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Design features of a folded MEMS pyramid IMU including interlocking latches, SOI sensors, flexible interconnect hinges, and packaging lids. 

Design features of a folded MEMS pyramid IMU including interlocking latches, SOI sensors, flexible interconnect hinges, and packaging lids. 

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Article
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This paper reports a new approach for design and fabrication of chip-level inertial measurement units (IMUs). The method utilizes a 3-D foldable silicon-on-insulator (SOI) backbone with in-situ fabricated high-aspect-ratio sensors. A planar multi-sensor unit was fabricated and subsequently folded in a pyramidal shape, forming a compact IMU. Inertia...

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... though the proposed approach has many advantages, several design challenges should be considered, including the structural rigidity of the folded microsystem, durability, sensor alignment, and packaging. Design of the IMU involves a number of elements, Fig. 2, including a rigid backbone, inertial sensors, mechanical latches, flexible hinges, electrical interconnects, and glass lids for ...
Context 2
... suitable interface, such as a DIP package. Sensor anchors are connected to the electrical traces on the polyimide substrate using glass encapsulation lids containing metal traces. Wafer- level fabrication of the lids is performed on a 500 D-263 glass substrate and metal is patterned using a liftoff process to define the electrical interconnects, Fig. 2. Deposition of metal is done utilizing the same procedure as for the IMU structure inter- connects to create a 5000 layer of gold atop a 500 adhesion layer of chrome. After fabrication, the wafer is diced to separate each individual encapsulation lid. Impedance of the traces man- ufactured with this procedure is measured to have a ...
Context 3
... silicon does not inherently allow for wetting of solder, a layer of gold is first deposited onto the bonding joints, Fig. 2. Metal deposition is conducted in post-fabrication pro- cessing by mounting the unfolded structure facedown, leaving the backside exposed. With the current process, the entire backside area is coated, however, a shadow mask or lithography can also be used to mask the sidewalls and selectively deposit metal only on the latches. Similar ...

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