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Crossssectional SEM images of trenches with platt ing time, trench width: 100 nm, trench depth: 500 nm, trench width: 250 nm Plating times: (a) 2 min, (b) 7 min, (c) 17 min.
Source publication
Bottom-up copper filling for different sub-micrometer trenches was investigated by electroless deposition technique using a PO-EO-PO triblock copolymer termed PEP-3100 as an additive. It was found that PEP-3100 (molecular weight 3100) had a strong inhibition for the electroless copper deposition. The bottom-up filling behavior of electroless copper...
Contexts in source publication
Context 1
... to the aboveementioned experiment results, when PEPP3100 concentration was 1.0 mg L -1 in electroless copper solution, the bottomup filling behaviors of electroless copper bath with plating times were investigated, and the crossssectional SEM results were shown in Fig. ...
Context 2
... a plating time of 2 min, Cu thickness at the surr face and at the bottom of trench was approximately 64 and 83 nm, respectively. When the plating time was 7 min, they became 106 and 253 nm, respectively (see Fig. 2b), the Cu deposition rate at the bottom of the holes was higher than the rate on the surface. The trenches were filled with Cu at a plating time of 17 min (Fig. 2c), which suggests that bottommup filling with electroless plated Cu could be obtained by addition of PEPP3100 into the electroless Cu plating solution. This result may be ...
Context 3
... Cu thickness at the surr face and at the bottom of trench was approximately 64 and 83 nm, respectively. When the plating time was 7 min, they became 106 and 253 nm, respectively (see Fig. 2b), the Cu deposition rate at the bottom of the holes was higher than the rate on the surface. The trenches were filled with Cu at a plating time of 17 min (Fig. 2c), which suggests that bottommup filling with electroless plated Cu could be obtained by addition of PEPP3100 into the electroless Cu plating solution. This result may be explained by the following: PEPP3100 has a large molecular weight and low diffuu sion rate in electroless copper solution. Though the molecular weights of [Cu(EDTA)] ...
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