presence of Co-GNSs within the solder bulk altered the morphology of the primary Cu6Sn5 intermetallic phase and decreased its volume percentage and average size. The Co-GNSs also impacted the crystallographic orientation relationships by promoting the growth of {301} cyclic twinning and increasing the sub-grains along twin boundaries in the solder matrix. Results of the nanoindentation test revealed that addition of up to 0.1 wt% Co-GNSs enhanced the hardness and elastic modulus of the composite solder by ∼17 % and ∼42 %, respectively, compared to the non-composite SAC0307 solder. The strengthening mechanisms were discussed, considering grain and sub-grain features, as well as the presence of second phases and particles within the solder bulk. In the soldered joints, the highest shear strength was achieved in the soldered sample containing 0.1 wt% Co-GNSs, which was associated with the formation of a thin layer of (Cu,Co)6Sn5 and Cu3Sn intermetallics at the solder/copper substrate interface coupled with the refinement of Ag3Sn, and Cu6Sn5 bulk intermetallics. However, the presence of a high amount of Co-GNSs reduced the influence of particles on the microstructure and mechanical properties due to the agglomeration phenomenon. Since adding Co-GNSs did not have a significantly negative impact on the melting point and electrical resistance of the solder, reinforcing lead-free tin-based solders with Co-GNSs can lead to the production of solders with high potential for electronic packaging.
... The fabrication of lead-free solders by the vacuum melting process is now widely used to improve the wetting characteristics and mechanical properties of lead-free solders. The vacuum melting process is a type of casting method used to fabricate Sn lead-free solder alloys where materials are melted under the protection of vacuum or other gases (hydrogen, argon, etc) in vacuum melting, which allows for precise control of the alloy composition and ensures a high degree of purity [31,32]. There is not enough study focused especially on the tensile properties of Sn-Zn based solders under elevated temperatures and strain-rate conditions. ...
The impact of minor additions of nickel and ZrO2 nanoparticles to eutectic Sn-9wt%Zn (SZ) prepared by vacuum melting technique was investigated. The morphologies and microstructures were carried out using an optical microscope (OM) and field emission scanning electron microscope technique (FESEM) escorted by energy dispersive x-ray spectrometry (EDX). The phase structure of the specimens was confirmed by an X-ray diffractometer (XRD). The results obtained demonstrate that small Ni addition causes a major grain refinement of β-Sn, due to the formation of the fine intermetallic compounds Ni5Zn21 and Sn3Ni4Zn3 phases and refines the formation of α- Zn lamellar phase. The melting temperature of the recently discovered solder alloys was lower than that of the eutectic Sn-Zn solders (∆Tm ~ 28 ºC) as a result of the preparation technique and the incorporation of Ni and ZrO2 nanoparticles. The tensile test showed enhanced the mechanical properties of SZ solder as a result of the addition of third elements. The experimental results showed that of all the alloys under investigation, the SZN903 alloy had the greatest UTS and YS values. The enhanced strength of the SZ-ZrO2 alloy defended the results of σUTS and increased the stress exponent parameters, n, by ∼20%. All solders had an activation energy Q that measured between ∼35.62 kJ/mol to ∼58.12 kJ/mol which comparable to the pipe-diffusion mechanism.
... The fabrication of lead-free solders by the vacuum melting process is now widely used to improve the wetting characteristics and mechanical properties of lead-free solders. The vacuum melting process is a type of casting method used to fabricate Sn lead-free solder alloys where materials are melted under the protection of vacuum or other gases (hydrogen, argon, etc) in vacuum melting, which allows for precise control of the alloy composition and ensures a high degree of purity [31,32]. There is not enough study focused especially on the tensile properties of Sn-Zn based solders under elevated temperatures and strain-rate conditions. ...
The impact of minor additions of nickel and ZrO2 nanoparticles to eutectic Sn-9wt%Zn (SZ)
prepared by vacuum melting technique was investigated. The morphologies and microstructures
were carried out using an optical microscope (OM) and field emission scanning electron
microscope technique (FESEM) escorted by energy dispersive x-ray spectrometry (EDX). The
phase structure of the specimens was confirmed by an X-ray diffractometer (XRD). The results
obtained demonstrate that small Ni addition causes a major grain refinement of β-Sn, due to the
formation of the fine intermetallic compounds Ni5Zn21 and Sn3Ni4Zn3 phases and refines the
formation of α- Zn lamellar phase. The melting temperature of the recently discovered solder alloys
was lower than that of the eutectic Sn-Zn solders (∆Tm ~ 28 ºC) as a result of the preparation
technique and the incorporation of Ni and ZrO2 nanoparticles. The tensile test showed enhanced
the mechanical properties of SZ solder as a result of the addition of third elements. The
experimental results showed that of all the alloys under investigation, the SZN903 alloy had the
greatest UTS and YS values. The enhanced strength of the SZ-ZrO2 alloy defended the results of
σUTS and increased the stress exponent parameters, n, by ∼20%. All solders had an activation
energy Q that measured between ∼35.62 kJ/mol to ∼58.12 kJ/mol which comparable to the pipe-diffusion mechanism.
