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![General performance goals for HEV/PHEV electric power train [1] Parameter Target Value](profile/John-Vetrovec/publication/244724126/figure/tbl1/AS:393143070543906@1470744020945/General-performance-goals-for-HEV-PHEV-electric-power-train-1-Parameter-Target-Value.png)
General performance goals for HEV/PHEV electric power train [1] Parameter Target Value
Source publication
We report on the development of a novel active heat sink (AHS) for cooling of high-power electronic chips in inverters for hybrid electric vehicles (HEV) and plug-in HEV (PHEV). AHS employs convective heat transfer in liquid metal circulating in a miniature closed and sealed flow loop. The liquid metal removes high-flux waste heat from the chips an...
Contexts in source publication
Context 1
... the HEV/PHEV power train electronics is very efficient, considering the very high power throughput even a small inefficiency leads to a significant thermal load. Table 1 shows the general performance goals for the HEV/PHEV electric power train [1]. The HEV/PHEV electric power train uses a solid-state electronics inverter to convert the direct current (DC) from the battery to a 3- phase alternating current (AC) to drive the propulsion motor, Figure 1. ...
Context 2
... inverter with a 96% efficiency operating at 55-kW peak power (Table 1) would generate 2,200 W of waste heat while continuous operation at 30 kW would generate 1,200 W of waste heat. About two thirds of the heat is dissipated in the IGBT and about one third in the diodes, which translates to a peak heat load of about 244 W per IGBT and 122 W per diode. ...
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Heat exchangers (HEX) are one of the most crucial components in the thermal management system of future electrified aircraft. To precisely model the convective heat transfer, high-fidelity Computational Fluid Dynamics (CFD) simulations are commonly carried out. However, due to their complexity, employing them in a design optimization loop is comput...
Citations
... For example, the typically used pump could be replaced by a 12-times-lighter pump in the cooling system. Similarly, a novel cooling scheme using liquid metal rather than the commonly adopted waterethylene glycol engine coolant was developed for the thermal management of HEV inverters due to its relatively low freezing point, low kinematic viscosity, high thermal conductivity, and excellent wetting properties [55]. ...
In recent years, global automotive industries are going through a significant revolution from traditional internal combustion engine vehicles (ICEVs) to electric vehicles (EVs) for CO2 emission reduction. Very similarly, the aviation industry is developing towards more electric aircraft (MEA) in response to the reduction in global CO2 emission. To promote this technology revolution and performance advancement, plenty of electronic devices with high heat flux are implemented on board automobiles and aircraft. To cope with the thermal challenges of electronics, in addition to developing wide bandgap (WBG) semiconductors with satisfactory electric and thermal performance, providing proper thermal management solutions may be a much more cost-effective way at present. This paper provides an overview of the thermal management technologies for electronics used in automobiles and aircraft. Meanwhile, the active methods include forced air cooling, indirect contact cold plate cooling, direct contact baseplate cooling, jet impingement, spray cooling, and so on. The passive methods include the use of various heat pipes and PCMs. The features, thermal performance, and development tendency of these active and passive thermal management technologies are reviewed in detail. Moreover, the environmental influences introduced by vibrations, shock, acceleration, and so on, on the thermal performance and reliability of the TMS are specially emphasized and discussed in detail, which are usually neglected in normal operating conditions. Eventually, the possible future directions are discussed, aiming to serve as a reference guide for engineers and promote the advancement of the next-generation electronics TMS in automobile and aircraft applications.
... Heat pipes have superior advantage for cooling of electronics devices with low to medium range heat flux (<10 W/cm 2 ), and shorter heat transport distance (<250 mm) between source and sink. Capillary driven heat pipes have been investigated for range of thermal control applications in automotive including cooling of cabin electronics [7], headlamp [8], battery system [9,10], and power electronics [11][12][13]. Further, cabin cooling [14] and energy recovery/cooling of exhaust [15,16] has been attempted with heat pipes owing to their passive operation and mode of operation at saturation conditions (low differential temperatures across two ends). ...
This present paper investigates the potential of loop heat pipe (LHP), with respect to technological merits and application niche, in automotive thermal management. Broadly, LHP design and applicability for hot spot cooling in electronics (local dissipation), and for heat transport over longer distances (remote dissipation) has been proposed and discussed in detail. The basic module in these applications includes loop heat pipe with different shapes and sizing factors. Two types of LHP design have being tested and results discussed. The miniature version, with 10 mm thick and flat evaporator, for cooling ECU with 70 W chipset while keeping source temperature below 100 °C limit was evaluated. Two larger versions with cylindrical evaporator, 25 mm diameter & 150 mm length, and heat transfer distances of 250 mm and 1000 mm respectively were tested for power electronics and battery cooling, with more than 500 W transport capabilities in gravity field. In conclusions, loop heat pipes will provide an energy efficient passive thermal control solution for next generation low emission automotive, particularly for electric vehicles which have high level electrifications and more definitive cooling requirements.
... Vetrovec [56] studied the thermal performance of a novel active heat sink (AHS) design to cool the electronics on HEVs and PHEVs alike. The AHS was designed to replace the traditional cooling layout of an HEV's IGBT. ...
Reducing heat accumulation within vehicles and ensuring appropriate vehicular temperature levels can lead to enhanced vehicle fuel economy, range, reliability, longevity, passenger comfort, and safety. Advancements in vehicle thermal management remain key as new technologies, consumer demand, societal concerns, and government regulations emerge and evolve. This study summarizes several recent advances in vehicle thermal management technology and modeling, with a focus on three key areas: the cabin, electronics, and exterior components of vehicles. Cabin-related topics covered include methods for reducing thermal loads and improving heating, ventilation, and air-conditioning (HVAC) systems; and advancements in window glazing/tinting and vehicle surface treatments. For the thermal management of electronics, including batteries and insulated-gate bipolar transistors (IGBTs), active and passive cooling methods that employ heat pipes, heat sinks, jet impingement, forced convection, and phase-change materials are discussed. Finally, efforts to model and enhance the heat transfer of exterior vehicular components are reviewed while considering drag/friction forces and environmental effects. Despite advances in the field of vehicle thermal management, challenges still exist; this article provides a broad summary of the major issues, with recommendations for further study. Keywords: Vehicle design, Automotive engineering, Electronics packaging, Heat pipes, Climate control, Heating, ventilation, and air-conditioning, Battery cooling, Thermal soak
... In the meantime, Aqwest Inc. (USA), supported by the funding from US Air Force, started to develop liquid metal heat sink for high power diodes since 2009 [39,40]. They also used this technology for cooling of high power electronic chips in inverters for hybrid electric vehicles (HEV) and plug-in HEV (PHEV) [41,42]. Besides, liquid metal based micro/mini-channel heat sink was also gradually concerned and investigated [43][44][45][46][47][48][49]. ...
As a class of newly emerging material, liquid metal exhibits many outstanding performances in a wide variety of thermal management areas, such as thermal interface material, heat spreader, convective cooling and phase change material (PCM) for thermal buffering etc. To help mold next generation unconventional cooling technologies and further advance the liquid metal cooling to an ever higher level in tackling more extreme, complex and critical thermal issues and energy utilizations, a novel conceptual scientific category was dedicated here which could be termed as combinatorial liquid metal heat transfer science. Through comprehensive interpretations on a group of representative liquid metal thermal management strategies, the most basic ways were outlined for developing liquid metal enabled combined cooling systems. The main scientific and technical features of the proposed hybrid cooling systems were illustrated. Particularly, five abstractive segments toward constructing the combinatorial liquid metal heat transfer systems were clarified. The most common methods on innovating liquid metal combined cooling systems based on this classification principle were discussed, and their potential utilization forms were proposed. For illustration purpose, several typical examples such as low melting point metal PCM combined cooling systems and liquid metal convection combined cooling systems, etc. were specifically introduced. Finally, future prospects to search for and make full use of the liquid metal combined high performance cooling system were discussed. It is expected that in practical application in the future, more unconventional combination forms on the liquid metal cooling can be obtained from the current fundamental principles.
The application of thermal management systems using liquid metal has been explored for aircraft converters and insulated-gate bipolar transistors of hybrid electric vehicles. Galinstan, a novel coolant used in thermal management systems, exhibits high thermal conductivity, low Prandtl number, and high boiling point, which enables its application in high-temperature environments of single-phase systems. In this study, we analyzed the heat transfer performance of Galinstan flowing through an immersion heater using computational fluid dynamics. The calculation was performed under different conditions with varying numbers of baffles, mass flow rates, and values of constant heat flux. The results provided the temperature, pressure drop, turbulence intensity, and streamlining of Galinstan. Based on the comparison of the heat transfer performance at different flow conditions, we determined the most suitable flow conditions and optimal heater design for maximizing the heat transfer performance.
We have previously reported on the development of a novel active heat sink (AHS) for high-power electronic components offering unparalleled capacity in high-heat flux handling and temperature control. AHS employs convective heat transfer in a working fluid circulating in a miniature closed and sealed flow loop. High flow velocity, good flow attachment, and relatively high thermal conductivity of working fluid lead to ultra-low thermal resistance around 0.1 deg C/W. AHS appears very suitable for directly interfacing a hybrid electric vehicle (HEV) inverter to engine coolant loop. Alternatively, AHS may be used to interface inverter electronics to an air-cooled heat exchanger. As a result, the traditional dedicated liquid coolant loop for thermal management of the inverter can be eliminated, the inverter subsystem can be greatly simplified, and the power train electronics made much more compact. Our previous work focused on AHS with working fluids based on liquid metals. This paper reports on AHS development testing with water-based working fluid, which are more suitable for automotive applications. Also presented are an AHS concept updated for high-volume, low-cost series production, and a concept for AHS integration into an automotive inverter.
We report on the development of a novel, ultra-low thermal resistance active heat sink (AHS) for thermal management of high-power density electronic and photonic components. AHS uses a liquid metal coolant flowing at high speed in a miniature closed and sealed loop. The liquid metal coolant receives waste heat from a component at high flux and transfers it at much reduced flux to environment, primary coolant fluid, heat pipe, or structure. Liquid metal flow is maintained electromagnetically without any moving parts. Temperature of the heat load can be controlled electronically, thus allowing photonic components to operate at a stable temperature over a broad range of ambient conditions. Cooling with liquid metal is shown to require much less pumping power than comparable cooling with conventional liquids.
