Table 1 - uploaded by Sunit B. Rane
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Source publication
Ceramic technology has had an important role in microelectronics since 1960s and ceramic seems to be a continuously developing,
mature technology. Recently, development of low temperature co-fired ceramic technology (LTCC) has been geared up due to the
huge demand of miniaturisation of electronic components. New materials are being developed for ex...
Contexts in source publication
Context 1
... formulated ink samples were designated as SP6A, SP6B, and SP6C, respectively. The details of the samples prepared are given in Table 1. The viscosity of the formulated inks was not measured since we have confined the ink formulation at 5 g scale. ...
Context 2
... sheet resistance of the fired film was measured using four-probe technique with an accuracy of ±0.05 mX/h. The data pertaining to the sheet resistance is given in Table 1. From the data it is seen that the type of organic vehicle used for ink formulation affects the microstructure and that leads the change in the value of sheet resistance. ...
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Citations
... The low-temperature co-fired ceramics (LTCC) technology has nowadays been further developed as an effective method to accomplish the miniaturization of electronic components and devices, such as filters, ceramic substrates, baluns, and antennas, due to its 3D circuit structure and high performance of microwave ceramics [2][3][4][5][6]. To realize the fabrication of these devices, it requires the ceramic materials should possess the characteristics of low dielectric constant, low loss, near-zero temperature coefficient of resonant frequency (s f ) and low sintering temperature (always below 961°C, which is the melting point of Ag conductor) to ensure the quality of the signal during high-speed transmission [7][8][9][10]. ...
The dielectric properties and sintering behavior of cobalt-doped Ba3(VO4)2 microwave dielectric ceramic prepared by the traditional solid-state reaction method were systematic researched. The phase structure and grain morphology of the ceramics were studied by XRD and SEM analysis. Densification temperature of cobalt-doped Ba3(VO4)2 was successfully decreased from 1100 to 925 °C. The second-phase Ba2V2O7 was formed as x = 0.05, and the second phase gradually increased as x increased. Electro-magnetic testing results show that the dielectric constant and bulk density were gradually falling with x increased, the Q*f value of ceramic has been improved, and the peak of Q*f obtained is x = 0.3 sintered at 925 °C. The optimal dielectric properties are εr = 13.2, Q*f = 54,063 GHz at 10.6 GHz and τf = + 18.7 ppm/°C, sintered at 925 °C, which may be widely used in adjustment of τf for LTCC ceramics with negative τf while maintaining excellent performances.
... Thick film paste (SP06B) was indigenously formulated using the well-established procedure with the composition of silver as a conducting phase, glass frit as an inorganic binder and organic vehicle. The specific paste formulation process is reported earlier (Bangali et 2009). Square thick film conductor pattern of 1 cm × 1 cm size of the prepared silver pastes were screen-printed on to the 1" × 1" × 0.635" alumina substrate (96%) through nylon screen of 250-mesh. ...
This paper aims to focus on the microwave processing of thick films which is a fast, cheap technique and could be the alternative to the currently used conventional high temperature processing technique. Microwave processing has gained worldwide acceptance as a novel method for heating and sintering a variety of materials, as it offers specific advantages in terms of speed, energy efficiency, process simplicity, finer microstructures and lower environmental hazards. Silver conducting thick films were prepared and processed in the household microwave oven. The films sintered at different time period by keeping the other parameter such as microwave power, film thickness etc constant. The microstructure analysis revealed that the surface morphology of the microwave processed films become compact with respect to the processing time. The sheet resistance for microwave sintered silver films is in the range of 0.003 to where as the films fired at 750 and showed the resistance of 0.009 and which can be comparable. The results revealed that the microstructure of the microwave sintered films has more uniform and compact surface than that of the conventionally fired films. The paper reports upon the preparation of silver thick film by screen printing technique and processing the same by microwave which also compared with the conventionally processed thick films.
... Thick film is a term applied to an additive processing methodology whereby pastes are applied in a definitive pattern by screen printing on an insulating substrate and fired. These pastes result in cermets that function, in the solid state, as conductor (Bangali, Rane, Phatak, & Gangal, 2009;Grier and , Pa, 1978;Siuta, 1985.) , resistor (Carcia, Ferretti &, Suna, 1982;Chiang, Silverman, French &, Cannon, 1994;Warren , Taylor, Edward &, Douglas,2009 as the shear rate increases. ...
Although thick film technology has been widely used in the past for medium performance packaging solutions, it has inherent size and space (< 150 µm) as well as surface and edge roughness limitations forbidding its applications in high performance requirements. Owing to such limitations and growing demands from the microelectronics industry, it has been imperative to develop innovative interconnection technologies. Photopatternable thick film technology which is a combination of classical thick film and traditional photoresist technology has the potential to meet low cost, compact and high performance circuit (MCM and microwave) interconnection requirements. The current review furnishes stateof-the-art account of photopatternable thick film technology (with historical landmarks) and mainly focuses on materials, processing and formulation attributes of silver based conductor paste. In the subject comprehension, we have exclusively referred to our own R & D efforts in photopatternable thick film technology for the sake of clarity. Keywords: Grain Growth, Composites, Electrical Properties, Microstructure-Final, Photopatternable Thick Film
... Thick film is a term applied to an additive processing methodology whereby pastes are applied in a definitive pattern by screen printing on an insulating substrate and fired. These pastes result in cermets that function, in the solid state, as conductor (Bangali, Rane, Phatak, & Gangal, 2009; Grier and , Pa, 1978;Siuta, 1985.) , resistor (Carcia, Ferretti &, Suna, 1982; Chiang, Silverman, French &, Cannon, 1994;Warren , Taylor, Edward &, Douglas,2009.), ...
Although thick film technology has been widely used in the past for medium performance packaging solutions, it has inherent size and space (< 150 µm) as well as surface and edge roughness limitations forbidding its applications in high performance requirements. Owing to such limitations and growing demands from the microelectronics industry, it has been imperative to develop innovative interconnection technologies. Photopatternable thick film technology which is a combination of classical thick film and traditional photoresist technology has the potential to meet low cost, compact and high performance circuit (MCM and microwave) interconnection requirements. The current review furnishes stateof-the-art account of photopatternable thick film technology (with historical landmarks) and mainly focuses on materials, processing and formulation attributes of silver based conductor paste. In the subject comprehension, we have exclusively referred to our own R & D efforts in photopatternable thick film technology for the sake of clarity. Keywords: Grain Growth, Composites, Electrical Properties, Microstructure-Final, Photopatternable Thick Film
... Most of the literature/reports depict the study in LTCC using the only commercial thick film materials. Recently, we reported the indigenous development of silver thick film materials on LTCC (Jagtap et al., 2008; Bangali et al., 2008). In continuation to this, the aim of the present work is to investigate and report the impact of glass frit variation in silver thick film pastes used as surface conductors in LTCC, especially on the properties such as warpage of LTCC associated with conductors, microstructure of the fired thick films, sheet resistance and adhesion on LTCC. ...
... between the coefficient of thermal expansion (CTE) between the thick film pastes, which will be printed on and the LTCC tape (Jagtap et al., 2008; Bangali et al., 2008; Hsueh and Evans, 1985; Dell Acqua, 1994); and . ...
... Therefore, we can predict that the source of warpage in our samples may be due the percentage of glass frit, which is responsible for the mismatch in shrinkage and CTE between the paste and the LTCC tape. In our earlier report, we noted that the warpage in LTCC arises due to the type of permanent binder, i.e. glass frit (Jagtap et al., 2008) and organic composition (Bangali et al., 2008) used in silver thick films. However, in the present case same organic vehicle and permanent binder, i.e. glass frit is used in all the cases but the amount (per cent) of glass frit has been changed. ...
Purpose
The purpose of this paper is to investigate and report the impact of glass frit variation in silver thick film pastes used as surface conductors in low temperature co‐fired ceramics technology (LTCC), especially on the properties such as warpage of LTCC associated with conductors, microstructure of the fired thick films, sheet resistance and adhesion on LTCC.
Design/methodology/approach
Silver thick film paste compositions were formulated by changing the silver glass frit ratio. The compatibility of these formulated paste compositions with LTCC (DP 951AX) substrate were evaluated. The properties such as microstructure developments, the change in sheet resistance, warpage of LTCC substrate with respect to glass frit ratio of the developed silver films on LTCC were evaluated.
Findings
The results reveal that the glass frit percentage used in paste formulation is equally responsible for the disturbance in the properties such as microstructure, warping and electrical properties of the fired thick films on LTCC. It was observed that the paste composition, in particular sample SP10B containing the highest glass frit percentage, is compatible with the LTCC tape under processing conditions. The sheet resistance value in the range of 5 mΩ/□ and the fired films showed very good adhesion (3.95 N), irrespective of the glass frit composition.
Originality/value
The paper provides useful evaluations of properties such as microstructure developments, changes in sheet resistance and warpage of LTCC substrate with respect to glass frit ratio of the developed silver pastes on LTCC.
