Fig 1 - uploaded by Gong Li
Content may be subject to copyright.
Facility for the undercooling and solidification experiments with the combination of electromagnetic levitation and glass fluxing treatment. 

Facility for the undercooling and solidification experiments with the combination of electromagnetic levitation and glass fluxing treatment. 

Source publication
Article
Full-text available
Cylinder-shaped Cu80 Ni20 alloy melt is undercooled and solidified by the combination of the electromagnetic levitation technique and the flux treatment method. Nearly constant temperature gradient of 8-10K/cm is realized for the cylindrical melts with different undercooling levels at the bottom ends. The experimental results reveal that with the i...

Context in source publication

Context 1
... samples, and obtained the tensile strength and the yield strength of the alloy with 3 and 1.3 times respectively as high as those with the conventional as-cast structure. The Cu 80 Ni 20 alloy was prepared from a mixture of pure elements in an arc melting furnace under a Ti- gettered Ar atmosphere, and was subsequently sucked into a copper mold with water cooling. The sample was cut into 5 mm in diameter and 10 mm in length. Then the sample was put into a crucible and wrapped with dehydrated B 2 O 3 . Afterwards, the sample was heated by the conical coil as seen in Fig. 1. It is noted that this design of the coil can generate a temperature gradient through the sample due to the longitudinally changing magnetic field strength along the sample, and this is quite different from the traditional one, which generally offers a uniform temperature through the sample. The generation of the temperature gradient favours the unidirectional solidification at a certain undercooling of the melts. The temperature was measured by a two-colour infrared pyrometer at the bottom end of the sample. After several cycles of heating and cooling, the sample was solidified at different degrees of undercooling. Lastly, the samples were cut along the longitudinal and cross directions, etched, and the microstructures were analysed by an optical microscope (OM) and a scanning electron microscope (SEM). After several cycles of heating and cooling treatment, a series of undercooling at the bottom end were obtained, in the range of 30 K to 220 K. No matter how large is the undercooling, the temperature gradient kept nearly constant around 8 to 10 K/cm. The samples solidified from the undercooled melts were measured by x-ray diffraction. It is found that there was only one phase, CuNi solid solution, was formed independent of the degrees of undercooling, as seen in Fig. 2. Four typical microstructures were observed along the longitudinal section of the samples, as seen in Fig. 3. At the undercooling of 30 K, the microstructure consists of mainly coarse dendrites which exhibits well-developed first arms and second-arms. When the undercooling reaches 110 K, the short and coarse dendrites change into a worm-like form. There is a tendency to form fine granular grains, without ob- vious second arms. At undercooling of 140 K, the microstructures are quite different from those men- tioned above, and changes to well-arranged unidirectional dendrites, the first arms are long and parallel and the second-arms are short or not obvious, as seen in Fig. 3(c). When the undercooling went up to 220 K, the directional dendrites were changed into very tiny equiaxed grains, which were different from the microstructures of Fig. 3(b). Repeated experiments show that only in the undercooling range of 120–170 K the directional microstructure can be obtained. Below 120 K, the release of solidification latent heat leads to the reduction of undercooling degree as well as the temperature gradient influence on the solidification, which in turn affects the growth and make it difficult to realize preferential growth direction. Above 170 K, due to the compe- tition of nucleation and growth, quite large amount of nuclei formed prior to growth, and this results in the microstructure transformation of dendrites into spherical crystals. In the undercooling range of 60– 120 K, the microstructures are granular grains. Guo et al . [18] argued that the type of microstructure might be formed by remelting of the dendrite formed in rapid solidification and recrystallization of the dendrite frag- ments. It is therefore concluded that the formation of the unidirectional microstructures is closely associated with the degree of undercooling and the temperature gradient in the melts. The central area in the cross section of the sample solidified at the undercooling of 140 K is also analysed, as shown in Fig. 4. It is found that the dendrites of the microstructures are homogeneous and well dis- tributed. In conclusion, we have designed a conical rf coil to realize the undercooling of rod-like CuNi alloy melt with a combination of fluxing method. At the temperature gradient of 8–10 K/cm, with the increasing degree of undercooling in the range of 35–220 K, the microstructures of the solidified alloy are found to evolve from the coarse dendrites to granular grains, unidirectional dendrites, and eventually to equiaxed ...

Similar publications

Article
Full-text available
Al2O3/Al6Ti2O13 composite ceramics with low thermal expansion properties are promising for the rapid preparation of large-scale and complex components by directed energy deposition-laser based (DED-LB) technology. However, the wider application of DED-LB technology is limited due to the inadequate understanding of process conditions. The shaping qu...
Article
Full-text available
To treat mixed columnar-equiaxed solidification with dendritic morphology, five phase regions have been distinguished: extradendritic melt, interdendritic melt and solid dendrites in equiaxed grains, interdendritic melt and solid dendrites in columnar arrays of dendrites. These five phases are quantified by their volume fractions, and characterized...
Article
Full-text available
A series of refractory high-entropy alloys VTaTiMoAlx with x=0,0.2,0.6,1.0 were designed and produced by vacuum arc melting. The effect of added Al elements on the microstructure and mechanical properties of refractory high-entropy alloys were investigated. The X-ray diffraction results showed that all the high-entropy alloys consist of simple BCC...
Article
Full-text available
Diecastings of the A356 aluminum alloy were produced by rheo-diecasting (RDC) and High pressure die casting (HPDC), the microstructures of primary solidification, secondary solidification and eutectic Si of diecastings with different pouring temperature were explored and the mechanical properties of different parameters were tested. The result show...
Article
Full-text available
This study investigated the characteristics of the intermetallics that appear in Sn–Zn–Ag solder alloys, particularly their behavior in molten solder during cooling and remelting. The results indicated that the intermetallics, which deplete the Zn-rich phase, were present in the form of inhomogeneous dendrites and consisted of two intermetallic pha...

Citations

... Rapid dendritic growth within highly undercooled liquid alloy has aroused great research interest, which significantly influences the microstructures, solute distribution and application performances of alloys [1][2][3][4][5]. The dendritic growth velocity is an important and fundamental parameter for revealing nonequilibrium solidification process and controlling the alloy properties [6][7][8][9][10]. ...
... Figure 3 presents the dendritic growth velocity of α-Ni phase measured at different undercoolings. It shows a power relation to undercooling ∆T L , which can be described as: 2 1 . 3 6 ...
Article
Based on the stable solid solution cluster model, cupronickel is microalloylized in this paper. Alloys with different Ni-M (M = Si, Cr, Cr+Fe) ratios are designed at constant atomic ration of Cu (72.22 at.%). The high temperature oxidation resistance and mechanism of alloy are also investigated. In the Cu-Ni-Si system, the addition of Ni-Si can enhance the oxidation resistance of the alloy from two aspects: firstly, the Ni-Si is in solid solution state when being added as a cluster, it can inhibit the chemical reactivity of Cu-Ni-Si alloy; secondly, anti-oxidation precipitation can be obtained with the increase of Si/Ni ratio. Therefore, the oxidation resistance of the alloy is not because of the formation of the compact silicon oxide film. In the Cu-Ni-Cr system, the oxidation is obviously inhibited at medium temperatures (lower than 800°C). But at higher temperatures, the oxidation resistance is relevant to the integrality of chrome oxide layer. The high temperature oxidation resistance is closely related to Cr/Ni ratio, hence an appropriate Cr/Ni ratio is necessary for the good high temperature oxidation resistance. Compared with the third element Cr, the forth element Fe cannot be oxidized first. Therefore, combined addition of Cr and Fe can only inhibit the medium temperature oxidation, but not high temperature oxidation.
Article
Differential scanning calorimeter technique combined with the traditional fluxing treatment was used to investigate the specific heat and related thermodynamic properties of under-cooled pure silver melts. The specific heat of the under-cooled melt showed a linear dependence on the temperature in the range of the obtained under-cooling from 0 to 198 K. The related thermodynamic properties of silver, such as the entropy change, the enthalpy change and the Gibbs free energy difference between the under-cooled melt and the solid phase, were derived from the measured specific heat. The relations between the temperature and the thermal diffusion or the thermal conductivity of the under-cooled melt were analyzed respectively.
Article
Nature of solute distribution in copper single crystals alloyed with 0–100 at.% Ni has been investigated via temperature dependence of the yield stress. The composition–property diagram developed and interpreted in terms of the kink-pair nucleation model of flow stress in solid–solution crystals shows that the solute distribution is statistically random in Cu–Ni single crystals with solute concentration c ≤ 14 at.% Ni, and is non-random for c between 14 and 50 at.% Ni. Similarly, the solute distribution is statistically random in Ni–Cu single crystals with c ≤ 20 at.% Cu, and deviation from statistically random distribution of solute occurs for all other values of c up to 50 at.% Cu.