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A radio frequency (RF) front-end module at 5 GHz has been designed. The module consists of two switches, two bandpass filters, a balun, a low noise amplifier (LNA) and a power amplifier (PA). The top-down design methodology is used in our design. Firstly, the module function is specified with input and output (I/O) ports. Secondly, the RF front-end...
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Context 1
... with distributed elements Fig. 3a shows the schematic of a 3 rd order coupled hairpin BPF, and Fig. 3b shows the simulated results of the worst case when the line varies with ±10%. It is seen that ±10% variation of line width results in less than 0.5 dB changes in the pass band of 5.15-5.35 GHz. Fig. 4a shows the schematic of the designed switch composed of two λ/4 ...
Context 2
... with distributed elements Fig. 3a shows the schematic of a 3 rd order coupled hairpin BPF, and Fig. 3b shows the simulated results of the worst case when the line varies with ±10%. It is seen that ±10% variation of line width results in less than 0.5 dB changes in the pass band of 5.15-5.35 GHz. Fig. 4a shows the schematic of the designed switch composed of two λ/4 (λ=wavelength at 5.25 GHz) microstrip lines, two PIN diodes (MPP4203 ...
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Till now, most of the power combiners used in microwave engineering is designed with passive circuits. Due to the losses, the application of these passive power combiners is limited. For this reason, our attention is attracted by the development of active power combiner based on the use microwave transistors. This letter addresses an investigation...
Citations
... The top-down design of the entire front-end is described in [1]. ...
... The design of the LNA starts with its specifications derived from the top-down design of the entire front-end, [1]. The active device, MAX2649, is described in the ADS design flow as a two-port network in the form of the Touchstone format file (*.s2p). ...
Two different designs of a low-noise amplifier (LNA) at 5 GHz are presented in this paper. The first design uses lumped elements for implementing the matching networks. The second design utilizes distributed element matching networks using microstrip lines. It is shown that the design using lumped element matching networks has difficulties to achieve high performance at a frequency of above 5 GHz and that distributed matching circuits are more adequate compared to the lumped element solution. Experimental results confirm the simulation results based on the LNA design with distributed matching network.
... Another drawback is that good substrates for distributed components are very expensive. Advantage with distributed components is that some of the design parameters like length and width can vary a certain degree but the component still maintain its desired function [3]. This diploma work focuses on distributed components for implementation of the 5GHz radio front-end module. ...
... This will be explained in the following sections. 3 The only design restriction is the minimum line width and separation, which is 75µm. This measure is taken from the PCB manufacturer Elektrotyck's design rules. ...
... To save space on the PCB one of the most popular and common way is to bend those coupled lines like hairpins and they are hence called coupled hairpin lters. Characteristics of coupled line lter depend on several parameters (see g. 3.12), the most important parameter is length (l) in the coupled region, the spacing (S) between the couplings and the line width (W). ...
The wireless market is developing very fast today with a steadily increasing number of users all around the world. An increasing number of users and the constant need for higher and higher data rates have led to an increasing number of emerging wireless communication standards. As a result there is a huge demand for flexible and low-cost radio architectures for portable applications. Modern radio transceivers have to support several different standards. Moving towards multi-standard radio, a high level of integration becomes a necessity and only can be accomplished by new improved radio architectures and full utilization of technology scaling. A radio frequency (RF) front-end system has been designed, integrated and fabricated using printed circuit board (PCB). The system consists of single-pole double-throw (SPDT) transmitter/receiver (T/R) switch with PIN diode, a low noise amplifier (LNA), a power amplifier (PA) and other microwave components. The components and sub-circuits based upon the transmission line theory have been utilized for the system design. All the sub-circuits and the entire system have been evaluated using a commercial software. The full design has been fabricated and measured using network analyzer. It is shown that RF front-end system can be integrated in a PCB utilizing a conventional PCB process. This system integration technique provides not only low cost but also high performance because of the elimination of parasitic associated with lumped components in a conventional design.
The wireless world is shrinking and so is the size of all electronic wireless devices which is aggressively pushing the chip manufacturers to reduce the size and power consumption of their IC's. This work presents a similar case wherein all the blocks of a FEM are tightly integrated on a single die measuring 1500 times 1350 um2 using GaAs E/D p-HEMT process and packaged in 3 times 3 times 0.7 mm3 16 lead QFN package. We have developed a compact Front End Module (FEM) for a range of wireless applications such as ZigBee, Wireless Audio Streaming and bluetooth. The FEM contains a PA, LNA and SPDT Switch which is fully integrated and matched to a 50 ohm system. In transmit chain FEM has a gain of 26.5 dB, output power 21.5 dBm at 3.3 V with 124 mA peak current and input-output return loss better than 10 dB for 24 mA of quiescent current. The receive chain has a noise figure 2 dB, gain of 15 dB, IIP3 better than 6 dBm for 8 mA of quiescent current. This integrated FEM solves the issue of integrating discrete RF components on RF board and also reduces size, cost and time to market for wireless product vendors.
A radio frequency (RF) front-end module at 5 GHz has been designed and implemented in a conventional printed circuit board (PCB). The module consists of two switches, two bandpass filters, a balun, a low noise amplifier and a power amplifier. Distributed components and sub-circuits based upon the transmission line theory have been utilized for the module design. All the sub-circuits and the entire module have been evaluated by both simulation and measurements. It is shown that RF modules at 5 GHz can be integrated in a PCB utilizing a conventional PCB process. This module integration technique provides not only low cost but also high performance because of the elimination of parasitics associated with lumped components in a conventional design
