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Recent progress in the development of thermodynamic and kinetic databases of micro-soldering alloys, which were constructed within the framework of the Thermo-Calc and DICTRA software, was presented. Especially, a thermodynamic tool, ADAMIS (alloy database for micro-solders) was developed by combining the thermodynamic databases of micro-solders wi...
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... Some of the experimental data concerning binary sub-component alloys are also presented in Figures 1-4, for comparison. Therefore, using the models mentioned above, the calculations of the viscosities of the ternary SAC387 and quaternary (SAC) 1−x Co x alloy systems are treated at 1073 K in the present work considering the phase diagram concerning SAC387 ternary alloy systems in ref. [45,46]. The viscosity values of pure components, pre-exponential factors and activation energy of viscous flow have been taken from the data in the literature [47][48][49][50][51][52][53] and these data have also been used in the present study. ...
Because of the increasing complexity and cost of experiments carried out, the data for the multi-component alloy systems have frequently been obtained by numerical modelling. It is clear that the related calculations require reliable data dealing with the pure components and binary alloy systems. Selecting the reliable data concerning the pure components from the literature, the viscosities for the SAC and (SAC)1−x Cox solder alloys have been calculated using different viscosity models (geometric and physical). The viscosity decreases as the amount of tin content increases in the SAC387 alloy while the addition of the cobalt to SAC387 solder results in the increasing of the viscosity. Moreover, by computing the root mean square values between theoretical and experimental viscosities, it can be concluded that the lowest value among all models is that of obtained by Kaptay equation.
... Some of the experimental data concerning binary sub-component alloys are also presented in Figures 1-4, for comparison. Therefore, using the models mentioned above, the calculations of the viscosities of the ternary SAC387 and quaternary (SAC) 1−x Co x alloy systems are treated at 1073 K in the present work considering the phase diagram concerning SAC387 ternary alloy systems in ref. [45,46]. The viscosity values of pure components, pre-exponential factors and activation energy of viscous flow have been taken from the data in the literature [47][48][49][50][51][52][53] and these data have also been used in the present study. ...
Because of the increasing complexity and cost of experiments
carried out, the data for the multi-component alloy systems
have frequently been obtained by numerical modelling. It is
clear that the related calculations require reliable data dealing
with the pure components and binary alloy systems. Selecting
the reliable data concerning the pure components from the
literature, the viscosities for the SAC and (SAC)1−x Cox solder
alloys have been calculated using different viscosity models
(geometric and physical). The viscosity decreases as the
amount of tin content increases in the SAC387 alloy while the
addition of the cobalt to SAC387 solder results in the
increasing of the viscosity. Moreover, by computing the root
mean square values between theoretical and experimental
viscosities, it can be concluded that the lowest value among
all models is that of obtained by Kaptay equation.
... As convenient electronic packing materials, the Sn-Pb-based solders can cause serious harm to health and environment because of the toxic nature of plumbum. Therefore, the development of Pbfree solders, which should satisfy the criterion regarding plentiful supply, favorable physical and chemical properties and cost benefit, has been considered necessarily [1,2]. As the most promising substitute for leaded solders, Sn-Au eutectic solder has been vastly employed for optoelectronic packages in high-temperature environments with high thermal and electrical conductivities, superior creep resistance and excellent solderability [3,4]. ...
The thermodynamic assessments of the Au-Gd and Au-Yb binary systems have been carried out by the Calculation of Phase Diagram (CALPHAD) method based on the available experimental data. The Gibbs free energies of the solution phases including liquid, fcc, bcc, and hcp were described by the substitutional solution models with the Redlich-Kister equation. All the intermetallic compounds except the βAuYb phase were treated as stoichiometric phases, and the βAuYb phase was modeled using the sublattice model. The thermodynamic parameters of each phase in the Au-Gd and Au-Yb binary systems were obtained, and an agreement between the calculated results and experimental data was obtained in each binary system.
A CALPHAD-guided alloy design and the corresponding key experiments method were performed to study the microstructure-mechanical properties relationships for Sn–In based solder alloys with In content ranging from 0 to 52 wt. %. Based on a calculated Sn0.7Cu–Sn52In isoplethal section phase diagram, six compositions (Sn52In, 42In, 35In, 18In, 8In and Sn0.7Cu) were selected with different phases such as β-In3Sn, γ-InSn4, β-Sn and β-Sn(In). The phase fractions of alloys acquired from experimental microstructures are consistent with calculated values. Their phase fractions differ and the order of hardness values is β-Sn(In) > β-Sn > γ-InSn4 > β-In3Sn, leading to an increase in strength and a decrease in ductility with the reduction of In content. Strengths of low In content alloys of 18In and 8In containing β-Sn(In) and γ-InSn4 phase are higher compared with high In content alloys of Sn52In, 42In and 35In containing γ-InSn4 and β-In3Sn phases. Meanwhile, elongations of low In content alloys are better than that of 42In and 35In alloys. Thus, the best strength and ductility combination can be achieved by low ln contents alloys. This work can provide a new strategy for the development of Sn–In based alloys via CALPHAD-guided design of phase types and fractions.
A brief review of measurement techniques and theoretical studies on the surface tension alloy and mixture has been presented in the present study. It is clear that the experimental determination of thermodynamic and thermophysical properties of both solid and especially liquid alloys at high temperature cases is frequently difficult technologically. In addition to this, a lack of experimental data concerning thermophysical properties of Ag-Au, Au-Cu, and Ag-Cu sub-binary systems is obvious. The theoretical thermophysical data of the Ag-Au-Cu ternary alloy systems are very scarce in the literature. Thus, the surface tensions of the alloys just mentioned above for cross sections z = x Ag /x Au = 1/3, 1/1, 3/1, 2/5, and 5/2, respectively, and their sub-binary systems are much simply calculated from the surface tensions of the Ag-Au, Au-Cu, and Ag-Cu sub-binary systems by using geometric models, such as Muggianu, Kohler, Toop, and GSM (Chou's general solution model) and Butler's equation. The predicted results in the present study show rather an agreement with the experimental results of the alloys. Therefore, it is inferred that the obtained surface tension curves for the Ag-Au-Cu ternary alloy at 1381 K are reasonable with especially those calculated from the Toop model.
Composite lead-free solders, containing micro and nano particles, have been widely studied. Due to grain boundary drag or Zener drag, these particles can refrain the solder microstructure from coarsening in services, especially for Cu6Sn5, Ag3Sn intermetallic compounds and the β-Sn phases. Due to dispersion hardening or dislocation drag, the mechanical properties of the composite solder alloys were enhanced significantly. Moreover, these particles can influence the rate of interfacial reactions, and some particles can transform into a layer of intermetallic compound. Wettability, creep resistance, and hardness properties were affected by these particles. A systematic review of the development of these lead-free composite solders is given here, which hopefully may find applications in microbumps to be used in the future 3D IC technology.
