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Device layout of CMOS color sensors based on anti-Hermitian metasurfaces
a Top- and b side-view of color sensor device layout including electrical contacts. c Oblique view of scanning electron micrograph, just after nano patterning of PIN Si rods. d Side cross-section view and e top view of nanocylinder array, after SiO2 gap-filling and ITO electrode deposition. The white scale bar corresponds to 500 nm in c–e. The diagonal red line in c and e indicates the cross-section presented in d.

Device layout of CMOS color sensors based on anti-Hermitian metasurfaces a Top- and b side-view of color sensor device layout including electrical contacts. c Oblique view of scanning electron micrograph, just after nano patterning of PIN Si rods. d Side cross-section view and e top view of nanocylinder array, after SiO2 gap-filling and ITO electrode deposition. The white scale bar corresponds to 500 nm in c–e. The diagonal red line in c and e indicates the cross-section presented in d.

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The demand for essential pixel components with ever-decreasing size and enhanced performance is central to current optoelectronic applications, including imaging, sensing, photovoltaics and communications. The size of the pixels, however, are severely limited by the fundamental constraints of lightwave diffraction. Current development using transmi...

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... Optical image sensors are increasingly gaining widespread use in diverse applications, including mobile devices, augmented reality glasses, and sensors for autonomous vehicles and robots. The demand for high-quality image sensors has driven rapid evolution in various aspects, such as increased image resolution [1]- [9], improved low-light imaging capabilities [10]- [12], and pixel miniaturization [13]- [15]. Currently, complementary metal-oxide-semiconductor (CMOS) image sensors (CIS) have mainly utilized silicon (Si)-based photodetectors with additional components, such as color filters [16], [17], microlenses, and antireflection coatings [18], to facilitate color separation and efficient light collection, as illustrated in Figure 1(a). ...
... Hence, recent research has aimed to reduce the overall thickness of devices by simultaneously integrating the functionalities of microlenses, color filters, antireflection coatings, and Si photodetectors into a single metasurface. For example, anti-Hermitian Si metasurface [13], [14], Si-Al hybrid nanoantennas [15], and filterfree image sensor pixels comprising Si nanowire [21] have been proposed as miniaturized CMOS-compatible image sensors. Additionally, advanced design like stacked silicon and germanium nanopillars [22] shows promise for the next generation of compact CMOS image sensors. ...
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... It may further realize the fully chip-integrated optical sensing and detecting functions and be readily integrated with numerous functionalities [10]. The silicon material device technology is established, affordable, and compatible with the CMOS process [38,39]. Thus, researchers' interest has been drawn to silicon-based high refractive index sensor chips. ...
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... Nevertheless, this approach is generally limited in scalability and miniaturization. Alternatively, other CMOS compatible color sensor designs are based on p-i-n anti-Hermitian Si metasurface (34) or the aluminum (Al)-Si junction with a large pixel size of~10 μm (21). In addition, both designs (21,34) exhibit substantial dark current, which induces a large background signal for photodetection. ...
... Alternatively, other CMOS compatible color sensor designs are based on p-i-n anti-Hermitian Si metasurface (34) or the aluminum (Al)-Si junction with a large pixel size of~10 μm (21). In addition, both designs (21,34) exhibit substantial dark current, which induces a large background signal for photodetection. ...
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... Nevertheless, this approach is generally limited by its potential scalability and miniaturization. Alternatively, other CMOS compatible color sensor designs are based on p-i-n anti-Hermitian Si metasurface 31 or the Al-Si junction with a large pixel size of ~10 µm. 19 In addition, both of these designs 19,31 exhibit significant dark current, which induces a large background signal for photodetection. ...
... Alternatively, other CMOS compatible color sensor designs are based on p-i-n anti-Hermitian Si metasurface 31 or the Al-Si junction with a large pixel size of ~10 µm. 19 In addition, both of these designs 19,31 exhibit significant dark current, which induces a large background signal for photodetection. ...
Preprint
Digital camera sensors utilize color filters on photodiodes to achieve color selectivity. As color filters and photosensitive silicon layers are separate elements, these sensors suffer from optical cross-talk, which sets limits to the minimum pixel size. In this paper, we report hybrid silicon-aluminum nanostructures in the extreme limit of zero distance between color filters and sensors. This design could essentially achieve sub micron pixel dimensions and minimize the optical cross-talk originated from tilt illuminations. The designed hybrid silicon-aluminum nanostructure has dual functionalities. Crucially, it supports a hybrid Mie-plasmon resonance of magnetic dipole to achieve the color-selective light absorption, generating electron hole pairs. Simultaneously, the silicon-aluminum interface forms a Schottky barrier for charge separation and photodetection. This design could potentially replace the traditional dye based filters for camera sensors at ultra-high pixel densities with advanced functionalities in sensing polarization and directionality, as well as UV selectivity via interband plasmons of silicon.
... Zhang et al., further demonstrated sub-wavelength scale color pixels in a CMOS compatible platform based on Anti-Hermitian metasurfaces (Figure 7p) [60]. The AH Silicon metasurfaces, with two-dimensional arrays of three differently sized nanocylinders, are coupled with a shallow PIN junction for efficient carrier transport and electrical readout. ...
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... Metallic nanostructures, such as 2D nanoholes and one-dimensional (1D) gratings, are well-known structures for implementing high-efficiency light control using SPPs, such as in extraordinary optical transmission (EOT) [38][39][40] and wavelength-selective perfect absorption/emission [41][42][43]. In addition, spectral filters using SPPs are highly promising for a wide range of applications, such as spectral imaging [44][45][46][47] and complementary metal oxide semiconductor sensors [48,49]. ...
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Hexagonal boron nitride (hBN) exhibits natural hyperbolic dispersion in the infrared (IR) wavelength spectrum. In particular, the hybridization of its hyperbolic phonon polaritons (HPPs) and surface plasmon resonances (SPRs) induced by metallic nanostructures is expected to serve as a new platform for novel light manipulation. In this study, the transmission properties of embedded hBN in metallic one-dimensional (1D) nanoslits were theoretically investigated using a rigorous coupled wave analysis method. Extraordinary optical transmission (EOT) was observed in the type-II Reststrahlen band, which was attributed to the hybridization of HPPs in hBN and SPRs in 1D nanoslits. The calculated electric field distributions indicated that the unique Fabry–Pérot-like resonance was induced by the hybridization of HPPs and SPRs in an embedded hBN cavity. The trajectory of the confined light was a zigzag owing to the hyperbolicity of hBN, and its resonance number depended primarily on the aspect ratio of the 1D nanoslit. Such an EOT is also independent of the slit width and incident angle of light. These findings can not only assist in the development of improved strategies for the extreme confinement of IR light but may also be applied to ultrathin optical filters, advanced photodetectors, and optical devices.