Figure 3 - uploaded by Nurul Ahad Akil
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Electronic band structure of copper (blue line) and silicon (green line) with and without spin-orbit coupling.
Source publication
The miniaturization and higher power density of modern electronics pose a significant challenge in thermal management. A key focus in addressing this challenge revolves around the advancement of thermal interfaces within microchip packaging, aiming to enhance thermal energy dissipation and optimization of performance. Copper nanowires are extensive...
