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Commercialization of perovskite solar technology depends on reaching a stable functioning of the devices. In this regard, both intrinsic (chemistry phenomena of the different device layers) and extrinsic factors (environmental) need to be considered. In this chapter, we report the state of the art of encapsulation techniques against extrinsic degra...
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Accounting for the perovskite ionic transport and reactions reveals the importance of the electron blocking (hole transporting) layer in determining device stability.
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... However, the thermoplastic properties of HMAs come at a cost. The heat and creep resistance are limited, a quick rise in viscosity during cooling hinders penetration into the substrate, and a rapid drop in toughness is expected with increased temperature [51]. ...
... The formulator must consider the desired processing method, working conditions, and price. In general, base polymers have a huge impact on viscosity and rheology, cohesive and adhesive strength, creep and tack, as well as processing and working temperature [39,40,[51][52][53]. Common primary resins used in HMAs include ethylene-vinyl acetate (EVA) [38,43,45,49,50,54] polyolefins [54,55], styrenic block copolymers (SBC) [56,57], butyl rubber [58,59], polyamides [38,60], and reactive resins [48,61]. ...
Hot-melt adhesives (HMAs) are thermoplastic materials that can bond various substrates by solidifying rapidly upon cooling from the molten state, and their modification with organosilicon compounds can result in crosslinking behavior, characteristic of gels. Organosilicon compounds are hybrid molecules that have both inorganic and organic components and can enhance the properties and performance of HMAs. The gel aspect of HMA with and without organosilicon modifiers can be considered in organosilicon-modified systems, the modifiers are often either sol–gel condensation products or their mechanism of action on the adherent surface can be considered of sol–gel type. The purpose of this manuscript is to present the current state of the art on the formulation, characterization, and application of HMAs and optimize their performance with organosilicon compounds for application in various industries such as automotive, construction, and photovoltaics. This review covers articles published within the period of 2018–2022. The article is divided into sections, in which information about hot-melt adhesives is described at the beginning. The following part of the presented review focuses on the composition of hot-melt adhesives, which takes into account the use of organosilicon compounds. The last part of this review outlines the future trends in hot-melt adhesives.
